Patents by Inventor Hsing-Wang CHEN

Hsing-Wang CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for optical proximity correction
    Patent number: 9235676
    Abstract: Some embodiments of the present disclosure provide an integrated circuit (IC) design method. The method includes (1) receiving a first layout comprising stripe patterns with a first separation and a first width; (2) receiving a second layout comprising stripe patterns with a second width narrower than the first separation, each stripe on the second layout is configured to situate between two adjacent stripes on the first layout when overlaying the first layout and the second layout; (3) performing a separation check by identifying a spacing between a stripe on the second layout and one of the two adjacent stripes on the first layout; and (4) adjusting the spacing between the stripe on the second layout and one of the two adjacent stripes on the first layout when the separation check determining the spacing is greater than a predetermined value.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: January 12, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chuan-Fang Su, Chih-Chun Hsu, Hsing-Wang Chen, Rung-Shiang Chen, Ching-Juinn Huang
  • METHOD AND APPARATUS FOR OPTICAL PROXIMITY CORRECTION
    Publication number: 20150310156
    Abstract: Some embodiments of the present disclosure provide an integrated circuit (IC) design method. The method includes (1) receiving a first layout comprising stripe patterns with a first separation and a first width; (2) receiving a second layout comprising stripe patterns with a second width narrower than the first separation, each stripe on the second layout is configured to situate between two adjacent stripes on the first layout when overlaying the first layout and the second layout; (3) performing a separation check by identifying a spacing between a stripe on the second layout and one of the two adjacent stripes on the first layout; and (4) adjusting the spacing between the stripe on the second layout and one of the two adjacent stripes on the first layout when the separation check determining the spacing is greater than a predetermined value.
    Type: Application
    Filed: April 25, 2014
    Publication date: October 29, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: CHUAN-FANG SU, CHIH-CHUN HSU, HSING-WANG CHEN, RUNG-SHIANG CHEN, CHING-JUINN HUANG
  • Semiconductor device and method for making same
    Patent number: 8736072
    Abstract: A semiconductor circuit pattern includes an angled conductive pattern having a line portion and a pad portion at an end of the line portion extending normal to the line portion on a first side of the line portion. The pad portion has a width greater than a width of the line portion. A spacing has a first portion adjacent the first side of the pad portion, and a second portion adjacent a second side of the pad portion opposite the first side. The first portion of the spacing has a width greater than the width of the second portion of the spacing.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: May 27, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Ching Wang, Chan-Kang Kuo, Ting-Yu Yen, Hsing-Wang Chen, Chun-Shiang Chang, Yen-Shen Chen
  • SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME
    Publication number: 20130154114
    Abstract: A semiconductor circuit pattern includes an angled conductive pattern having a line portion and a pad portion at an end of the line portion extending normal to the line portion on a first side of the line portion. The pad portion has a width greater than a width of the line portion. A spacing has a first portion adjacent the first side of the pad portion, and a second portion adjacent a second side of the pad portion opposite the first side. The first portion of the spacing has a width greater than the width of the second portion of the spacing.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 20, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Ching WANG, Chan-Kang KUO, Ting-Yu YEN, Hsing-Wang CHEN, Chun-Shiang CHANG, Yen-Shen CHEN