Patents by Inventor Hsin Lu

Hsin Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155721
    Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. The UE initiates a mobile originated (MO) procedure for modifying an Evolved Packet System (EPS) bearer to release all traffic flows associated with the EPS bearer. The UE receives a request to initiate a mobile terminated (MT) procedure for modifying the EPS bearer. The UE, in response to receiving the request, aborts the MO procedure. The UE locally deactivates the EPS bearer.
    Type: Application
    Filed: October 23, 2023
    Publication date: May 9, 2024
    Inventors: Yu-Hsin Lin, Po-Kuang Lu, YUAN-CHIEH LIN
  • Publication number: 20240142732
    Abstract: A method includes forming a first waveguide over a substrate; forming a first layer of low-dimensional material on the first waveguide; forming a first layer of dielectric material over the first layer of low-dimensional material; forming a second layer of low dimensional material on the first layer of dielectric material; and forming a first conductive contact that electrically contacts the first layer of low-dimensional material and a second conductive contact that electrically contacts the second layer of low-dimensional material.
    Type: Application
    Filed: January 6, 2023
    Publication date: May 2, 2024
    Inventors: Chih-Hsin Lu, Chin-Her Chien, Chung-Hao Tsai, Chuei-Tang Wang, Chen-Hua Yu
  • Patent number: 11967546
    Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen, Szu-Wei Lu, Ying-Ching Shih, Wen-Chih Chiou, Chi-Hsi Wu, Chen-Hua Yu
  • Publication number: 20240129632
    Abstract: A wafer position status inspection apparatus includes a wafer transportation device, a robotic arm rotatably mounted on the wafer transportation device, an image capture device arranged on the robotic arm, a light flashing device arranged at one side of the image capture device, and a status inspection section in information connection with the image capture device. An image capturing direction of the image capture device is set consistent with a gripping direction of the robotic arm, and a light projecting direction of the light flashing device is consistent with the image capturing direction. The light flashing device projects light on a wafer to generate a light-reflecting contour, which is captured by the image capture device to form a wafer contour image based on which the status inspection section acquires a wafer deposition status to identify various wafer statuses including incline, overlap, absence, and warp.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 18, 2024
    Inventors: Yu-Hsin Liu, Cheng-Hsiang Lu, Daisuke Sasaki
  • Patent number: 11961891
    Abstract: A semiconductor device includes a channel component of a transistor and a gate component disposed over the channel component. The gate component includes: a dielectric layer, a first work function metal layer disposed over the dielectric layer, a fill-metal layer disposed over the first work function metal layer, and a second work function metal layer disposed over the fill-metal layer.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Ru-Shang Hsiao, Ching-Hwanq Su, Pohan Kung, Ying Hsin Lu, I-Shan Huang
  • Patent number: 11952676
    Abstract: A silicon carbide crystal includes a seed layer, a bulk layer and a stress buffering structure formed between the seed layer and the bulk layer. The seed layer, the bulk layer and the stress buffering structure are each formed with a dopant that cycles between high and low dopant concentration. The stress buffering structure includes a plurality of stacked buffer layers and a transition layer over the buffer layers. The buffer layer closest to the seed layer has the same variation trend of the dopant concentration as the buffer layer closest to the transition layer, and the dopant concentration of the transition layer is equal to the dopant concentration of the seed layer.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: April 9, 2024
    Assignee: GLOBALWAFERS CO., LTD.
