Patents by Inventor Hsiao-Yu Chang

Hsiao-Yu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11997778
    Abstract: A method includes following steps. A photoresist-coated substrate is received to an extreme ultraviolet (EUV) tool. An EUV radiation is directed from a radiation source onto the photoresist-coated substrate, wherein the EUV radiation is generated by an excitation laser hitting a plurality of target droplets ejected from a first droplet generator. The first droplet generator is replaced with a second droplet generator at a temperature not lower than about 150° C.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Yu Tu, Han-Lung Chang, Hsiao-Lun Chang, Li-Jui Chen, Po-Chung Cheng
  • Publication number: 20240135995
    Abstract: A method is described. The method includes performing the following on a flash memory chip: measuring a temperature of the flash memory chip; and, changing a program step size voltage of the flash memory chip because the temperature of the flash memory chip has changed.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Arash HAZEGHI, Pranav KALAVADE, Rohit S. SHENOY, Hsiao-Yu CHANG
  • Patent number: 11963969
    Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: April 23, 2024
    Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATION
    Inventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
  • Patent number: 11923010
    Abstract: A method is described. The method includes performing the following on a flash memory chip: measuring a temperature of the flash memory chip; and, changing a program step size voltage of the flash memory chip because the temperature of the flash memory chip has changed.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: March 5, 2024
    Assignee: INTEL NDTM US LLC
    Inventors: Arash Hazeghi, Pranav Kalavade, Rohit S. Shenoy, Hsiao-Yu Chang
  • Publication number: 20230352092
    Abstract: Systems, apparatuses and methods may provide for technology that issues a program pulse to a selected subblock of a NAND memory array, conducts a pulse recovery phase after the program pulse, and shuts down unselected subblocks in the NAND memory array during the pulse recovery phase.
    Type: Application
    Filed: April 28, 2022
    Publication date: November 2, 2023
    Inventors: Tarek Ameen, Shantanu Rajwade, Hsiao Yu Chang, Rohit Shenoy, Pranav Chava, Xin Sun, Pratyush Chandrapati
  • Publication number: 20210304820
    Abstract: A method is described. The method includes performing the following on a flash memory chip: measuring a temperature of the flash memory chip; and, changing a program step size voltage of the flash memory chip because the temperature of the flash memory chip has changed.
    Type: Application
    Filed: March 24, 2020
    Publication date: September 30, 2021
    Inventors: Arash HAZEGHI, Pranav KALAVADE, Rohit S. SHENOY, Hsiao-Yu CHANG
  • Patent number: 9819100
    Abstract: An insulating apparatus for a metallic busbar is disposed on an interconnection part of a first strip and a second strip of the metallic busbar. The insulating apparatus includes a first insulated member, a second insulated member and a securing member. The first insulated member is formed with at least one slot. The second insulated member overlaps the first insulated member. The securing member passes through the second insulated member and the slot of the first insulated member to be slidably disposed in the slot, so that the first insulated member and the second insulated member are movable in a telescopic manner. The first insulated member and the second insulated member can cover the interconnection part of the first and second strips. The insulating problem of the interconnection part of a metallic busbar is solved, shortening the manufacturing period and manufacturing conveniently with lower cost.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: November 14, 2017
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsiao-Yu Chang, Sheng-Chan Tu