Patents by Inventor Hsiao-Ting Lee

Hsiao-Ting Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IMPLANTABLE CAPSULE AND GASTROESOPHAGEAL REFLUX DISEASE DETERMINING SYSTEM THEREOF
    Publication number: 20210298664
    Abstract: An implantable capsule includes a capsule, an adsorption hole, a pH detector, two impedance sensors and a pose sensor. The capsule includes a first shell, a second shell and the first shell and the second shell defines an accommodating space. The adsorption hole is disposed at the first shell and attaches to the tube wall of the esophagus by the external force. The pH detector is disposed at the second shell to measure the pH value of the esophageal fluid. Two impedance sensors are disposed at the first shell and the second shell. The two impedance sensors measure the impedance of the esophageal fluid to determine the fluid direction of the esophageal fluid. The pose sensor is disposed at the second shell to determine the patient pose. By this configuration, lightweight and wireless gastroesophageal monitoring device and the long-time measurement of pH of the esophageal fluid may be achieved.
    Type: Application
    Filed: March 30, 2021
    Publication date: September 30, 2021
    Inventors: HSIAO-TING LEE, SHIH-WEI HUANG, CHIN-CHENG HSIAO, KAI-CHE LIU
  • Bonding inspection structure
    Patent number: 8736083
    Abstract: A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: May 27, 2014
    Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corporation, Chimei Innolux Corporation, Industrial Technology Research Institute
    Inventors: Sheng-Shu Yang, Hsiao-Ting Lee, Chao-Chyun An
  • BONDING INSPECTION STRUCTURE
    Publication number: 20100163869
    Abstract: A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening.
    Type: Application
    Filed: April 29, 2009
    Publication date: July 1, 2010
    Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORPORATION, HANNSTAR DISPLAY CORPORATION, CHI MEI OPTOELECTRONICS CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Shu Yang, Hsiao-Ting Lee, Chao-Chyun An