Patents by Inventor Hsin-Li Lee
Hsin-Li Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955441Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.Type: GrantFiled: March 28, 2022Date of Patent: April 9, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Jian-Hong Lin, Kuo-Yen Liu, Hsin-Chun Chang, Tzu-Li Lee, Yu-Ching Lee, Yih-Ching Wang
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Patent number: 11459230Abstract: A MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, a diaphragm movably disposed between the substrate and the backplate, and a plurality of slots formed on the diaphragm. The slots are spaced apart from each other and have a non-constant width to relieve the residual stress on the diaphragm.Type: GrantFiled: March 31, 2020Date of Patent: October 4, 2022Assignee: FORTEMEDIA, INC.Inventors: Jien-Ming Chen, Feng-Chia Hsu, Wen-Shan Lin, Hsin-Li Lee, Nai-Hao Kuo
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Patent number: 11202153Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, and a diaphragm movably disposed between the substrate and the backplate. The diaphragm includes a plurality of implantation portions, and the implantation portions have different concentration-depth profiles.Type: GrantFiled: July 21, 2020Date of Patent: December 14, 2021Assignee: FORTEMEDIA, INC.Inventors: Jien-Ming Chen, Feng-Chia Hsu, Wen-Shan Lin, Hsin-Li Lee, Nai-Hao Kuo
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Publication number: 20210037320Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, and a diaphragm movably disposed between the substrate and the backplate. The diaphragm includes a plurality of implantation portions, and the implantation portions have different concentration-depth profiles.Type: ApplicationFiled: July 21, 2020Publication date: February 4, 2021Inventors: Jien-Ming CHEN, Feng-Chia HSU, Wen-Shan LIN, Hsin-Li LEE, Nai-Hao KUO
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Publication number: 20200339411Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, a diaphragm movably disposed between the substrate and the backplate, and a plurality of slots formed on the diaphragm. The slots are spaced apart from each other and have a non-constant width to relieve the residual stress on the diaphragm.Type: ApplicationFiled: March 31, 2020Publication date: October 29, 2020Inventors: Jien-Ming CHEN, Feng-Chia HSU, Wen-Shan LIN, Hsin-Li LEE, Nai-Hao KUO
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Patent number: 10694297Abstract: A MEMS microphone package includes a substrate, a transducer, an integrated circuit chip, and a housing. The substrate has a hollow chamber, a first opening and a second opening, wherein the first opening and the second opening communicate with the hollow chamber. The transducer is disposed on the substrate. The integrated circuit chip is disposed on the substrate. The housing is disposed on the substrate, and covers the integrated circuit chip and the transducer.Type: GrantFiled: March 25, 2019Date of Patent: June 23, 2020Assignee: FORTEMEDIA, INC.Inventors: Hsin-Li Lee, Jien-Ming Chen, Wen-Shan Lin, Nai-Hao Kuo, Feng-Chia Hsu
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Publication number: 20190210866Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, a diaphragm, a first insulating protrusion and a plurality of second insulating protrusions. The backplate is disposed on a side of the substrate. The diaphragm is disposed between the substrate and the backplate and is movable relative to the backplate. The first insulating protrusion and the second insulating protrusions are formed on the side of the backplate facing the diaphragm. The first insulating protrusion is connected to and affixed to the diaphragm permanently, and an air gap is formed between the diaphragm and each of the second insulating protrusions.Type: ApplicationFiled: July 2, 2018Publication date: July 11, 2019Inventors: Jien-Ming CHEN, Nai-Hao KUO, Wen-Shan LIN, Hsin-Li LEE
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Patent number: 10343898Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, a diaphragm, a first insulating protrusion and a plurality of second insulating protrusions. The backplate is disposed on a side of the substrate. The diaphragm is disposed between the substrate and the backplate and is movable relative to the backplate. The first insulating protrusion and the second insulating protrusions are formed on the side of the backplate facing the diaphragm. The first insulating protrusion is connected to and affixed to the diaphragm permanently, and an air gap is formed between the diaphragm and each of the second insulating protrusions.Type: GrantFiled: July 2, 2018Date of Patent: July 9, 2019Assignee: FORTEMEDIA, INC.Inventors: Jien-Ming Chen, Nai-Hao Kuo, Wen-Shan Lin, Hsin-Li Lee
