Patents by Inventor Hsiu-An Yu
Hsiu-An Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240177893Abstract: An over-current protection device includes a heat-sensitive layer and an electrode layer. The electrode layer includes a top metal layer and a bottom metal layer, and the heat-sensitive layer attached therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a conductive filler. The polymer matrix includes a polyolefin-based homopolymer and a polyolefin-based copolymer. The polyolefin-based homopolymer has a first coefficient of thermal expansion (CTE), and the polyolefin-based copolymer has a second CTE lower than the first CTE. The polyolefin-based homopolymer and the polyolefin-based copolymer together form an interpenetrating polymer network (IPN).Type: ApplicationFiled: May 3, 2023Publication date: May 30, 2024Inventors: CHENG-YU TUNG, Chia-Yuan Lee, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU, Takashi Hasunuma
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Patent number: 11990258Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.Type: GrantFiled: September 28, 2022Date of Patent: May 21, 2024Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: Hsiu-Che Yen, Yung-Hsien Chang, Cheng-Yu Tung, Chen-Nan Liu, Chia-Yuan Lee, Yu-Chieh Fu, Yao-Te Chang, Fu-Hua Chu
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Publication number: 20240151085Abstract: A hinge includes a first fixing bracket, a shaft and a swivel bracket. The first fixing bracket includes two first support pieces and a first connection piece. The two first support pieces are arranged in parallel to each other, and the first connection piece is connected to the two second support pieces. The two first support pieces are respectively provided with a shaft hole and the shaft holes are arranged coaxially along a central axis. At least one of the first support pieces is provided with one limiting extension portion extending in a direction in parallel to the central axis at an upper front end of the first support piece and extending towards the other first support piece. The shaft is inserted into the shaft hole.Type: ApplicationFiled: January 11, 2023Publication date: May 9, 2024Inventors: KUAN-YU LIN, HSIU-FAN HO
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Publication number: 20240151080Abstract: A hinge includes a seat, a shaft, a swivel bracket and at least one limiting bar. The seat includes two support portions. An accommodation area is defined between the two support portions. The two support portions are respectively provided with a shaft hole. The two shaft holes are arranged coaxially and connected to the accommodation area. The shaft includes a coupling section and two pivoting sections. The coupling section is located between the two pivoting sections. The two pivoting sections are respectively provided in one of the two shaft holes in a rotatable manner, and the coupling section is in the accommodation area. The swivel bracket includes a mounting plate, a sleeve piece and at least one extension portion. The mounting plate includes an inner surface, an outer surface, and a bottom edge. The sleeve piece extends from the bottom edge of the mounting plate and is wound at a side corresponding to the inner surface.Type: ApplicationFiled: January 11, 2023Publication date: May 9, 2024Inventors: KUAN-YU LIN, HSIU-FAN HO
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Publication number: 20240153842Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.Type: ApplicationFiled: January 4, 2024Publication date: May 9, 2024Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
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Publication number: 20240145132Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa·s.Type: ApplicationFiled: March 16, 2023Publication date: May 2, 2024Inventors: CHENG-YU TUNG, CHEN-NAN LIU, Chia-Yuan Lee, HSIU-CHE YEN, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU
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Publication number: 20240145133Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.Type: ApplicationFiled: April 5, 2023Publication date: May 2, 2024Inventors: CHEN-NAN LIU, YUNG-HSIEN CHANG, CHENG-YU TUNG, HSIU-CHE YEN, Chia-Yuan LEE, Yao-Te CHANG, FU-HUA CHU
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Publication number: 20240127988Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.Type: ApplicationFiled: March 2, 2023Publication date: April 18, 2024Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
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Publication number: 20240127989Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.Type: ApplicationFiled: January 25, 2023Publication date: April 18, 2024Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
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Publication number: 20240105642Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.Type: ApplicationFiled: November 29, 2023Publication date: March 28, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
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Patent number: 11942464Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.Type: GrantFiled: July 19, 2021Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
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Publication number: 20240088062Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.Type: ApplicationFiled: November 23, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
