Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.

Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: In a mobile cellular network, a mobile network operator (MNO) or other entity can specify whether a user equipment (UE) is to utilize either a concealed identifier (e.g., a subscription concealed identifier (SUCI)) calculated by a universal subscriber identity module (USIM) of a universal integrated circuit card (UICC) or a concealed identifier calculated by mobile equipment (ME) of the UE that is separate from the UICC and USIM. In the event that a USIM-calculated concealed identifier is specified for use but the USIM fails in generation of a concealed identifier, the UE can utilize one or more failure recovery procedures to attempt completion of attachment of the UE to the same network or a different network to help ensure that the UE does not remain attached to a network without access to services of the network due to authentication failure.

Abstract: An audio output device includes a processor, an audio decoder, an audio amplifier, and a protection circuit. The processor outputs an audio digital signal. The audio decoder converts the audio digital signal into an audio analog signal. The audio amplifier amplifies the audio analog signal. The protection circuit detects abnormalities in the audio digital signal or the amplified audio analog signal. When the audio digital signal or the amplified audio analog signal is abnormal, the protection circuit outputs a disable signal to turn off or mute the audio amplifier, or the protection circuit outputs a logic signal to notify the processor, so that the processor outputs the disable signal to turn off or mute the audio amplifier.

Abstract: A touch display panel is provided. The touch display panel includes: a display panel, a touch glass, and a touch controller. The display panel includes sensing lines and identification pins. The touch controller obtains first product information of the touch glass. The touch controller and the display panel respectively report the first product information of the touch glass and second product information of the display panel to a host. The host retrieves firmware and a default noise offset value corresponding to the touch display panel according to the first product information and the second product information, and writes the firmware and default noise offset value to a non-volatile memory of the touch display panel. The touch controller executes the firmware, and determines touch actions performed on the touch glass according to the default noise offset value.

Abstract: A touch display panel is provided. The touch display panel includes: a display panel, a touch glass, and a touch controller. The display panel includes sensing lines and identification pins. The touch controller obtains first product information of the touch glass. The touch controller and the display panel respectively report the first product information of the touch glass and second product information of the display panel to a host. The host retrieves firmware and a default noise offset value corresponding to the touch display panel according to the first product information and the second product information, and writes the firmware and default noise offset value to a non-volatile memory of the touch display panel. The touch controller executes the firmware, and determines touch actions performed on the touch glass according to the default noise offset value.

Abstract: An illuminance calibrating device includes a reference light source and an illuminance detection device. The reference light source, which generates light with a specific wavelength and a source illuminance, adjusts the source illuminance to be a first illuminance according to a control signal. The illuminance detection device includes a shading plate, an illuminance detector, and a controller. The shading plate is configured to lower the first illuminance to a first shading illuminance. The illuminance detector detects the first shading illuminance to generate a detection signal. The controller generates the control signal and calculates a ratio of the first illuminance to the first shading illuminance according to the detection signal.

Abstract: An illuminance calibrating device includes a reference light source and an illuminance detection device. The reference light source, which generates light with a specific wavelength and a source illuminance, adjusts the source illuminance to be a first illuminance according to a control signal. The illuminance detection device includes a shading plate, an illuminance detector, and a controller. The shading plate is configured to lower the first illuminance to a first shading illuminance. The illuminance detector detects the first shading illuminance to generate a detection signal. The controller generates the control signal and calculates a ratio of the first illuminance to the first shading illuminance according to the detection signal.

Abstract: An integrated packaging structure is provided. In the package structure, an integrated component body has a first source region, a second source region, a first setting region, and a second setting region, which are separated from each other. A first MOSFET die and a second MOSFET die are located on the first setting region and the second setting region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed from the top surface and spaced apart from each other. A first source connection element is connected to the source electrode pad of the first MOSFET die and the first source region. A second source connection element is connected to the source electrode pad of the second MOSFET die and the second source region. A gate connection element is connected to the gate electrode pad and a gate region of the integrated component body.

