Patents by Inventor Hsien-Sheng Pei

Hsien-Sheng Pei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8459341
    Abstract: An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: June 11, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chang-Shen Chang, Juei-Khai Liu, Chao-Hao Wang, Hsien-Sheng Pei
  • Patent number: 7988893
    Abstract: A method for fabricating a carbon nanotube yarn includes providing a plurality of carbon nanotube arrays; pulling out, by using a tool, a first carbon nanotube structure from one of the carbon nanotube arrays; pulling out a subsequent carbon nanotube structure from another one of the carbon nanotube arrays; joining a leading end of the subsequent carbon nanotube structure to a trailing portion of the carbon nanotube structure already formed by contacting the leading end of the subsequent carbon nanotube structure with the trailing portion of the already-formed carbon nanotube structure, with the contact occurring along a common lengthwise direction of the two carbon nanotube structures, thereby forming a lengthened carbon nanotube structure; repeating the pulling and the joining until the lengthened carbon nanotube structure has a desired length; and treating the lengthened carbon nanotube structure with an organic solvent.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: August 2, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Hsin Kevin Liao, Kai-Li Jiang, Shou-Shan Fan, Yuan Yao, Chang-Shen Chang, Hsien-Sheng Pei
  • Patent number: 7947331
    Abstract: A method for making a thermal interface material includes the steps of: (a) providing an array of carbon nanotubes formed on a substrate, the carbon nanotubes having interfaces defined therebetween; (b) providing a transferring device and disposing at least one low melting point metallic material above the array of carbon nanotubes, using the transferring device; and (c) heating the low melting point metallic material and the array of carbon nanotube to a certain temperature to make the at least one low melting point metallic material melt, then flow into the interspaces between the carbon nanotubes, and combine (e.g., mechanically) with the array of carbon nanotubes to acquire a carbon-nanotube-based thermal interface material.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: May 24, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Yun-Hsin Kevin Liao, Yuan Yao, Chang-Shen Chang, Hsien-Sheng Pei, Kai-Li Jiang, Chang-Hong Liu
  • Publication number: 20110048683
    Abstract: An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.
    Type: Application
    Filed: November 4, 2010
    Publication date: March 3, 2011
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHANG-SHEN CHANG, JUEI-KHAI LIU, CHAO-HAO WANG, HSIEN-SHENG PEI
  • Patent number: 7845394
    Abstract: A heat pipe includes an elongated casing (10), a wick (13), at least one artery mesh (12), and working medium filling in the casing. The casing has an evaporating section (101) and a condensing section (102). The wick is disposed on an inner wall of the evaporating section. The at least one artery mesh includes a large portion (121) and a small portion (122) with an outer diameter smaller than that of the large portion. The small portion is located within and contacts with the wick, and the large portion contacts with the inner wall of the condensing section of the casing. The working medium saturates the wick and the at least one artery mesh.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: December 7, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chang-Shen Chang, Juei-Khai Liu, Chao-Hao Wang, Hsien-Sheng Pei
  • Patent number: 7764806
    Abstract: A speaker set (10) includes an enclosure (11) extending two spaced supporting portions (118) from a bottom side thereof for contacting with a supporting member (20); a woofer (12), two mid-frequency speakers (13), and two tweeters (14) are disposed in the enclosure; a circuitry electrically connects with the woofer, the mid-frequency speakers, and the tweeters; two woofer chambers (121, 123) are disposed at two opposite sides of a diaphragm of the woofer. One of the woofer chambers is defined between the bottom side of the enclosure, the supporting portions of the enclosure and the supporting member, whilst the other one of the woofer chambers is defined in the enclosure. Sound generated by the woofer emanates to a surrounding environment through both the woofer chambers, wherein the enclosure defines a plurality of venting holes (122) communicating with the other one of the woofer chambers.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: July 27, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Hsien-Sheng Pei, Tsung-Lung Yang
  • Publication number: 20100065981
    Abstract: A method for fabricating a carbon nanotube yarn includes providing a plurality of carbon nanotube arrays; pulling out, by using a tool, a first carbon nanotube structure from one of the carbon nanotube arrays; pulling out a subsequent carbon nanotube structure from another one of the carbon nanotube arrays; joining a leading end of the subsequent carbon nanotube structure to a trailing portion of the carbon nanotube structure already formed by contacting the leading end of the subsequent carbon nanotube structure with the trailing portion of the already-formed carbon nanotube structure, with the contact occurring along a common lengthwise direction of the two carbon nanotube structures, thereby forming a lengthened carbon nanotube structure; repeating the pulling and the joining until the lengthened carbon nanotube structure has a desired length; and treating the lengthened carbon nanotube structure with an organic solvent.
