Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.

Abstract: An electronic device has a narrow viewing angle state and a wide viewing angle state, and includes a panel and a light source providing a light passing through the panel. In the narrow viewing angle state, the light has a first relative light intensity and a second relative light intensity. The first relative light intensity is the strongest light intensity, the second relative light intensity is 50% of the strongest light intensity, the first relative light intensity corresponds to an angle of 0°, the second relative light intensity corresponds to a half-value angle, and the half-value angle is between ?15° and 15°. In the narrow angle state, a third relative light intensity at each angle between 20° and 60° or each angle between ?20° and ?60° is lower than 20% of the strongest light intensity.

Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: A semiconductor die package includes a high dielectric constant (high-k) dielectric layer over a device region of a first semiconductor die that is bonded with a second semiconductor die in a wafer on wafer (WoW) configuration. A through silicon via (TSV) structure may be formed through the device region. The high-k dielectric layer has an intrinsic negative charge polarity that provides a coupling voltage to modify the electric potential in the device region. In particular, the electron carriers in high-k dielectric layer attracts hole charge carriers in device region, which suppresses trap-assist tunnels that result from surface defects formed during etching of the recess for the TSV structure. Accordingly, the high-k dielectric layer described herein reduces the likelihood of (and/or the magnitude of) current leakage in semiconductor devices that are included in the device region of the first semiconductor die.

Abstract: A LED structure with wireless power driver and display thereof is provided. The LED structure receives outside electric and magnetic field to transform into operation power for LED. The LED structure has a driver IC, a receiving element, and a light-emitting element to dispose and pack into a LED carrier directly. The receiving element is utilized to receive the electric and/or magnetic field, and a wireless control signal. The driver IC has a transformation mechanism and a driver mechanism to control the light-emitting element. With the arrangement of the elements to form a high density LED without wired powers. Therefore, the occupied space is reduced and the pins are omitted to save costs.

Abstract: A LED package structure is provided. The LED package includes a three-element red-green-blue (RGB) light emitting diode (LED). The carrier of the LED package has a power input pin and a ground pin and the pins form extension portions inside the carrier. The driver element, a red dice, a green dice, and a blue dice are disposed within the carrier. The driver element controls the red, green and blue LED dices by receiving an operation power and a PWM (Pulse Width Modulation) signal from the power input pin. By this arrangement, the LED package with compact structure, good mixing effect, and high resolution is achieved. Furthermore, the using space is saved and the PIN number is reduced to allow mass production with low costs.

Abstract: A LED package structure is provided. The LED package includes a three-element red-green-blue (RGB) light emitting diode (LED). The carrier of the LED package has a power input pin and a ground pin and the pins form extension portions inside the carrier. The driver element, a red dice, a green dice, and a blue dice are disposed within the carrier. The driver element controls the red, green and blue LED dices by receiving an operation power and a PWM (Pulse Width Modulation) signal from the power input pin. By this arrangement, the LED package with compact structure, good mixing effect, and high resolution is achieved. Furthermore, the using space is saved and the PIN number is reduced to allow mass production with low costs.

Abstract: A package structure of full-color LED (Light Emitting Diode) integrated with driving mechanism and current limiting elements includes an driving IC (Integrated Circuit) chip, a red LED dice, a green LED dice, a blue LED dice. The IC chip has a driving mechanism to control the red LED dice, the green LED dice, and the blue LED dice. And the current limiting elements are integrated into the driving IC chip. By the specific arrangement of these internal elements, the package structure generates full-color light with high resolution, compact structure and high mixing uniformity, and also achieves low cost and decreases usage of space.

Abstract: A modular LED (Light Emitting Diode) display structure includes full-color LED units to be arranged in a matrix on a flexible PCB, and plurality of protective plates to protect connection between the full-color LED units and the transmission line of the flexible PCB. Also, the edge of the display has a connecting edge banding with a hook to form a track thereunder. The hook can clip the track of another LED module plate for connection to develop a lager LED display. Moreover, by a hanger connecting to the connecting edge banding to simplify the suspending of the LED display. Furthermore, each full-color LED units has a driving chip to enhance the resolution of the LED display.

Abstract: A package structure of full-color LED (Light Emitting Diode) with driving mechanism includes an IC (Integrated Circuit) chip, a red LED dice, a green LED dice, a blue LED dice, and corresponding current limiting resistors. The IC chip has a driving mechanism to control the red LED dice, the green LED dice, and the blue LED dice. By the specific arrangement of these internal elements, the package structure generates full-color light with high resolution, compact structure and high mixing uniformity, and also achieves low cost and decreases usage of space.

Abstract: A laser module co-axis adjustment structure includes a laser module that includes an optical module and a laser diode housed inside a hollow casing and a circuit board for controlling the laser diode to emit a laser beam through the optical module, and an eccentric sleeve, which is rotatable relative to the casing through 360-degrees and has an eccentrically disposed inside sloping surface stopped against the periphery of the hollow casing of the laser module for enabling the eccentric sleeve to be rotated relative to the laser module to adjust the mechanical axis of the eccentric sleeve into alignment with the optical axis of the optical module of the laser module. The eccentric sleeve and the hollow casing may be affixed with an adhesive after calibration of the alignment.

Abstract: A package structure of full-color LED (Light Emitting Diode) with driving mechanism includes an IC (Integrated Circuit) chip, a red LED dice, a green LED dice, a blue LED dice, and corresponding current limiting resistors. The IC chip has a driving mechanism to control the red LED dice, the green LED dice, and the blue LED dice. By the specific arrangement of these internal elements, the package structure generates full-color light with high resolution, compact structure and high mixing uniformity, and also achieves low cost and decreases usage of space.

Abstract: An electrical chess module is disclosed. A LED and a first coil are configured at every chessman, and the LED and the first coil are parallel connection. A electric power and a second coil are configured at the chessboard, wherein the second coil makes the electromagnetic induction due to a magnetic field resulted from the electric current of the electric power, thereby the luminous apparatus of every chessman will shine because the first coil produces a electric current due to the electromagnetic induction between the first coil and the magnetic field.

Abstract: A heat sink device for configuring a lamp house is disclosed. The heat sink device includes a heat sink and a lamp house. The lamp house is telescoped into the heat sink. The heat sink includes room for containing a heat condition material. The lamp house is used for configuring an light emitting device. The heat sink comprises a plurality of fins surround itself. The heat generated by the light emitting device can be dissipated into the air via the heat condition material and the fins.

Abstract: a heat sink for a light emitting diode lamp is disclosed. The heat sink comprises a heat sink module, a transparent lens and a heat condition liquid. The heat sink module has a lamphouse with a first opening and a second opening on the both ends. The heat sink is formed by a heat condition material for heat sinking. Besides, there is a room in where the heat condition liquid is filled within the heat sink module for enhancing the effect of heat condition. Accordingly, the heat can be sinked into the air by the heat sink module.

Abstract: A piezoelectric porcelain step-up discharge tube includes a vacuum tube having an inner surface coated with fluorescent material and filled with a substance which can be easily activated to discharge, an input plug mounted on one end of the vacuum tube, a conducting terminal arranged on another end of the vacuum tube, a porcelain step-up device arranged within the vacuum tube and having an end electrically connected with the input plug and another end made of piezoelectric material for providing a discharging electrode for supplying a starting and working voltage, and a conductive material coated on an outer side of the vacuum tube and electrically connecting the input plug to the conducting terminal.