Abstract: The present invention provides a chemical mechanical polishing device for polishing a wafer. The chemical mechanical polishing device comprises a platen, an outer polishing pad, an inner polishing pad, a slurry providing system, and a rotating carrier. The inner polishing pad is located on the platen. The outer polishing pad is mounted on the outer polishing pad and peeled off when abraded from overuse. The slurry providing system provides a slurry to the surface of the outer polishing pad. The rotating carrier holds the wafer and contacts the surface of the wafer with the slurry and the polishing pad to carry out the chemical mechanical polishing process.