Patents by Inventor HSIEN-YU CHEN

HSIEN-YU CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948627
    Abstract: A write assist circuit can include a control circuit and a voltage generator. The control circuit can be configured to receive memory address information associated with a memory write operation for memory cells. The voltage generator can be configured to provide a reference voltage to one or more bitlines coupled to the memory cells. The voltage generator can include two capacitive elements, where during the memory write operation, (i) one of the capacitive elements can be configured to couple the reference voltage to a first negative voltage, and (ii) based on the memory address information, both capacitive elements can be configured to cumulatively couple the reference voltage to a second negative voltage that is lower than the first negative voltage.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hidehiro Fujiwara, Chih-Yu Lin, Sahil Preet Singh, Hsien-Yu Pan, Yen-Huei Chen, Hung-Jen Liao
  • Publication number: 20240088093
    Abstract: In an embodiment, a method includes: attaching a package component to a package substrate, the package component includes: a first die being disposed over an interposer; a second die being disposed over the interposer and laterally adjacent to the first die; and an encapsulant being disposed around the first die and the second die; attaching a thermal interface material to the first die and the second die; and attaching a lid structure to the package substrate, the lid structure includes: a lid cap being disposed over the thermal interface material; and a plurality of lid feet connecting the lid cap to the package substrate, in a plan view the plurality of lid feet forming a discontinuous loop around the package component.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 14, 2024
    Inventors: Wensen Hung, Tsung-Yu Chen, Wen-Hsin Wei, Hsien-Pin Hu
  • Patent number: 11923310
    Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei
  • Patent number: 11921001
    Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: March 5, 2024
    Assignee: Hiwin Technologies Corp.
    Inventors: Hsien-Yu Chen, Yu-Sheng Chiu, Chih-Chun Cheng, Wen-Nan Cheng, Chi-Ming Liu
  • Publication number: 20240071849
    Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Jian-You Chen, Kuan-Yu Huang, Li-Chung Kuo, Chen-Hsuan Tsai, Kung-Chen Yeh, Hsien-Ju Tsou, Ying-Ching Shih, Szu-Wei Lu
  • Patent number: 11788880
    Abstract: A device and a method for detecting states of a linear guideway including a sliding block and a slide rail are provided. The device includes a sensor located at a position corresponding to a side surface of the slide rail, and an analysis processer communicated with the sensor. The sensor detects the vibrating of the slide rail to generate a sensing signal. The analysis processer compares the sensing signal with at least one threshold, to determines occurrence of abnormalities. Therefore, the sensitivity for detection may be increased.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: October 17, 2023
    Assignee: Hiwin Technologies Corp.
    Inventors: Po-Lin Lee, Hsien-Yu Chen, Stephanie Chun-Ming Yang
  • Publication number: 20230288290
    Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.
    Type: Application
    Filed: March 11, 2022
    Publication date: September 14, 2023
    Inventors: Hsien-Yu CHEN, Yu-Sheng CHIU, Chih-Chun CHENG, Wen-Nan CHENG, Chi-Ming LIU
  • Publication number: 20230244826
    Abstract: A method and a system for building digital twin models allow the setting of a shape and dimensions of a simplified geometric solid corresponding to a component of a feeding system; after sampling the solid to obtain second position data, calculates a set of model eigenvalues and a set of model eigenvectors by a modal analysis method according to a material data of the component, the second position data and second size data of the solid; and defines the solid as a digital twin model of the component when it is determined by a modal verification method that a set of actual eigenvectors of the component is similar to the set of model eigenvectors. Data amounts of the second position and size data are far less than data amounts of first position and size data of an image of the component.