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Patent number: 10277969Abstract: A microphone device is provided. The microphone device includes a microphone cover, a circuit board, an integrated circuit, a first acoustic sensor, and a second acoustic sensor. The circuit board is coupled to the microphone cover. The circuit board includes a first acoustic port and a second acoustic port. The integrated circuit is coupled to the microphone cover and the circuit board to form a first chamber and a second chamber. The first acoustic sensor is arranged in the first chamber. The second acoustic sensor is arranged in the second chamber. The integrated circuit is coupled to the first acoustic sensor and the second acoustic sensor.Type: GrantFiled: August 3, 2017Date of Patent: April 30, 2019Assignee: FORTEMEDIA, INC.Inventors: Tsung-Lung Yang, Hsin-Li Lee, Neng-Bin Wan
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Publication number: 20180359551Abstract: A microphone device is provided. The microphone device includes a microphone cover, a circuit board, an integrated circuit, a first acoustic sensor, and a second acoustic sensor. The circuit board is coupled to the microphone cover. The circuit board includes a first acoustic port and a second acoustic port. The integrated circuit is coupled to the microphone cover and the circuit board to form a first chamber and a second chamber. The first acoustic sensor is arranged in the first chamber. The second acoustic sensor is arranged in the second chamber. The integrated circuit is coupled to the first acoustic sensor and the second acoustic sensor.Type: ApplicationFiled: August 3, 2017Publication date: December 13, 2018Inventors: Tsung-Lung YANG, Hsin-Li LEE, Neng-Bin WAN
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Patent number: 9236275Abstract: A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter the MEMS acoustic transducer. The MEMS chip is disposed over the surface of the substrate, including a second opening area and an upper electrode layer partially sealing the second opening area, wherein the upper electrode layer and the lower electrode layer, which are parallel to each other and have a gap therebetween, form an induction capacitor. The housing is disposed over the MEMS chip or the surface of the substrate creating a cavity with the MEMS chip or the substrate. In addition, a method for fabricating the above MEMS acoustic transducer is also provided.Type: GrantFiled: October 26, 2012Date of Patent: January 12, 2016Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Nan Yeh, Chin-Hung Wang, Hsin-Li Lee, Jien-Ming Chen, Tzong-Che Ho, Li-Chi Pan
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Patent number: 9154886Abstract: A capacitive transducer and manufacturing method thereof is provided. A multifunction device including a plurality of the capacitive transducers is also provided, where the capacitive transducers are disposed on a substrate and include at least one microphone and at least one pressure sensor or ultrasonic device.Type: GrantFiled: April 25, 2012Date of Patent: October 6, 2015Assignee: Industrial Technology Research InstituteInventors: Jien-Ming Chen, Chin-Wen Huang, Chin-Hung Wang, Hsin-Li Lee
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Patent number: 8508022Abstract: An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.Type: GrantFiled: July 14, 2008Date of Patent: August 13, 2013Assignee: Industrial Technology Research InstituteInventors: Tzong-Che Ho, Jason Pan, Pin Chang, Chin-Horng Wang, Jung-Tai Chen, Hsin-Li Lee, Kai-Hsiang Yen
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Publication number: 20130160554Abstract: A capacitive transducer and manufacturing method thereof is provided. A multifunction device including a plurality of the capacitive transducers is also provided, where the capacitive transducers are disposed on a substrate and include at least one microphone and at least one pressure sensor or ultrasonic device.Type: ApplicationFiled: April 25, 2012Publication date: June 27, 2013Applicant: Industrial Technology Research InstituteInventors: Jien-Ming Chen, Chin-Wen Huang, Chin-Hung Wang, Hsin-Li Lee
