Abstract: An apparatus for producing silicon carbide crystal is provided and includes a composite structure formed by a plurality of graphite layers and silicon carbide seed crystals, wherein a density or thickness of each layer of graphite is gradually adjusted to reduce a difference of a thermal expansion coefficient and Young's modulus between the graphite layers and silicon carbide. The composite structure can be stabilized on a top portion or an upper cover of a crucible made of graphite, thereby preventing the silicon carbide crystal from falling off.

Abstract: A neural network (NN) processing method is provided. An AI (artificial intelligence) compiler code of an AI compiler is transformed to a garbled circuit code by performing following steps. A circuit graph of a garbled circuit having logic gates corresponding to the garbled circuit code is sent to an electrical device by a server. Key codebooks for candidate gates corresponding to each logic gate are creating by the electrical device. Garbled truth tables for the candidate gates corresponding to each logic pate are generated and transmitted to the server by the electrical device through using OT (Oblivious Transfer) protocol. A target garbled truth table of each logic gate is generated by the server. Afterward, an NN model is encrypted according to the key codebooks by the electrical device and a compiled NN model of an encrypted NN model are generated by the server.

Abstract: An electrically connecting assembly has a probe card and a conductive rubber sheet. The probe card has multiple probes. Each of the probes has a first contact end and an inclined guiding segment inclined to a same direction. The conductive rubber sheet is mounted on the probe card, is located in a side of the probe card having the inclined guiding segment, and has a rubber sheet body and multiple wires distributed in the rubber sheet body. The first contact end of each of the probes is capable of contacting a group of the wires. The inclined guiding segment of each of the probes is capable of guiding a direction for the group of the wires to be squeezed and deformed. The electrically connecting assembly prevents the probes from directly abutting the test object to reduce the replacement frequency.

Abstract: An image classification system includes a storage device, a computing device and a first processing device. The storage device stores a plurality of pseudo-centroid datasets, wherein the pseudo-centroid datasets correspond to a plurality of units of first image dataset, and the number of pseudo-centroid data points of each of the pseudo-centroid datasets is much smaller than the number of data points of each of the units of first image dataset. The computing device receives the second image data and computes a plurality of feature values of the second image data. The first processing device receives the feature values and the pseudo-centroid datasets, and compares the feature values with the pseudo-centroid data points to identify and classify the second image data.

Abstract: An image classification system includes a storage device, a computing device and a first processing device. The storage device stores a plurality of pseudo-centroid datasets, wherein the pseudo-centroid datasets correspond to a plurality of units of first image dataset, and the number of pseudo-centroid data points of each of the pseudo-centroid datasets is much smaller than the number of data points of each of the units of first image dataset. The computing device receives the second image data and computes a plurality of feature values of the second image data. The first processing device receives the feature values and the pseudo-centroid datasets, and compares the feature values with the pseudo-centroid data points to identify and classify the second image data.

Abstract: A circuit adapter board has a film circuit board, a spring probe assembly, a space, and a filler. The film circuit board has a film body and multiple conductors. The film body has multiple first contacts and multiple second contacts. A density of distribution of the second contacts is higher than a density of distribution of the first contacts. The conductors are respectively connected to the first contacts. The spring probe assembly is disposed out of the first outer layer and has a plate and multiple spring probes. The spring probes are respectively disposed in the plate. Each spring probe has a base, a connecting portion, and a contacting portion being retractable. The space is formed between the film body of the film circuit board and the plate. The filler is disposed between the film body and the plate.

Abstract: A circuit adapter board has a film circuit board, a spring probe assembly, a space, and a filler. The film circuit board has a film body and multiple conductors. The film body has multiple first contacts and multiple second contacts. A density of distribution of the second contacts is higher than a density of distribution of the first contacts. The conductors are respectively connected to the first contacts. The spring probe assembly is disposed out of the first outer layer and has a plate and multiple spring probes. The spring probes are respectively disposed in the plate. Each spring probe has a base, a connecting portion, and a contacting portion being retractable. The space is formed between the film body of the film circuit board and the plate. The filler is disposed between the film body and the plate.

Abstract: A probe connector assembly includes a carrier plate, multiple probes and multiple positioning members. The multiple probes are mounted into multiple probe holes of the carrier plate. Each positioning member is securely mounted into the carrier plate and partially protrudes into corresponding probe holes to contact probe trunks of corresponding probes, such that the probe trunk of each probe is positioned in a corresponding probe hole of the carrier plate by friction resistance generated between the probe trunk and positioning members adjacent to the probe trunk. Thus, the probe connector assembly is advantageous in a simplified structure of the carrier plate and reduced thickness of the carrier plate and probe length.

Abstract: A conductive adhesive having multiple curved lead wires therein serves as an electrical contact medium between an object to be tested and a test system or between objects to be connected. The conductive adhesive has a resilient body and multiple lead wires dispersedly mounted in the resilient body, extending from a bottom surface to a top surface of the resilient body, and being curved. A direction determined by two end points of each lead wire is perpendicular to the top surface of the resilient body. Attributable to a bendable nature of the lead wires, the pressing force during a pressing test and electrical connection can be reduced. The sideslip occurring on a bottom end of each lead wire can be also lessened so that the stability of the test and connection can be enhanced and an effective vertical operating stroke range is increased to facilitate various IC tests and electrical connection devices.