Abstract: A method for manufacturing flip-chip light emitting diode (LED) package fabricates a silicon submount with at least one groove by wet etching. Two vias are defined on base of the groove, wherein each via has a contact pad thereon and a bottom electrode on bottom thereof. An LED die is flip-chip mounted in the groove with the electrodes thereof electrically connected to the contact pads. A protective glue is applied to fill the groove and provides a flat top face. A phosphor layer is formed on the flat top face by printing. The phosphor layer is formed with excellent uniformity due to the flat top face, and provides uniform wavelength conversion effect. Alternatively, a phosphor plate is manufactured in advance and selected with desired color temperature parameter. The phosphor plate with desired color temperature parameter is attached to the flat top face of the protective glue instead of printing.

Abstract: A method for manufacturing light emitting diode (LED) package first fabricates a silicon submount with at least one groove by wet etching, wherein a reflective layer, a transparent insulation layer and a metal bump are successively formed in the silicon submount. An LED die is mounted in the groove of the silicon submount. A protective glue is applied to fill the groove and provides a flat top face. A phosphor layer is formed on the flat top face by printing. The phosphor layer is formed with excellent uniformity due to the flat top face, and provides uniform wavelength conversion effect. Alternatively, a phosphor plate is manufactured in advance and selected with desired color temperature parameter. The phosphor plate with desired color temperature parameter is attached to the flat top face of the protective glue instead of printing.

Abstract: An embedded multimedia speaker structure includes a five-facet housing having a same dimension as that of a 5-and-¼-inch disk drive; a recess disposed at a bottom center portion of the housing; a bass speaker disposed at the recess and having a bell thereof facing downward; a circuit board having play function disposed at an rear end of an interior of the housing and for controlling sounds; a panel enclosing a front end of the housing, and having a speaker provided at two sides thereof, respectively; and two sound guide tubes having an end thereof connected to a rear end of the speakers, respectively, and the other end thereof arranged to an exterior of the housing, respectively. Using the aforesaid structure, a multimedia speaker is assembled for disposing within a 5-and-¼-inch disk drive housing.

Abstract: An embedded multimedia speaker structure includes a five-facet housing having a same dimension as that of a 5-and-¼-inch disk drive; a recess disposed at a bottom center portion of the housing; a bass speaker disposed at the recess and having a bell thereof facing downward; a circuit board having play function disposed at an rear end of an interior of the housing and for controlling sounds; a panel enclosing a front end of the housing, and having a speaker provided at two sides thereof, respectively; and two sound guide tubes having an end thereof connected to a rear end of the speakers, respectively, and the other end thereof arranged to an exterior of the housing, respectively. Using the aforesaid structure, a multimedia speaker is assembled for disposing within a 5-and-¼-inch disk drive housing.