Patents by Inventor Hsien-Feng Lin

Hsien-Feng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Imaging module and electronic device using the same
    Patent number: 10180558
    Abstract: An image module and an electronic device using the same are provided. The image module includes a connecting element and a lens structure. The connecting element includes an inner ring, an outer ring and a connecting portion. The connecting portion connects the inner ring and the outer ring. The lens structure is mounted in the inner ring.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: January 15, 2019
    Assignee: ABILITY ENTERPRISE CO., LTD.
    Inventors: Yen-Min Chang, Chien-Hsin Lien, Chih-Chieh Yu, Cheng-En Lu, Hsien-Feng Lin
  • IMAGING MODULE AND ELECTRONIC DEVICE USING THE SAME
    Publication number: 20160154200
    Abstract: An image module and an electronic device using the same are provided. The image module includes a connecting element and a lens structure. The connecting element includes an inner ring, an outer ring and a connecting portion. The connecting portion connects the inner ring and the outer ring. The lens structure is mounted in the inner ring.
    Type: Application
    Filed: October 5, 2015
    Publication date: June 2, 2016
    Applicant: ABILITY ENTERPRISE CO., LTD.
    Inventors: Yen-Min CHANG, Chien-Hsin LIEN, Chih-Chieh YU, Cheng-En LU, Hsien-Feng LIN
  • Projection Device with an Electromagnetic Interference Shielding Slice
    Publication number: 20070201008
    Abstract: A DLP projection device includes a cooling fin of a DMD chip, a cover of an optical engine, a mother board, a metal sheet covering the mother board, an upper housing covering the DLP projection device, and an EMI shielding slice coupled with the cooling fin of the digital micro mirror display chip, the cover of the optical engine, and the metal sheet. The EMI shielding slice is also attached to the upper housing.
    Type: Application
    Filed: November 3, 2006
    Publication date: August 30, 2007
    Inventor: Hsien-Feng Lin