Abstract: A package for a MEMS microphone includes a cover, a substrate connected with the cover to define with the cover an accommodation chamber and having a channel in communication between the accommodation chamber and the space outside the cover, and a single chip disposed in the accommodation chamber and electrically connected with the substrate and corresponding to the channel of the substrate. Thus, an acoustic single can enter the accommodation chamber to reach the single chip through the channel for minimizing the dimensions of the package of the present invention.