Patents by Inventor Hsin-Yuan Chuang

Hsin-Yuan Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178102
    Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.
    Type: Application
    Filed: April 21, 2023
    Publication date: May 30, 2024
    Inventors: Chun-Ti LU, Hao-Yi TSAI, Chiahung LIU, Ken-Yu CHANG, Tzuan-Horng LIU, Chih-Hao CHANG, Bo-Jiun LIN, Shih-Wei CHEN, Pei-Rong NI, Hsin-Wei HUANG, Zheng GangTsai, Tai-You LIU, Steve SHIH, Yu-Ting HUANG, Steven SONG, Yu-Ching WANG, Tsung-Yuan YU, Hung-Yi KUO, CHung-Shi LIU, Tsung-Hsien CHIANG, Ming Hung TSENG, Yen-Liang LIN, Tzu-Sung HUANG, Chun-Chih CHUANG
  • Patent number: 11984372
    Abstract: A package structure and a method of forming the same are provided. A method includes forming first electrical connectors and second electrical connectors on a first side of an interposer wafer. An integrated circuit die is bonded to the first side of the interposer wafer using the first electrical connectors. A stiffener structure is attached to the first side of the interposer wafer adjacent the integrated circuit die. The stiffener structure covers the second electrical connectors in a plan view. The integrated circuit die and the stiffener structure are encapsulated with a first encapsulant. The interposer wafer and the stiffener structure are singulated to form a stacked structure.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Teng-Yuan Lo, Lipu Kris Chuang, Hsin-Yu Pan
  • Publication number: 20060001820
    Abstract: A liquid crystal module includes a plate, a plurality of driving circuits formed on the plate, at least an opening formed on the back of the plate, a connector positioned in the opening, and a plurality of flexible circuit boards used to connect the driving circuits and the connector.
    Type: Application
    Filed: November 7, 2004
    Publication date: January 5, 2006
    Inventors: Yin-Tsung Cheng, Po-Cheng Shih, Hsin-Yuan Chuang, Han-Ping Kuo
  • Publication number: 20050200770
    Abstract: A flat panel display. The flat panel display includes a frame, a panel, and a backlight unit. The panel is disposed in the frame. The backlight unit, disposed in the frame, comprises a plurality of optical films, a light source, a light guide plate, and a reflector surrounding the light source and the light guide plate. One of the optical films has a first end, and the reflector has a second end in the vicinity of the optical films, with the first end level with or facing the second end.
    Type: Application
    Filed: March 10, 2004
    Publication date: September 15, 2005
    Inventors: Han-Ping Kuo, Hsin-Yuan Chuang