Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.

Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.

Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.

Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.

Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.

Abstract: An upper cover of a garbage can includes a fitting frame, an upper cover body, an outer frame and two combining members. The combining members are respectively composed of a pivotal cylinder and a torsion spring, combined with the pivotal members of the upper cover body and the inner frame, letting the upper cover body to swing slowly up to an open upright condition or swing down to a closed condition with the pivotal members as pivots and by means of the torsion springs immersed in friction oil and turned in an untwisted natural condition or in a twisted condition. The upper cover body is pivotally combined with the inner side of the fitting frame combined with an outer frame, which is then assembled on the upper edge of a garbage can, letting the upper cover swung down or up to close or open slowly without noise by pressing.

Abstract: A collapsible refuse can includes a can body, a bottom, a cap, a pedal and a cap opening member and plural bag hangers. The can body consists of two half shells combined by means of elongate hooks, with the bottom fitted firmly in a lower open side with an open upper side closed with a cap possible to be opened by the cap opening member, when the cap opening member is lifted up by the pedal stepped down. And a refuse bag is secured on an upper inner surface of the can body by means of the plural bag hangers. Then the collapsible refuse can has a small size when collapsed, beneficial for carrying, transporting and storing.