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Patent number: 8218797Abstract: A micro-speaker and a manufacturing method thereof are provided. The micro-speaker has a sandwich structure. The micro-speaker includes two piezoelectric material layers and a diaphragm disposed between the two piezoelectric material layers, where the piezoelectric material layers have a ring-shaped structure. The problem of insufficient sound pressure at low frequency is resolved, and the flexibility of the micro-speaker is improved.Type: GrantFiled: April 28, 2009Date of Patent: July 10, 2012Assignee: Industrial Technology Research InstituteInventors: Hsin-Li Lee, Chin-Horng Wang, Cheng-Hsin Chuang, Jin-Yao Lai
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Publication number: 20120146163Abstract: A microphone package structure is provided, including an integrated circuit (IC) structure and a microphone structure disposed thereover and electrically connected therewith. The IC structure includes a first semiconductor substrate with opposite first and second surfaces, and a first through hole disposed in and through the first semiconductor substrate. The microphone structure includes: a second semiconductor substrate with opposite third and fourth surfaces, wherein the third surface faces to the second surface of the first semiconductor substrate; a second through hole disposed in and through the second semiconductor substrate; an acoustic sensing device embedded in the second through hole and adjacent to the third surface; and a sealing layer disposed over the fourth surface of the second semiconductor substrate, defining a back chamber with the sealing layer, wherein the first through hole allows acoustic pressure waves to penetrate and pass therethrough to the acoustic sensing device.Type: ApplicationFiled: August 9, 2011Publication date: June 14, 2012Applicant: Industrial Technology Research InstituteInventors: Tzong-Che Ho, Chin-Fu Kuo, Hsin-Li Lee, Yao-Jung Lee, Li-Chi Pan
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Publication number: 20100166214Abstract: An electronic apparatus at least including an audio-receiving circuit is provided. The audio-receiving circuit includes an audio receiver and a processor. The audio receiver receives a sound wave from a sound source, and generates a first audio signal containing a plurality of noises to the processor. The processor performs a signal processing of time reversal to the first audio signal to restore a sound sent at an original sound source, so as to filter noises in the first audio signal and output a second audio signal.Type: ApplicationFiled: June 9, 2009Publication date: July 1, 2010Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, NCKU RESEARCH & DEVELOPMENT FOUNDATIONInventors: Hsin-Li Lee, Gee-Pinn Too, Yu-Hao Hsieh, Chih-Hao Chou, Bo-Hsien Wu
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Publication number: 20100150381Abstract: A micro-speaker and a manufacturing method thereof are provided. The micro-speaker has a sandwich structure. The micro-speaker includes two piezoelectric material layers and a diaphragm disposed between the two piezoelectric material layers, where the piezoelectric material layers have a ring-shaped structure. The problem of insufficient sound pressure at low frequency is resolved, and the flexibility of the micro-speaker is improved.Type: ApplicationFiled: April 28, 2009Publication date: June 17, 2010Applicant: Industrial Technology Research InstituteInventors: Hsin-Li Lee, Chin-Horng Wang, Cheng-Hsin Chuang, Jin-Yao Lai
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Publication number: 20090161901Abstract: An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.Type: ApplicationFiled: July 14, 2008Publication date: June 25, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Tzong-Che Ho, Jason Pan, Pin Chang, Chin-Horng Wang, Jung-Tai Chen, Hsin-Li Lee, Kai-Hsiang Yen
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Patent number: 6856003Abstract: A microelectronic 3-dimensional solenoid of substantially circular or oval cross-section and a method for fabricating the solenoid. The solenoid is provided including a pre-processed semiconductor substrate, two supports upstanding from and spaced-apart on a top surface of the substrate, each support has a bottom end attached to the substrate. An inductor coil which has two spaced-apart ends each attached to one of two top ends of the two supports. The inductor coil is formed of a bi-layer metal laminate that has an inner metal layer and an outer metal layer. The outer metal layer is formed of a first metal that has a coefficient of thermal expansion larger than a coefficient of thermal expansion of a second metal that forms the inner metal layer.Type: GrantFiled: September 5, 2002Date of Patent: February 15, 2005Assignee: Industrial Technology Research InstituteInventors: Hsin-Li Lee, Cheng-Hong Lee, Yi-Shiau Chen