Patents by Inventor Hsin-Ho Lee

Hsin-Ho Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070062799
    Abstract: A water purification apparatus (10) includes an evaporating chamber (13), a light concentrator (11), and a heat pipe (12). The evaporating chamber is for containing impure water. The evaporating chamber has a connecting opening (134) and a vapor outlet (131). The light concentrator is for concentrating sunshine. The heat pipe has an evaporating section (121) and a condensing section (122). The evaporating section is irradiated by the concentrated sunshine, and the condensing section is disposed in the evaporating chamber through the connecting opening.
    Type: Application
    Filed: May 19, 2006
    Publication date: March 22, 2007
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventor: Hsin-Ho Lee
  • Publication number: 20070056689
    Abstract: An apparatus (10) for applying adhesive to a plurality of components (12) includes a main body (20), a driving member (60) and an injecting device (80). The main body has a cavity (208) configured for receiving the components therein. The driving member is configured for pushing the components so as to make the components contact with each other. The injecting device has a receiving space (824) configured for containing an adhesive therein and at least one injecting hole (826) both communicating with the receiving space and the cavity thereby allowing the adhesive to be injected onto the components.
    Type: Application
    Filed: April 26, 2006
    Publication date: March 15, 2007
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventor: Hsin-Ho Lee
  • Publication number: 20070034358
    Abstract: A heat dissipation device includes a first assembly having a first shell portion and a wick layer formed thereon, a second assembly having a second shell portion and a clapboard formed thereon, and a circumfluence cavity and an evaporation cavity formed by coupling the first assembly and the second assembly together and separated by the clapboard. The circumfluence cavity and the evaporation cavity are communicated via the wick layer.
    Type: Application
    Filed: May 3, 2006
    Publication date: February 15, 2007
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventor: Hsin-Ho Lee
  • Publication number: 20070034352
    Abstract: A temperature control system (100) includes a heating system (1), a cooling system (2) and a control unit (3). The heating system has a heated fluid. The heated fluid is heated by a solar energy for increasing the mold temperature. The cooling system has a cooled fluid. The cooled fluid cools for decreasing the mold temperature. The control unit controls the heating system and the cooling system to be opened or closed.
    Type: Application
    Filed: May 18, 2006
    Publication date: February 15, 2007
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventor: Hsin-Ho Lee
  • Publication number: 20070006902
    Abstract: A fixture for optical elements includes a washing bar, a holder and a vacuum pump. The washing bar includes an inner channel and a connecting portion in communication with the inner channel. A hole is formed in the washing bar for communicating with the inner channel. The holder connects with the washing bar. The holder has a holding surface communicating with the hole. The holding surface has a shape corresponding to a peripheral surface of the optical elements to be held. The vacuum pump is connected with the connecting portion. The vacuum pump is configured for vacuum the washing bar so as to effectively suck the one of the optical elements on the holding surface. The present fixture can hold optical elements firmly and does not damage the optical elements.
    Type: Application
    Filed: April 26, 2006
    Publication date: January 11, 2007
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventor: Hsin-Ho Lee
  • Publication number: 20060291168
    Abstract: A heat dissipating module (10) includes a container (11), a wick layer (12) and a working fluid (40). The container further includes a partition wall (13), a first cavity (16), a second cavity (17), an inlet (14) and an outlet (15). The first and second cavities are separated by the partition wall. The partition wall is arranged inside the container and is configured for blocking the working fluid from flowing from the first cavity to the second cavity. The wick layer is formed as a porous capillary structure. The wick layer is configured for guiding the working liquid to flow from the first cavity to the second cavity. The present invention also provides a heat sink assembly (100). The heat sink assembly includes an above-described heat dissipating module, a circulatory tube (20) and a cooling device (30).
    Type: Application
    Filed: May 18, 2006
    Publication date: December 28, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventor: Hsin-Ho Lee
  • Publication number: 20060278266
    Abstract: A solar energy device (100) for an electronic device includes a solar energy collecting component (10) and a lens module (20). The solar energy collecting component has a first surface (105) and a second surface. The lens module is rotatably mounted relative to the solar energy collecting component. The lens module is configured to concentrate incident solar radiation onto the first surface of the solar energy collecting component. The solar energy collecting component is for converting incident solar radiation energy to electrical energy. The lens module is movable between a first position in which the lens module is spaced from the first surface of the solar energy collecting component so as to concentrate incident solar radiation onto the first surface and a second position in which the lens module abuts the second surface so as to reduce overall volume of the solar energy device.
