Patents by Inventor Hsiao H. Peng

Hsiao H. Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170029275
    Abstract: A method for making a vertically aligned carbon nanotube (VACNT) nanocomposite applique includes: growing a VACNT array on a substrate; treating the VACNT array with a polymer solution; performing one or more of curing and drying the polymer; and etching a surface of the polymer-VACNT nanocomposite to remove some of the polymer and to expose a portion of the VACNT. A vertically aligned carbon nanotube (VACNT) nanocomposite applique includes: a VACNT array; and a polymer solution with which the VACNT array is treated, wherein a surface of the polymer-VACNT nanocomposite is etched so as to do one or more of removing some of the polymer and exposing a portion of the VACNT.
    Type: Application
    Filed: July 27, 2015
    Publication date: February 2, 2017
    Inventors: John A. Starkovich, Hsiao H. Peng, Jesse B. Tice, Edward M. Silverman
  • Patent number: 9482477
    Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: November 1, 2016
    Assignee: Northrop Grumman Systems Corporation
    Inventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao H. Peng
  • Publication number: 20160025431
    Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.
    Type: Application
    Filed: July 28, 2014
    Publication date: January 28, 2016
    Inventors: John A. Starkovich, Jesse B. Tice, Edward M. Silverman, Hsiao H. Peng