Patents by Inventor Hsiang-Yen TSAO

Hsiang-Yen TSAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition and method for manufacturing thermally conductive material
    Patent number: 11015018
    Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: May 25, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun Liu, Min-Chian Wang, Hsiang-Yen Tsao, Kuo-Chan Chiou
  • RESIN COMPOSITION AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE MATERIAL
    Publication number: 20190211138
    Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
    Type: Application
    Filed: September 28, 2018
    Publication date: July 11, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun LIU, Min-Chian WANG, Hsiang-Yen TSAO, Kuo-Chan CHIOU
  • Epoxy resin compositions and thermal interface materials comprising the same
    Patent number: 10059866
    Abstract: An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4?-methylenedianiline, 4,4?-ethylenedianiline, 4,4?-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: August 28, 2018
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun Liu, Hui-Wen Chang, Hsiang-Yen Tsao, Kuo-Chan Chiou
  • EPOXY RESIN COMPOSITIONS AND THERMAL INTERFACE MATERIALS COMPRISING THE SAME
    Publication number: 20170158932
    Abstract: An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4?-methylenedianiline, 4,4?-ethylenedianiline, 4,4?-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 8, 2017
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun LIU, Hui-Wen CHANG, Hsiang-Yen TSAO, Kuo-Chan CHIOU