    Type: Application
    Filed: April 24, 2006
    Publication date: December 14, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventor: Hsin-Ho Lee
  • Publication number: 20060278375
    Abstract: An exemplary heat sink apparatus (10) includes a base (12) and a number of fins (14) extending from an upper external first surface (124) of the base. The base defines a sealed cavity (122) therein. Operating fluid (18) is filled in the cavity. The operating fluid is liquid form. In use, heat produced by a heat source is transferred to the base. Then, the liquid operating fluid in the base absorbs the heat and is vaporized. The vaporized operating fluid is diffused to an upper inner wall (126) of the base and releases the heat, thereby being transformed back into liquid form. The fins transfer the heat to the ambient environment. The heat sink apparatus can dissipate the heat produced by the heat source to the ambient environment quickly and uniformly by adopting the operating fluid. Thus, the thermal operating efficiency and effect of the heat sink apparatus are enhanced.
    Type: Application
    Filed: June 9, 2006
    Publication date: December 14, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventor: Hsin-Ho Lee
  • Publication number: 20060277923
    Abstract: A heat-dissipation device (1) is used for assembly on an outside portion of an electrically powered, heat-generating device (e.g., a notebook 6) for dissipation of heat produced thereby. The heat-dissipation device includes a fan (30), a thermo-electric cooler (20) disposed adjacent the fan, a processing unit (40) electrically connected with the thermo-electric cooler and the fan for controlling them, and an electrical connector (50) electrically connected with the processing unit. The connector is further electrically connected with the electrically powered, heat-generating device to be cooled. The processing unit controls the fan and the thermo-electric cooler according to signals transmitted from the electrically powered, heat-generating device, via the connector.
    Type: Application
    Filed: May 26, 2006
    Publication date: December 14, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventor: Hsin-Ho Lee
  • Patent number: 7124810
    Abstract: A heat pipe (20) includes a pipe (21), a wick (22) formed on an inner wall (23) of the pipe, and a working fluid (not shown) sealed in the pipe and soaked in the wick. The wick is formed by sintering nano-size metal powder disposed inside the pipe. First through holes (25) are defined in the wick in an evaporator section (20a) of the heat pipe. A central one of the first through holes is aligned along an axis 20c of the heat pipe, and other first through holes are parallel to the axis 20c. A second through hole (26) is defined in the wick in a condenser section (20b) of the heat pipe. The second through hole communicates with the first through holes, whereby the working fluid flows through the first and second through holes. These characteristics give the wick low thermal resistance, a high evaporator surface area, and high capillary force.
    Type: Grant
    Filed: April 15, 2005
    Date of Patent: October 24, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Ho Lee, Wei-Jian Liao
  • Publication number: 20060141751
    Abstract: A method for forming silicon dioxide layer on a silicon substrate by anodic oxidation includes: providing a silicon substrate which has a polished face; providing an anodic oxidation apparatus which is filled with an electrolyte; providing a platinum piece and placing the platinum piece in the electrolyte as a cathode; placing the silicon substrate in the electrolyte as an anode with the polished surface of the silicon substrate facing to the cathode; applying a direct current to the cathode and the anode and irradiating the electrolyte with ultraviolet light for a predetermined period of time; taking out the silicon substrate and getting a finished silicon dioxide layer formed on the silicon substrate after cleaning, drying and cooling. The method can increase the reaction rate, and the silicon dioxide layer so formed has a uniform thickness and high purity.
    Type: Application
    Filed: December 14, 2005
    Publication date: June 29, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Wei-Jian Liao, Hsin-Ho Lee
  • Publication number: 20060125925
    Abstract: A digital camera module (100) with an auto-focusing function is adapted for use in a foldable electronic device. The digital camera module includes a lens mount (10), a lens barrel (20), a voice coil actuator (40), and an image pick-up module (50). The lens barrel receives at least one lens (24) therein and is mounted on/in the lens mount. The lens barrel is made of a composite material including a magnetic metallic nano-powder. The voice coil actuator is adapted for cooperating with the lens barrel to form a magnetic loop. The image pick-up module is disposed under the lens mount and is configured for receiving an image from the at least one lens and converting that image to an electrical signal.
    Type: Application
    Filed: November 18, 2005
    Publication date: June 15, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventor: Hsin-Ho Lee
  • Publication number: 20060016580
    Abstract: A heat pipe (20) includes a pipe (21), a wick (22) formed on an inner wall (23) of the pipe, and a working fluid (not shown) sealed in the pipe and soaked in the wick. The wick is formed by sintering nano-size metal powder disposed inside the pipe. First through holes (25) are defined in the wick in an evaporator section (20a) of the heat pipe. A central one of the first through holes is aligned along an axis 20c of the heat pipe, and other first through holes are parallel to the axis 20c. A second through hole (26) is defined in the wick in a condenser section (20b) of the heat pipe. The second through hole communicates with the first through holes, whereby the working fluid flows through the first and second through holes. These characteristics give the wick low thermal resistance, a high evaporator surface area, and high capillary force.
    Type: Application
    Filed: April 15, 2005
    Publication date: January 26, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Hsin-Ho Lee, Wei-Jian Liao