Patents by Inventor Hsin-Jung Lu

Hsin-Jung Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11989966
    Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: May 21, 2024
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Hsin-Hui Lee, Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen, Hsueh-Jung Lin, Wen-Chih Lu, Chih-Hsien Chen
  • Patent number: 11887564
    Abstract: A resonance counterweight structure for audio effect article includes a hollow counterweight main body and an assembling section connected with the counterweight main body. The assembling section can be mounted in a predetermined position of a musical instrument. The counterweight main body at least includes an upper wall, a lower wall and a peripheral wall connected between the upper and lower walls. The upper wall, the lower wall and the peripheral wall define a chamber of the counterweight main body. At least one counterweight fine-adjustment unit is received in the chamber. The counterweight main body and the counterweight fine-adjustment unit help the audio effect article to modify the music so as to achieve more idealistic timbre effect. A player can more diversely select or replace the counterweight structure, whereby one single musical instrument can selectively output different timbre effects according to the requirements of different playing situations.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: January 30, 2024
    Inventor: Hsin-Jung Lu
  • Publication number: 20220246117
    Abstract: A resonance counterweight structure for audio effect article includes a hollow counterweight main body and an assembling section connected with the counterweight main body. The assembling section can be mounted in a predetermined position of a musical instrument. The counterweight main body at least includes an upper wall, a lower wall and a peripheral wall connected between the upper and lower walls. The upper wall, the lower wall and the peripheral wall define a chamber of the counterweight main body. At least one counterweight fine-adjustment unit is received in the chamber. The counterweight main body and the counterweight fine-adjustment unit help the audio effect article to modify the music so as to achieve more idealistic timbre effect. A player can more diversely select or replace the counterweight structure, whereby one single musical instrument can selectively output different timbre effects according to the requirements of different playing situations.
    Type: Application
    Filed: December 16, 2021
    Publication date: August 4, 2022
    Inventor: HSIN-JUNG LU
  • Patent number: 9941131
    Abstract: A method for applying developer over a semiconductor wafer is provided. The method includes moving a nozzle over the center of the semiconductor wafer. The nozzle extends across the semiconductor wafer. The method also includes rotating the semiconductor wafer by a dispensing rotation angle that is less than 180 degrees. The method further includes dispensing developer over the semiconductor wafer relative to alignment marks formed on the semiconductor wafer while the semiconductor wafer is rotated by the dispensing rotation angle.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: April 10, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Hung Lin, Hsiao-Yi Wang, Yen-Min Liao, Hsin-Jung Lu, Diau-Tang Huang