Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: Disclosed is a technique for use in generating and delivering 3-D printed wearables via the use of body image data where the body is in under multiple physical conditions. Some embodiments include further body part data including videos of sequences of motion, static images, both 2-D and 3-D modeling, and user preference. Users take videos and/or photos of parts of their body as input into a custom wearable generation application. The body photos are subjected to a precise computer vision (CV) process to determine specific measurements of the user's body and the stresses.

Abstract: Disclosed is a user input verification technique for use in generating and delivering 3-D printed wearables. Users take photos of parts of their body as input into a custom wearable generation application. The body photos are subjected to a precise computer vision (CV) process to determine specific measurements of the user's body. To reduce the incidence of poor input data, image data is automatically taken from the camera viewfinder prior to the user issuing an image capture command. The extracted viewfinder data is subjected to an abbreviated CV process in order to determine viability for the precise CV process.

Abstract: Disclosed herein is a technique to efficiently pack a print volume of 3D printers having print jobs with a large number of objects. The technique positions unique objects that adhere to a similar structural pattern more closely when the degree of variation between the objects is small. Thus, while each object is unique, a greater extent of similarity between the objects causes a given group of objects to be positioned more closely to one another in the print area of the 3D printer.

Abstract: Disclosed herein is a technique to efficiently distribute a large number of printable CAD objects to a group of printers having variable settings and/or parameters. Each CAD object includes metadata specifying a particular set of production parameters (e.g., software settings, post-processing steps, production material, and/or physical location). The technique positions objects with the same set of production parameters metadata in similar print cycles subject to object nesting optimization.

Abstract: Disclosed herein is a technique to efficiently pack a print volume of 3D printers having print jobs with a large number of objects. The technique positions unique objects that adhere to a similar structural pattern more closely when the degree of variation between the objects is small. Thus, while each object is unique, a greater extent of similarity between the objects causes a given group of objects to be positioned more closely to one another in the print area of the 3D printer.

Abstract: A semiconductor device and a method for manufacturing the same. The method includes steps hereinafter. A substrate is provided with a first dielectric layer thereon. The first dielectric layer is provided with a trench. Then, a metal layer is formed to fill the trench and to cover the surface of the first dielectric layer. The metal layer is partially removed so that a remaining portion of the metal layer covers the first dielectric layer. A treatment process is performed to transform the remaining portion of the metal layer into a passivation layer on the top portion and a gate metal layer on the bottom portion. A chemical-mechanical polishing process is performed until the first dielectric layer is exposed so that a remaining portion of the passivation layer remains in the trench.

Abstract: A semiconductor device and a method for manufacturing the same. The method includes steps hereinafter. A substrate is provided with a first dielectric layer thereon. The first dielectric layer is provided with a trench. Then, a metal layer is formed to fill the trench and to cover the surface of the first dielectric layer. The metal layer is partially removed so that a remaining portion of the metal layer covers the first dielectric layer. A treatment process is performed to transform the remaining portion of the metal layer into a passivation layer on the top portion and a gate metal layer on the bottom portion. A chemical-mechanical polishing process is performed until the first dielectric layer is exposed so that a remaining portion of the passivation layer remains in the trench.

Abstract: A modular rack includes a number of lower legs and upper legs, one or more shelves to be selectively secured between the lower legs and the upper legs, one or more housing secured to the shelves, one or more sleeves may be engaged between the lower legs and the housing and the lower plates for anchoring the lower legs to the housing and the shelves, one or more connectors may be engaged between the upper legs and the shelves and the upper plates for anchoring the upper legs to the shelves and the housing, and for forming an improved or reinforced structure for allowing the modular rack to be solidly assembled together to form a stable structure.