    Inventors: Ching-Shan Lin, Jian-Hsin Lu, Chien-Cheng Liou, Man-Hsuan Lin
  • Patent number: 11949000
    Abstract: A method includes forming a dummy gate stack over a fin protruding from a semiconductor substrate, forming gate spacers on sidewalls of the dummy gate stack, forming source/features over portions of the fin, forming a gate trench between the gate spacers, which includes trimming top portions of the gate spacers to form a funnel-like opening in the gate trench, and forming a metal gate structure in the gate trench. A semiconductor structure includes a fin protruding from a substrate, a metal gate structure disposed over the fin, gate spacers disposed on sidewalls of the metal gate structure, where a top surface of each gate spacer is angled toward the semiconductor fin, a dielectric layer disposed over the top surface of each gate spacer, and a conductive feature disposed between the gate spacers to contact the metal gate structure, where sidewalls of the conductive feature contact the dielectric layer.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ru-Shang Hsiao, Ching-Hwanq Su, Pin Chia Su, Ying Hsin Lu, I-Shan Huang
  • Publication number: 20240107414
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for switching a secondary cell to a primary cell. A user equipment (UE) monitors a first radio condition of the UE for beams of a primary cell and a second radio condition for beams of one or more secondary cells configured for the UE in carrier aggregation. The UE transmits a request to configure a candidate beam of at least one candidate secondary cell as a new primary cell in response to the first radio condition not satisfying a first threshold and the second radio condition for the at least one candidate secondary cell satisfying a second threshold. A base station determines to reconfigure at least one secondary cell as the new primary cell. The base station and the UE perform a handover of the UE to the new primary cell.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 28, 2024
    Inventors: Yu-Chieh HUANG, Kuhn-Chang LIN, Jen-Chun CHANG, Wen-Hsin HSIA, Chia-Jou LU, Sheng-Chih WANG, Chenghsin LIN, Yeong Leong CHOO, Chun-Hsiang CHIU, Chihhung HSIEH, Kai-Chun CHENG, Chung Wei LIN
  • Patent number: 11935830
    Abstract: An integrated circuit includes multiple backside conductive layers disposed over a backside of a substrate. The multiple backside conductive layers each includes conductive segments. The conductive segments in at least one of the backside conductive layers are configured to transmit one or more power signals. The conductive segments of the multiple backside conductive layers cover select areas of the backside of the substrate, thereby leaving other areas of the backside of the substrate exposed.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Te-Hsin Chiu, Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng, Jiun-Wei Lu
  • Patent number: 11931187
    Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 19, 2024
    Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung University
    Inventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20240073378
    Abstract: A projection apparatus including a light source module, an eccentric-collimating lens, a prism lens group, a light valve and a projection lens is provided. The light source module is configured to provide an illumination light beam. The eccentric-collimating lens is disposed between the light sources and the light valve on a transmission path of the illumination light beam. The light valve is configured to convert the illumination light beam into an image light beam. The projection lens is configured to project the image light beam out of the projection apparatus. A first included angle between a first transmission direction of the illumination light beam incident on the eccentric-collimating lens and a central axis of the eccentric-collimating lens is greater than 0. The first transmission direction and a second transmission direction of the image beam exiting from the light valve are perpendicular to each other.
    Type: Application
    Filed: August 24, 2023
    Publication date: February 29, 2024
    Applicant: Coretronic Corporation
    Inventors: Chun-Hsin Lu, Jen-Wei Kuo, Wen-Chieh Chung
  • Publication number: 20240069425
    Abstract: An illumination system including two light source modules, two light guiding modules, a first reflector, and a light homogenization element is provided. The two light guiding modules are respectively disposed on transmission paths of light beams generated by the two light source modules to generate two guiding light beams. One of the guiding light beams is reflected to the light homogenization element by the first reflector. The other of the guiding light beams is directly transmitted to the light homogenization element. The guiding light beams are emitted from the light homogenization element and form an illumination light beam. A projection apparatus is also provided.