Abstract: A common-source type package structure is provided in the present invention. In the package structure, an integrated component body is configured a common-source pin region, a first arrangement region and a second arrangement region. The second and first arrangement regions are spaced apart from each other. A first MOSFET die and a second MOSFET are respectively located at the first and second arrangement region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed to the top surface and spaced apart from each other. A common-source connection element is connected to the source electrode pad and the common-source pin region. A gate connection element is connected to the gate electrode pad and a gate pin region of the integrated component body.

Abstract: An integrated packaging structure is provided. In the package structure, an integrated component body has a first source region, a second source region, a first setting region, and a second setting region, which are separated from each other. A first MOSFET die and a second MOSFET die are located on the first setting region and the second setting region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed from the top surface and spaced apart from each other. A first source connection element is connected to the source electrode pad of the first MOSFET die and the first source region. A second source connection element is connected to the source electrode pad of the second MOSFET die and the second source region. A gate connection element is connected to the gate electrode pad and a gate region of the integrated component body.

Abstract: A common-source type package structure is provided in the present invention. In the package structure, an integrated component body is configured a common-source pin region, a first arrangement region and a second arrangement region. The second and first arrangement regions are spaced apart from each other. A first MOSFET die and a second MOSFET are respectively located at the first and second arrangement region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed to the top surface and spaced apart from each other. A common-source connection element is connected to the source electrode pad and the common-source pin region. A gate connection element is connected to the gate electrode pad and a gate pin region of the integrated component body.

Abstract: A common-source type package structure is provided in the present invention. In the package structure, an integrated component body is configured a common-source pin region, a first arrangement region and a second arrangement region. The second and first arrangement regions are spaced apart from each other. A first MOSFET die and a second MOSFET are respectively located at the first and second arrangement region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed to the top surface and spaced apart from each other. A common-source connection element is connected to the source electrode pad and the common-source pin region. A gate connection element is connected to the gate electrode pad and a gate pin region of the integrated component body.

Abstract: A common-source type package structure is provided in the present invention. In the package structure, an integrated component body is configured a common-source pin region, a first arrangement region and a second arrangement region. The second and first arrangement regions are spaced apart from each other. A first MOSFET die and a second MOSFET are respectively located at the first and second arrangement region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed to the top surface and spaced apart from each other. A common-source connection element is connected to the source electrode pad and the common-source pin region. A gate connection element is connected to the gate electrode pad and a gate pin region of the integrated component body.

Abstract: A computer stick docking system and a power management method thereof are provided. The computer stick docking system includes a docking station and a computer stick device. The docking station is configured to receive a display device and a computer stick device, including a docking battery and a docking HDMI interface circuit. The computer stick device includes a computer-stick controller and a computer-stick HDMI interface circuit. The computer-stick controller is configured to load an operating system. The computer-stick HDMI interface circuit, coupled to the computer-stick controller, is configured to request battery power information of the docking battery from the docking station after it is powered on and the computer-stick HDMI interface circuit is connected to the docking station.

Abstract: A sensor system is provided. The sensor system includes a control device and a sensor device. The control device has an audio combo jack and selectively provides an audio signal to the audio combo jack. The sensor device is connected with the audio combo jack. The sensor device includes a transformer, a rectifier, a power supply circuit, and a sensor. The transformer receives the audio signal through the audio combo jack and amplifies the audio signal to generate an amplified audio signal. The rectifier, coupled to the transformer, receives the amplified audio signal and rectifies the amplified audio signal to generate a rectified voltage signal. The power supply circuit is controlled by the rectified voltage signal to provide a supply voltage. The sensor is powered by the supply voltage to perform a sensing operation. An output signal which carries information related the sensing operation is generated.

Abstract: A computer stick docking system and a power management method thereof are provided. The computer stick docking system includes a docking station and a computer stick device. The docking station is configured to receive a display device and a computer stick device, including a docking battery and a docking HDMI interface circuit. The computer stick device includes a computer-stick controller and a computer-stick HDMI interface circuit. The computer-stick controller is configured to load an operating system. The computer-stick HDMI interface circuit, coupled to the computer-stick controller, is configured to request battery power information of the docking battery from the docking station after it is powered on and the computer-stick HDMI interface circuit is connected to the docking station.