Patents by Inventor Hsien-Chun Liu

Hsien-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11921001
    Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: March 5, 2024
    Assignee: Hiwin Technologies Corp.
    Inventors: Hsien-Yu Chen, Yu-Sheng Chiu, Chih-Chun Cheng, Wen-Nan Cheng, Chi-Ming Liu
  • Patent number: 8794983
    Abstract: An electrical connector includes an outer housing having two side arms extended from two opposite lateral sides of a holder base thereof and defining with the holder base a sliding space, a movable inner housing movable in and out of the sliding space and having two upright sidewalls at two opposite lateral sides of a bottom panel thereof and defining with the bottom panel a mating space, mating contact pins mounted at the bottom panel of the movable inner housing and partially suspending in the mating space, and a flexible connection interface electrically connected with the mating contact pins and extending out of the movable inner housing and the outer housing for connection to an external transmission interface.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: August 5, 2014
    Assignee: Santa Electronics Inc.
    Inventor: Hsien-Chun Liu
  • Publication number: 20100221938
    Abstract: The present invention discloses a novel structure for the connector of electronic cards. The invented connector comprises a mode defining the outer shape of an electronic card, a first guide arm slidably provided at one side of said mode and a second guide arm slidably provided at the other side of said mode. The connector may further comprise a triangular guide rail and/or a card ejector. The connector may be affixed to a connector main body to form a connector assembly. The method for preparing the invented connector comprises the steps of: Preparing a mode defining an electronic card; slidably affixing a first guide arm at one side of the mode; and slidably affixing a second guide arm at one side of the mode. The invented method may further comprise the step of providing an ejector and/or a triangular guide rail at one guide arm. The invented method may further comprising the step of installing the first and second guide arms in a connector main body.
    Type: Application
    Filed: February 27, 2009
    Publication date: September 2, 2010
    Applicant: Santa Electronics Inc.
    Inventor: Hsien-Chun Liu