Abstract: This disclosure relates to a polishing composition that includes an abrasive, at least two pH adjusters, a barrier film removal rate enhancer, a low-k removal rate inhibitor, and an azole-containing corrosion inhibitor. This disclosure also features a method of using the polishing composition to polish a substrate containing copper and silicon oxide.

Abstract: A light source module and a display device are provided. The light source module includes a light source, a light guide plate, and an optical film set including multiple first optical microstructures having a first surface, multiple second optical microstructures having a second surface, and multiple third optical microstructures having a third surface. Each of the multiple first optical microstructures has a first vertex angle, each of the multiple second optical microstructures has a second vertex angle, and each of the multiple third optical microstructures has a third vertex angle. The third vertex angle is less than the first vertex angle, and the first vertex angle is less than or equal to the second vertex angle. By configuring the aforementioned optical microstructures, the light source module of the disclosure may greatly improve the collimation of light and has favorable luminance.

Abstract: A double seal ring for an integrated circuit, the double seal ring includes a first seal ring surrounding the integrated circuit and a second seal ring spaced from the first seal ring. The double seal ring further includes two connectors connecting the first seal ring and the second seal ring, wherein the first seal ring, the second seal ring, and the two connectors form a closed loop. A method of forming a double seal ring for an integrated circuit includes forming a first seal ring surrounding the integrated circuit and forming a second seal ring spaced from the first seal ring. The method further includes forming two connectors connecting the first seal ring and the second seal ring, wherein the first seal ring, the second seal ring, and the two connectors form a closed loop.

Abstract: A double seal ring for an integrated circuit, the double seal ring includes a first seal ring surrounding the integrated circuit and a second seal ring spaced from the first seal ring. The double seal ring further includes two connectors connecting the first seal ring and the second seal ring, wherein the first seal ring, the second seal ring, and the two connectors form a closed loop. A method of forming a double seal ring for an integrated circuit includes forming a first seal ring surrounding the integrated circuit and forming a second seal ring spaced from the first seal ring. The method further includes forming two connectors connecting the first seal ring and the second seal ring, wherein the first seal ring, the second seal ring, and the two connectors form a closed loop.

Abstract: A double seal ring for an integrated circuit includes a first seal ring with a first opening. The first seal ring surrounds the integrated circuit. A second seal ring with a second opening surrounds the first seal ring. Two connectors connect the first opening of the first seal ring and the second opening of the second seal ring. The first seal ring, the second seal ring, and the two connectors form a closed loop.