Patents by Inventor Hsien Y. Pu

Hsien Y. Pu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9725198
    Abstract: Shrink wrap films that are customized to have a shape matching a shape of a particular part or parts are disclosed. The shrink wrap films can be formed using unique manufacturing techniques that involve heating the part or parts prior to applying the shrink wrap film. The resultant part or parts will have substantially wrinkle-free and defect-free shrink wrap film applied thereon. In some embodiments, additional functional and cosmetic features are formed in the shrink wrap film. In some embodiments, a laser cutting procedure is used to form the features in the shrink wrap film. Methods can be used to provide visually and tactilely smooth and aesthetically appealing shrink wrapped consumer products.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: August 8, 2017
    Assignee: APPLE INC.
    Inventors: Eugene A. Whang, Paul E. Newburn, Mark E. Doutt, Rafael L. Dionello, Hsien Y. Pu, Michael A. Korinek, Evan A. Cernokus, Michael S. Long
  • Publication number: 20150217891
    Abstract: Shrink wrap films that are customized to have a shape matching a shape of a particular part or parts are disclosed. The shrink wrap films can be formed using unique manufacturing techniques that involve heating the part or parts prior to applying the shrink wrap film. The resultant part or parts will have substantially wrinkle-free and defect-free shrink wrap film applied thereon. In some embodiments, additional functional and cosmetic features are formed in the shrink wrap film. In some embodiments, a laser cutting procedure is used to form the features in the shrink wrap film. Methods can be used to provide visually and tactilely smooth and aesthetically appealing shrink wrapped consumer products.
    Type: Application
    Filed: August 21, 2014
    Publication date: August 6, 2015
    Inventors: Eugene A. Whang, Paul E. Newburn, Mark E. Doutt, Rafael L. Dionello, Hsien Y. Pu, Michael A. Korinek, Evan A. Cernokus, Michael S. Long