    Type: Application
    Filed: September 18, 2008
    Publication date: March 18, 2010
    Applicants: Tsinghua University, HON HAI Precision Industry CO., LTD.
    Inventors: Yun-Hsin Kevin Liao, Kai-Li Jiang, Shou-Shan Fang, Yuan Yao, Chang-Shen Chang, Hsien-Sheng Pei
  • Patent number: 7625122
    Abstract: A fluid dynamic bearing includes a bearing member (30) axially defining an inner bearing hole therein, and a spindle shaft (20) rotatably received in the bearing hole with a bearing clearance formed between an inner periphery of the bearing member and an outer periphery of the spindle shaft. Lubricant is filled in the bearing clearance. One of the inner periphery and the outer periphery comprises a bearing surface (10) with channels formed therein. The channels form a plurality of outer communication ends (1316b) at opposite sides of the bearing surface in the axial direction of the bearing member.
    Type: Grant
    Filed: December 14, 2004
    Date of Patent: December 1, 2009
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ching-Hsing Huang, Wun-Chang Shih, Hsien-Sheng Pei
  • Publication number: 20090269498
    Abstract: A method for making a thermal interface material includes the steps of: (a) providing an array of carbon nanotubes formed on a substrate, the carbon nanotubes having interfaces defined therebetween; (b) providing a transferring device and disposing at least one low melting point metallic material above the array of carbon nanotubes, using the transferring device; and (c) heating the low melting point metallic material and the array of carbon nanotube to a certain temperature to make the at least one low melting point metallic material melt, then flow into the interspaces between the carbon nanotubes, and combine (e.g., mechanically) with the array of carbon nanotubes to acquire a carbon-nanotube-based thermal interface material.
    Type: Application
    Filed: April 28, 2008
    Publication date: October 29, 2009
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUN-HSIN KEVIN LIAO, YUAN YAO, CHANG-SHEN CHANG, HSIEN-SHENG PEI, KAI-LI JIANG, CHANG-HONG LIU
  • Patent number: 7609520
    Abstract: A heat spreader includes a bottom wall (12) and a cover (14) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space (11) therebetween for receiving a working fluid therein. A wick structure (15) is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: October 27, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chang-Shen Chang, Juei-Khai Liu, Chao-Hao Wang, Hsien-Sheng Pei
  • Publication number: 20090263310
    Abstract: A method for making carbon nanotubes that includes the following steps. A metal substrate is provided. The surface of the metal substrate is polished. The polished metal substrate is put into a reaction device. A protecting gas is introduced to the reaction device while the environment inside of the reaction device is heated to about 400 to 800 degrees. A mixture of carbon source gas and protecting gas is introduced to the reaction device, whereby the carbon nanotubes are grown on the metal substrate on the polished metal substrate.
    Type: Application
    Filed: April 9, 2009
    Publication date: October 22, 2009
    Applicants: Tsinghua University, HON HAI Precision Industry CO., LTD.
    Inventors: Feng-Wei Dai, Yuan Yao, Chang-Shen Chang, Hsien-Sheng Pei, Kai-Li Jiang, Shou-Shan Fan
  • Patent number: 7578367
    Abstract: An electronic product (100) includes a casing (10) containing a speaker set (20) therein. The speaker set includes a hollow shell (60) and a loudspeaker (50). The loudspeaker is accommodated in the shell, dividing an inner space of the shell into a first resonance chamber (61a) and a second resonance chamber (61b). The loudspeaker includes first tone holes (52) communicating with the first resonance chamber and second tone holes (54) communicating with the second resonance chamber. The first resonance chamber communicates with the second resonance chamber via at least an inverted tube (69).