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Publication number: 20240068006Abstract: A method for assessing drug-resistant Klebsiella pneumoniae includes the following steps. A test sample is provided, wherein the test sample includes a Klebsiella pneumoniae. A spectrum analysis step is performed, wherein the test sample is detected by a mass spectrometry method so as to obtain a target mass spectrum data. An assessing step for drug-resistant Klebsiella pneumoniae is performed, wherein the target mass spectrum data is analyzed so as to assess whether the Klebsiella pneumoniae is resistant to a carbapenem antibiotic or a colistin or not. When the Klebsiella pneumoniae is resistant to the carbapenem antibiotic, the target mass spectrum data includes a first anti-carbapenem feature mark, and when the Klebsiella pneumoniae is resistant to the colistin, the target mass spectrum data includes a first anti-colistin feature mark.Type: ApplicationFiled: January 16, 2023Publication date: February 29, 2024Applicant: China Medical UniversityInventors: Der-Yang Cho, Po-Ren Hsueh, Jiaxin Yu, Ni Tien, Hsiu Hsien Lin, Chia-Fong Cho
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Patent number: 11916091Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A device includes a substrate and a plurality of photosensitive regions in the substrate. The substrate has a first side and a second side opposite to the first side. The device further includes an interconnect structure on the first side of the substrate, and a plurality of recesses on the second side of the substrate. The plurality of recesses extend into a semiconductor material of the substrate.Type: GrantFiled: April 15, 2021Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng
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Publication number: 20240022022Abstract: This disclosure is directed to a rugged plug having a connector, an elastic inner sheath and a slidable rigid sheath. The connector has a coupling end. The elastic inner sheath sleeves the connector. The elastic inner sheath has an elastic arm, and a hook is protruded from one lateral side of the elastic arm. The hook protrudes from the side of the elastic inner sheath and a tip of the hook is a curved surface, an actuating slope is defined on the elastic arm, and a direction normal to the actuating slope is biased toward the coupling end of the connector. The slidable rigid sheath movably sleeves the elastic inner sheath, the slidable rigid sheath cover the actuating slope and the hook is located outside the slidable rigid sheath, the slidable rigid sheath has an actuating structure and the actuating structure abuts against the actuating slope.Type: ApplicationFiled: January 17, 2023Publication date: January 18, 2024Inventor: HSIU-YU KUO
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Patent number: 11688533Abstract: A chip resistor structure includes a substrate; a pair of first electrodes disposed opposite to each other on a first surface of the substrate at a first interval; a resistance layer disposed between the pair of first electrodes on the first surface; a spacer layer made of a material having a composition different from that of the resistance layer, disposed over the pair of first electrodes; a protective layer overlying the resistance layer; and a plating layer electroplated onto the pair of first electrodes and the spacer layer, and having ends extending beyond the pair of first electrodes terminate at least over the spacer layer. The plating layer may be joined with or spaced from or climb up to the protective layer on or above the spacer layer.Type: GrantFiled: November 2, 2021Date of Patent: June 27, 2023Assignee: CYNTEC CO., LTD.Inventors: Hsiu-Yu Chang, Chao-Ting Lin
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Patent number: 11658439Abstract: A male plug and a female receptacle and a docking structure thereof include a male plug and a female receptacle docked with each other. When the male plug and the female receptacle docked with each other, the male plug is fitted with the female receptacle using a horizontal holding force provided by a first fastening structure, and is fitted with the female receptacle using a vertical holding force provided by a second fastening structure, hence further reinforcing plugging stability between the male plug and the female receptacle by the horizontal and vertical holding forces.Type: GrantFiled: February 19, 2021Date of Patent: May 23, 2023Assignee: Getac Technology CorporationInventor: Hsiu-Yu Kuo
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Publication number: 20230134039Abstract: A chip resistor structure includes a substrate; a pair of first electrodes disposed opposite to each other on a first surface of the substrate at a first interval; a resistance layer disposed between the pair of first electrodes on the first surface; a spacer layer made of a material having a composition different from that of the resistance layer, disposed over the pair of first electrodes; a protective layer overlying the resistance layer; and a plating layer electroplated onto the pair of first electrodes and the spacer layer, and having ends extending beyond the pair of first electrodes terminate at least over the spacer layer. The plating layer may be joined with or spaced from or climb up to the protective layer on or above the spacer layer.Type: ApplicationFiled: November 2, 2021Publication date: May 4, 2023Inventors: Hsiu-Yu Chang, Chao-Ting Lin
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Patent number: D995532Type: GrantFiled: July 27, 2021Date of Patent: August 15, 2023Assignee: GETAC TECHNOLOGY CORPORATIONInventors: Hsiu-Yu Kuo, Shi-Liang Zhong
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Patent number: D1000405Type: GrantFiled: August 12, 2021Date of Patent: October 3, 2023Assignee: GETAC TECHNOLOGY CORPORATIONInventors: Shi-Liang Zhong, Hsiu-Yu Kuo