    Type: Application
    Filed: August 24, 2023
    Publication date: February 29, 2024
    Applicant: Coretronic Corporation
    Inventors: Chun-Hsin Lu, Jen-Wei Kuo, Wen-Chieh Chung
  • Patent number: 11914277
    Abstract: An illumination system for providing an illumination beam includes red, blue, and green light source modules, a first light combining element, and a light uniforming element. The red light source module includes a first red light emitting element emitting first red light and a second red light emitting element emitting second red light. A peak wavelength of the second red light is greater than a peak wavelength of the first red light. The blue light source module includes a first blue light emitting element emitting first blue light and a second blue light emitting element emitting second blue light. A peak wavelength of the second blue light is less than a peak wavelength of the first blue light. The green light source module generates green light. The first light combining element guides these lights into the light uniforming element, so that the illumination system outputs the illumination beam.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: February 27, 2024
    Assignee: Coretronic Corporation
    Inventors: Hung-Yu Lin, Chi-Fu Liu, Chun-Hsin Lu, Chun-Li Chen
  • Publication number: 20240063160
    Abstract: A semiconductor package structure and a manufacturing method thereof is provided. The semiconductor package includes a first semiconductor die, including a semiconductor substrate and a first interconnect structure disposed on the semiconductor substrate; a second semiconductor die disposed on and electrically connected to the first semiconductor die, including a second semiconductor substrate and a second interconnect structure; a third interconnect structure, where in the second interconnect structure and the third interconnect structure are disposed on opposite sides of the second semiconductor substrate, and wherein the second interconnect structure is between the first interconnect structure and the third interconnect structure.
    Type: Application
    Filed: August 21, 2022
    Publication date: February 22, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsin Lu, Chung-Hao Tsai, Chuei-Tang WANG, Chen-Hua Yu
  • Publication number: 20240003025
    Abstract: A modified electrode, manufacturing method thereof and use thereof are provided. The manufacturing method includes steps of soaking a copper substrate in a solution to obtain a BiOI/copper(I) iodide, BiOI/copper(I) iodide/metallic bismuth, and copper(I) iodide/metallic bismuth composite modified electrodes by electroless plating method. The obtained electrodes, designated as bismuth-based modified electrode, can be used for the electrohydrodimerization of acrylonitrile to synthesize adiponitrile.
    Type: Application
    Filed: September 22, 2022
    Publication date: January 4, 2024
    Applicant: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Chia-yu Lin, Chia-sheng Su, Chia-hui Yen, Shih-ching Huang, Wei-hsin Lu
  • Publication number: 20230410536
    Abstract: A method of retrieving a map includes receiving a grid data of the map comprising lane segments, wherein the grid data includes an array of grids each associated with a list including none or at least one of the lane segments intersecting the respective grid; receiving coordinates of a location; identifying a first grid including the location based on the grid data; identifying a target grid that has an associated list including at least one of the lane segments as first lane segment; and outputting the first lane segment.
    Type: Application
    Filed: July 27, 2023
    Publication date: December 21, 2023
    Inventors: Minhao JIANG, Hsin LU, Genmao SHI, Ziqi LIU
  • Publication number: 20230387230
    Abstract: A semiconductor device includes a channel component of a transistor and a gate component disposed over the channel component. The gate component includes: a dielectric layer, a first work function metal layer disposed over the dielectric layer, a fill-metal layer disposed over the first work function metal layer, and a second work function metal layer disposed over the fill-metal layer.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Inventors: Ru-Shang Hsiao, Ching-Hwanq Su, Pohan Kung, Ying Hsin Lu, I-Shan Huang
  • Patent number: 11782310
    Abstract: A display system includes a light source configured to emit light from a light exit surface, the emitted light having an emitted wavelength. An optical filter is disposed on the light exit surface of the light source. One or more light converting films are disposed between the optical filter and the light exit surface of the light source. The one or more light converting films are configured to receive the emitted light from the light source and convert at least portions of the received emitted light to blue, green, and red lights having respective blue, green and red wavelengths. For a substantially normally incident light and for at least an in-plane first polarization state, the optical filter reflects more than about 80% of the incident light having the emitted wavelength, and transmits greater than about 60% of the incident light for each of the blue, green and red wavelengths.
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: October 10, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Yu Hsin Lu, Gary T. Boyd, Matthew B. Johnson, Ryan T. Fabick, Carl A. Stover, Adam D. Haag
  • Patent number: D1009049
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: December 26, 2023
    Assignee: Kingston Digital, Inc.
    Inventor: Hui-Hsin Lu