Patents by Inventor Hsin-Min Chen

Hsin-Min Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128531
    Abstract: The present disclosure discloses a method for recycling all types of lithium batteries. First, the lithium battery waste is acid-leached to obtain a solution containing most of metal ions. After filtering, the solution is separated from the remaining solids, and then the obtained solution is subjected to separate precipitation many times. After separately adjusting the pH value of the solution many times, adding precipitants with a high selectivity ratio, and matching with filtration and separation reaction, all ions in the lithium battery waste are sequentially precipitated in forms of iron phosphate (FePO4), aluminum hydroxide (Al(OH)3), manganese oxide (MnO2), dicobalt trioxide (cobalt oxide, Co2O3), nickel hydroxide (Ni(OH)2), and lithium carbonate (Li2CO3).
    Type: Application
    Filed: September 24, 2023
    Publication date: April 18, 2024
    Applicant: Cleanaway Company Limited
    Inventors: CHIH-HUANG LAI, HSIN-FANG CHANG, TZU-MIN CHENG, YUNG-FA YANG, TSUNG-TIEN CHEN, ZHENG-YU CHENG, CHI-YUNG CHANG
  • Publication number: 20240128106
    Abstract: The invention discloses a container for a non-rectangular reticle, adapted for accommodating an elliptical reticle, and including a cover and a base which are configured to define an elliptical space when engaged with each other. The cover and the base have reticle retainers and reticle supports, respectively, which are configured to securely hold the elliptical reticle.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 18, 2024
    Inventors: Ming-Chien CHIU, Chia-Ho CHUANG, Hsin-Min HSUEH, Yu-Ruei CHEN
  • Publication number: 20240071888
    Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.
    Type: Application
    Filed: August 28, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Chang Lin, Yen-Fu Su, Chin-Liang Chen, Wei-Yu Chen, Hsin-Yu Pan, Yu-Min Liang, Hao-Cheng Hou, Chi-Yang Yu
  • Patent number: 8138425
    Abstract: A touch panel and a fabricating method thereof are provided. The touch panel includes: a substrate; a first conductive layer configured on the substrate and having a first and a second portions; an insulating layer covering the first portion; and a second conductive layer having a third portion configured on the second portion, and a fourth portion configured on the insulating layer and being separate from the third portion. The fabricating method includes the steps of: providing a first conductive layer; forming an insulating layer partially covering the first conductive layer; and forming a second conductive layer having a first pattern coupled to the first conductive layer and a second pattern insulated from the first pattern on the insulating layer.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: March 20, 2012
    Assignee: Arima Display Corporation
    Inventors: Chi-Chen Lee, Fu-Chen Huang, Hsin-Min Chen, Shih-Min Wu
  • Publication number: 20110005818
    Abstract: A touch panel and a fabricating method thereof are provided. The touch panel includes: a substrate; a first conductive layer configured on the substrate and having a first and a second portions; an insulating layer covering the first portion; and a second conductive layer having a third portion configured on the second portion, and a fourth portion configured on the insulating layer and being separate from the third portion. The fabricating method includes the steps of: providing a first conductive layer; forming an insulating layer partially covering the first conductive layer; and forming a second conductive layer having a first pattern coupled to the first conductive layer and a second pattern insulated from the first pattern on the insulating layer.
    Type: Application
    Filed: December 15, 2009
    Publication date: January 13, 2011
    Applicant: ARIMA DISPLAY CORPORATION
    Inventors: Chi-Chen LEE, Fu-Chen HUANG, Hsin-Min CHEN, Shih-Min WU
  • Publication number: 20100102468
    Abstract: A method for manufacturing an environment-friendly composite material, using polyolefin particles and powder rubber that are made from reclaimed plastic and reclaimed rubber as a raw material, comprises the steps of: powder rubber surface treatment: using interface treatment coupling agent to perform a powder rubber surface treatment to improve the compatibility between the polyolefin particles and the powder rubber; additive treatment: adding the selected additive according to the desired function; blending: melt-blending the polyolefin particles and the powder rubber evenly; extrusion granulating: granulating the evenly-blended polyolefin grain and powder rubber by means of extrusion using a processing machine so as to form the granulated raw material, which has a wide application range and is environment-friendly.
    Type: Application
    Filed: October 27, 2008
    Publication date: April 29, 2010
    Inventor: HSIN-MIN CHEN
  • Patent number: 7401997
    Abstract: A protruding road warning device includes a base plate, at least one mounting spike, a cushioned pad and at least one reflector. The base plate has a bottom surface, a top surface and a breakable segment. The bottom surface has multiple fastening recesses, at least one groove and at least one connecting surface. The at least one groove is defined in the bottom surface. The at least one connecting surface corresponds to and is formed respectively inside the at least one groove. The at least one break segment is formed respectively between the at least one groove and the top surface. The at least one mounting spike is connected respectively to the at least one connecting surface on the bottom surface. The cushioned pad is mounted on the top surface of the base plate. The at least one reflector is mounted on the cushioned pad.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: July 22, 2008
    Inventor: Hsin-Min Chen