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: August 25, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tsung-Lung Yang, Hsien-Sheng Pei
  • Patent number: 7578368
    Abstract: A speaker set (20) for an electronic product (100) includes a hollow shell (60), and a loudspeaker (50) accommodated in the shell. The shell includes at least a spacing plate (68) which divides an inner space of the shell into a first resonance chamber (61a) and a second resonance chamber (61b). The loudspeaker includes first tone holes (52) communicating with the first resonance chamber and second tone holes (54) communicating with the second resonance chamber. The second resonance chamber communicates with the first resonance chamber via at least an inverted hole (69) defined in the at least a spacing plate. The first resonance chamber communicates with a surrounding environment so that sound emitted from the first and second tone holes of the loudspeaker can be transferred to the surrounding environment.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: August 25, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tsung-Lung Yang, Hsien-Sheng Pei
  • Patent number: 7556121
    Abstract: A mobile phone (1) includes a casing (10) containing a printed circuit board (28) and an antenna (29) therein; and a speaker set (20) is disposed between the printed circuit board and the antenna. The speaker set includes a hollow shell (21) including a first chamber (220), a second chamber (230) and a third chamber (240) isolated from the second chamber, and a loudspeaker (25) accommodated in first chamber of the shell and dividing the first chamber into a front chamber (224) and a rear chamber (223). The front chamber communicates with the second chamber, whilst the rear chamber communicates with the third chamber.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: July 7, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tsung-Lung Yang, Hsien-Sheng Pei
  • Patent number: 7547124
    Abstract: An LED lamp cooling apparatus (10) includes a substrate (11), a plurality of LEDs (13) electrically connected with the substrate, a heat sink (19) for dissipation of heat generated by the LEDs and a pulsating heat pipe (15) thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions (154) and a plurality of heat radiating portions (155), and contains a working fluid (153) therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: June 16, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chang-Shen Chang, Juei-Khai Liu, Chao-Hao Wang, Hsien-Sheng Pei
  • Patent number: 7543960
    Abstract: A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.
    Type: Grant
    Filed: January 26, 2007
    Date of Patent: June 9, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chang-Shen Chang, Juei-Khai Liu, Chao-Hao Wang, Hsien-Sheng Pei
  • Publication number: 20090084526
    Abstract: A heat pipe includes an elongated casing (10), a wick (13), at least one artery mesh (12), and working medium filling in the casing. The casing has an evaporating section (101) and a condensing section (102). The wick is disposed on an inner wall of the evaporating section. The at least one artery mesh includes a large portion (121) and a small portion (122) with an outer diameter smaller than that of the large portion. The small portion is located within and contacts with the wick, and the large portion contacts with the inner wall of the condensing section of the casing. The working medium saturates the wick and the at least one artery mesh.
    Type: Application
    Filed: December 18, 2007
    Publication date: April 2, 2009
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHANG-SHEN CHANG, JUEI-KHAI LIU, CHAO-HAO WANG, HSIEN-SHENG PEI
  • Patent number: 7494283
    Abstract: A hydrodynamic bearing assembly (10) includes a bearing sleeve (11) defining a receiving chamber (113) therein, a bearing (12) received in the receiving chamber of the bearing sleeve, a sealing cover (15) mounted to an open end (112) of the bearing sleeve and including an enlarged section (153) adjacent to the bearing, a shaft (13) extending through the sealing cover and rotatably disposed in the bearing, on which a plurality lubricant pressure generating grooves are defined, and a lubricant retaining space (117) defined by the enlarged section of the sealing cover, an end of the bearing and the shaft for receiving lubricant therein. One of the sealing cover and the shaft defines a groove (134) therein, while the other one of the sealing cover and the shaft extends a flange (156) into the groove.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: February 24, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chien-Long Hong, Ching-Hsing Huang, Wun-Chang Shih, Hsien-Sheng Pei
  • Publication number: 20090020268
    Abstract: A heat pipe (10) includes a casing (11) and a composite wick structure (14). The casing includes an evaporator section (15) and a condenser section (16). The wick structure includes a plurality of grooves (142, 143) and an artery mesh (145). The grooves at the evaporator section each have a smaller groove width and a smaller apex angle (A1) than those of each of the grooves at the condenser section. A method for manufacturing the heat pipe includes: providing a casing with a plurality of grooves axially defined therein; shrinking a diameter of one portion of the casing to obtain an evaporator section of the heat pipe; placing an artery mesh to contact with an inner wall of the casing; vacuuming the casing and placing a working fluid in the casing; sealing the casing to obtain the heat pipe.
    Type: Application
    Filed: September 18, 2007
    Publication date: January 22, 2009
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHANG-SHEN CHANG, CHAO-HAO WANG, JUEI-KHAI LIU, HSIEN-SHENG PEI
  • Publication number: 20090020269
    Abstract: A heat pipe (10) includes a metal casing (12) having an evaporator section (121) and a condenser section (122). A major wick structure (14) is disposed on an inner wall of the casing. At least one assistant wick structure (16) is disposed in and contacts with the major wick structure, and working medium fills in the casing and saturates the major wick structure and the at least one assistant wick structure. An average pore size of the major wick structure corresponding to the evaporator section is smaller than that of the major wick structure corresponding to the condenser section. A diameter of a cross section of the at least one assistant wick structure is smaller than a diameter of a cross section of the major wick structure, and thus the at least one assistant wick structure has a linear contact with the major wick structure.
    Type: Application
    Filed: September 19, 2007
    Publication date: January 22, 2009
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHANG-SHEN CHANG, CHAO-HAO WANG, JUEI-KHAI LIU, HSIEN-SHENG PEI