    Type: Application
    Filed: January 28, 2022
    Publication date: August 3, 2023
    Inventors: Po-Lin Lee, Hsien-Yu Chen, Yu-Sheng Chiu, Wen-Nan Cheng, Chih-Chun Cheng
  • Patent number: 11572919
    Abstract: A clamp slide for use in a linear guide includes a slide body, two piston units disposed in the slide body, two elastic members stopped against the piston units, and two fluid pressure cylinders pushing the piston units to move toward a direction against restoring forces exerted by the elastic members. Further, a moveable member is disposed in each of the piston units and pushed by an inclined plane of a lateral cover to push a braking member, such that a rail is clamped by the left and right braking members. The lateral cover can be assembled in different ways according to actual needs for enabling the inclined plane to perform opposite tilt direction. As such, the clamp slide of the present invention has the effects of simplifying structure and reducing cost.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: February 7, 2023
    Assignee: HIWIN TECHNOLOGIES CORP.
    Inventors: Made Rama Pradipta Arya, Yeh-Wei Lin, Hsien-Yu Chen
  • Publication number: 20220178739
    Abstract: A device and a method for detecting states of a linear guideway including a sliding block and a slide rail are provided. The device includes a sensor located at a position corresponding to a side surface of the slide rail, and an analysis processer communicated with the sensor. The sensor detects the vibrating of the slide rail to generate a sensing signal. The analysis processer compares the sensing signal with at least one threshold, to determines occurrence of abnormalities. Therefore, the sensitivity for detection may be increased.
    Type: Application
    Filed: July 14, 2021
    Publication date: June 9, 2022
    Inventors: Po-Lin Lee, Hsien-Yu Chen, Stephanie Chun-Ming Yang
  • Publication number: 20220042543
    Abstract: A clamp slide for use in a linear guide includes a slide body, two piston units disposed in the slide body, two elastic members stopped against the piston units, and two fluid pressure cylinders pushing the piston units to move toward a direction against restoring forces exerted by the elastic members. Further, a moveable member is disposed in each of the piston units and pushed by an inclined plane of a lateral cover to push a braking member, such that a rail is clamped by the left and right braking members. The lateral cover can be assembled in different ways according to actual needs for enabling the inclined plane to perform opposite tilt direction. As such, the clamp slide of the present invention has the effects of simplifying structure and reducing cost.
    Type: Application
    Filed: April 30, 2021
    Publication date: February 10, 2022
    Inventors: Made Rama Pradipta Arya, Yeh-Wei LIN, Hsien-Yu CHEN
  • Patent number: 9621067
    Abstract: A hybrid power supply device of an air-conditioner for supplying multiple electric power sources to a DC rail of an inverter of a DC brushless motor of the air-conditioner to drive the operation of the DC brushless motor is introduced. Two power sources may be selectively fed into the inverter of the DC brushless motor to provide hybrid power sources to the air-conditioner in a low cost simply by connecting the outputs of two one-way rectifiers. In addition, a voltage boost circuit is provided to program each source as the main power source and a backup power source. With the skillful arrangement of a simple circuit, the air-conditioner achieves the hybrid power supply effect with a multiple of controllable power sources.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: April 11, 2017
    Assignees: PHOEBUS-POWER TECHNOLOGY CO., LTD., TARO SUE CORPORATION
    Inventors: Te-Jen Hsieh, Hsien-Yu Chen, Alexander S. Gozon, Yi-Huei Lin
  • Publication number: 20150369525
    Abstract: A hybrid power supply device of an air-conditioner for supplying multiple electric power sources to a DC rail of an inverter of a DC brushless motor of the air-conditioner to drive the operation of the DC brushless motor is introduced. Two power sources may be selectively fed into the inverter of the DC brushless motor to provide hybrid power sources to the air-conditioner in a low cost simply by connecting the outputs of two one-way rectifiers. In addition, a voltage boost circuit is provided to program each source as the main power source and a backup power source. With the skillful arrangement of a simple circuit, the air-conditioner achieves the hybrid power supply effect with a multiple of controllable power sources.
    Type: Application
    Filed: June 24, 2014
    Publication date: December 24, 2015
    Inventors: TE-JEN HSIEH, HSIEN-YU CHEN, ALEXANDER S. GOZON, YI-HUEI LIN