Patents by Inventor Hsiao-Chyang Liu

Hsiao-Chyang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ventilated front-opening unified pod
    Patent number: 7938269
    Abstract: An improved substrate transport pod for storing or transporting semiconductor wafer substrates during semiconductor wafer processing has a main body defined by a plurality of side panels. A substantial portion of at least one of the side panels being formed of a semi-permeable membrane allowing any corrosive gas molecules introduced to the interior of the pod to diffuse out of the transport pod through the semi-permeable membrane while preventing particulate contaminants from entering the transport pod.
    Type: Grant
    Filed: November 11, 2008
    Date of Patent: May 10, 2011
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Hsiao-Chyang Liu
  • VENTILATED FRONT-OPENING UNIFIED POD
    Publication number: 20100116709
    Abstract: An improved substrate transport pod for storing or transporting semiconductor wafer substrates during semiconductor wafer processing has a main body defined by a plurality of side panels. A substantial portion of at least one of the side panels being formed of a semi-permeable membrane allowing any corrosive gas molecules introduced to the interior of the pod to diffuse out of the transport pod through the semi-permeable membrane while preventing particulate contaminants from entering the transport pod.
    Type: Application
    Filed: November 11, 2008
    Publication date: May 13, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Hsiao-Chyang LIU