Patents by Inventor HSING-I TSAI

HSING-I TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088224
    Abstract: A semiconductor structure includes a first gate structure, a second gate structure coupled to the first gate structure, a source region, a first drain region, and a second drain region. The source region is surrounded by the first gate structure and the second gate structure. The first drain region is separated from the source region by the first gate structure. The second drain region is separated from the source region by the second gat structure. A shape of the first drain region and a shape of the second drain region are different from each other from a plan view.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: HSING-I TSAI, FU-HUAN TSAI, CHIA-CHUNG CHEN, HSIAO-CHUN LEE, CHI-FENG HUANG, CHO-YING LU, VICTOR CHIANG LIANG
  • Patent number: 11855145
    Abstract: A semiconductor structure includes a gate structure, a source region, a drain region, and an isolation structure. The gate structure includes a first portion, a second portion and a third portion. The first portion extends in a first direction, and the second portion and the third portion extend in a second direction. The second portion and the third portion are disposed at opposite ends of the first portion. The source region and the drain region are separated by the gate structure. The isolation structure surrounds the gate structure, the source region and the drain region. The first portion has a first sidewall, the second portion has a second sidewall, and the third portion has a third sidewall. The first sidewall, the second sidewall and the third sidewall are parallel to the first direction and aligned with each other to form a straight line.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsing-I Tsai, Fu-Huan Tsai, Chia-Chung Chen, Hsiao-Chun Lee, Chi-Feng Huang, Cho-Ying Lu, Victor Chiang Liang
  • Publication number: 20230178537
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a cell array having a plurality of rows. The cell array includes a plurality of first logic cells arranged in at least one first row, and a plurality of second logic cells arranged in at least one second row. The first logic cells share a first active region. Each of the second logic cells has a second active region, and the second active regions of two adjacent second logic cells are separated from each other by an isolation structure. The first logic cells of the first row are in contact with the second logic cells of the second row.
    Type: Application
    Filed: October 31, 2022
    Publication date: June 8, 2023
    Inventors: Kin-Hooi DIA, Ho-Chieh HSIEH, Hsing-I TSAI
  • Publication number: 20230178557
    Abstract: A semiconductor structure is provided. A logic cell includes a first transistor in a first active region, a second gate electrode and a third gate electrode on opposite sides of the first transistor, a second transistor in a second active region, and a first isolation structure and a second isolation structure on opposite edges of the second active region. The first transistor includes a first gate electrode extending in a first direction. The second and third gate electrodes extend in the first direction, and the first and second isolation structures extend in the first direction. The second transistor and the first transistor share the first gate electrode. The first isolation structure is aligned with the second gate structure in the first direction, and the second isolation structure is aligned with the third gate structure in the first direction.
    Type: Application
    Filed: October 28, 2022
    Publication date: June 8, 2023
    Inventors: Ho-Chieh HSIEH, Kin-Hooi DIA, Hsing-I TSAI
  • Publication number: 20230067210
    Abstract: A semiconductor structure includes a gate structure, a source region, a drain region, and an isolation structure. The gate structure includes a first portion, a second portion and a third portion. The first portion extends in a first direction, and the second portion and the third portion extend in a second direction. The second portion and the third portion are disposed at opposite ends of the first portion. The source region and the drain region are separated by the gate structure. The isolation structure surrounds the gate structure, the source region and the drain region. The first portion has a first sidewall, the second portion has a second sidewall, and the third portion has a third sidewall. The first sidewall, the second sidewall and the third sidewall are parallel to the first direction and aligned with each other to form a straight line.
    Type: Application
    Filed: August 31, 2021
    Publication date: March 2, 2023
    Inventors: HSING-I TSAI, FU-HUAN TSAI, CHIA-CHUNG CHEN, HSIAO-CHUN LEE, CHI-FENG HUANG, CHO-YING LU, VICTOR CHIANG LIANG