Patents by Inventor Hsin-Ting Lin
Hsin-Ting Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240178102Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.Type: ApplicationFiled: April 21, 2023Publication date: May 30, 2024Inventors: Chun-Ti LU, Hao-Yi TSAI, Chiahung LIU, Ken-Yu CHANG, Tzuan-Horng LIU, Chih-Hao CHANG, Bo-Jiun LIN, Shih-Wei CHEN, Pei-Rong NI, Hsin-Wei HUANG, Zheng GangTsai, Tai-You LIU, Steve SHIH, Yu-Ting HUANG, Steven SONG, Yu-Ching WANG, Tsung-Yuan YU, Hung-Yi KUO, CHung-Shi LIU, Tsung-Hsien CHIANG, Ming Hung TSENG, Yen-Liang LIN, Tzu-Sung HUANG, Chun-Chih CHUANG
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Publication number: 20240162220Abstract: A capacitor on a fin structure includes a fin structure. A dielectric layer covers the fin structure. A first electrode extension is embedded within the fin structure. A first electrode penetrates the dielectric layer and contacts the first electrode extension. A second electrode and a capacitor dielectric layer are disposed within the dielectric layer. The capacitor dielectric layer surrounds the second electrode, and the capacitor dielectric layer is between the second electrode and the first electrode extension.Type: ApplicationFiled: December 8, 2022Publication date: May 16, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Hsin-Yu Chen, Chun-Hao Lin, Yuan-Ting Chuang, Shou-Wei Hsieh
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Patent number: 11942750Abstract: A laser inspection system is provided. A laser source emits a laser with a first spectrum and the laser is transmitted by a first optical fiber. A gain optical fiber doped with special ions is connected to the first optical fiber, and a light detector is provided around the gain optical fiber. When the laser with the first spectrum passes through the gain optical fiber, the gain optical fiber absorbs part of the energy level of the laser with the first spectrum, so that the laser with the first spectrum is converted to generate light with a second spectrum based on the frequency conversion phenomenon. The light detector detects the intensity of the light with the second spectrum, so that the power of the laser source can be obtained.Type: GrantFiled: November 23, 2020Date of Patent: March 26, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yi-Chi Lee, Hsin-Chia Su, Shih-Ting Lin, Yu-Cheng Song, Fu-Shun Ho, Chih-Chun Chen
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Publication number: 20240096781Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.Type: ApplicationFiled: March 20, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
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Patent number: 11877382Abstract: An immersion cooling system miniaturized by the omission of a pump and heat exchanger includes a first casing for containing a non-conductive coolant in which a heat-generating component is immersed, fins disposed on and located outside the first casing, and a second casing. The first casing is disposed in the second casing, and the second casing defines a first vent hole exposing the fins. The immersion cooling system dissipates heat by means of natural convection.Type: GrantFiled: August 22, 2022Date of Patent: January 16, 2024Assignee: Shenzhen Fulian Fugui Precision Industry Co., Ltd.Inventors: Jia-Hong Wu, Li-Wen Guo, Hsin-Ting Lin
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Publication number: 20230240041Abstract: An immersion cooling system miniaturized by the omission of a pump and heat exchanger includes a first casing for containing a non-conductive coolant in which a heat-generating component is immersed, fins disposed on and located outside the first casing, and a second casing. The first casing is disposed in the second casing, and the second casing defines a first vent hole exposing the fins. The immersion cooling system dissipates heat by means of natural convection.Type: ApplicationFiled: August 22, 2022Publication date: July 27, 2023Inventors: JIA-HONG WU, LI-WEN GUO, HSIN-TING LIN
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Patent number: 11706901Abstract: An immersion cooling system includes a first casing, a plurality of fins, a liquid-cooled pipeline, and a liquid-cooled system. The first casing is used for containing a dielectric liquid in which a heat-generating component is immersed. The plurality of fins are disposed on and located outside the first casing. The liquid-cooled pipeline containing a coolant is attached to the first casing. The liquid-cooled system is disposed outside the first casing and connected with the liquid-cooled pipeline to remove heat from the coolant in the liquid-cooled pipeline. The immersion cooling system dissipates heat through two heat exchange mechanisms, that is, natural convection heat loss and heat absorption by liquid cooling.Type: GrantFiled: March 30, 2022Date of Patent: July 18, 2023Assignee: Shenzhen Fulian Fugui Precision Industry Co., Ltd.Inventors: Jia-Hong Wu, Hsin-Ting Lin, Li-Wen Guo
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Publication number: 20230189476Abstract: An immersion cooling system includes a first casing, a plurality of fins, a liquid-cooled pipeline, and a liquid-cooled system. The first casing is used for containing a dielectric liquid in which a heat-generating component is immersed. The plurality of fins are disposed on and located outside the first casing. The liquid-cooled pipeline containing a coolant is attached to the first casing. The liquid-cooled system is disposed outside the first casing and connected with the liquid-cooled pipeline to remove heat from the coolant in the liquid-cooled pipeline. The immersion cooling system dissipates heat through two heat exchange mechanisms, that is, natural convection heat loss and heat absorption by liquid cooling.Type: ApplicationFiled: March 30, 2022Publication date: June 15, 2023Inventors: JIA-HONG WU, HSIN-TING LIN, LI-WEN GUO
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Publication number: 20100309095Abstract: An electronic apparatus having dual displays includes a casing, a circuit board, an electronic-paper display and a non-electronic-paper display. The casing has a first side and a second side. The circuit board is disposed in the casing. The electronic-paper display is disposed on the first side of the casing and connected to the circuit board. The non-electronic-paper display is disposed on the second side of the casing and connected to the circuit board. The electronic-paper display can be used for displaying a text document, and the non-electronic-paper display can be used for displaying high quality image data, e.g. a streaming media. Based on the attribute of a file, a user can select an appropriate display for displaying the file so as to make good use of the electronic apparatus.Type: ApplicationFiled: May 16, 2010Publication date: December 9, 2010Inventors: Ju-Nan Chang, Wen-Fong Chang, Yi-Peng Hsu, Hsin-Ting Lin, Qi Liu
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Patent number: 7580615Abstract: The mechanism of a sub-picture processing method for displaying multiple subtitles in a video/audio playing apparatus is provided. The purpose for displaying multiple subtitles in different languages simultaneously can be achieved under a user's control. Due to the unique control procedures and the concept of time division multiplexing, the present invention only employs a single sub-picture decoding unit and a single image mixer to display multiple subtitles in different languages at any preferred positions of the main picture.Type: GrantFiled: August 1, 2005Date of Patent: August 25, 2009Assignee: Sunplus Technology Co., Ltd.Inventors: Hung-Jen Huang, Hsin-Ting Lin, Chao-Yung Liu
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Publication number: 20060222336Abstract: The mechanism of a sub-picture processing method for displaying multiple subtitles in a video/audio playing apparatus is provided. The purpose for displaying multiple subtitles in different languages simultaneously can be achieved under a user's control. Due to the unique control procedures and the concept of time division multiplexing, the present invention only employs a single sub-picture decoding unit and a single image mixer to display multiple subtitles in different languages at any preferred positions of the main picture.Type: ApplicationFiled: August 1, 2005Publication date: October 5, 2006Inventors: Hung-Jen Huang, Hsin-Ting Lin, Chao-Yung Liu