Abstract: A method of forming a semiconductor device includes: forming a fin protruding above a substrate, where a top portion of the fin comprises a layer stack that includes alternating layers of a first semiconductor material and a second semiconductor material; forming a dummy gate structure over the fin; forming openings in the fin on opposing sides of the dummy gate structure; forming source/drain regions in the openings; removing the dummy gate structure to expose the first semiconductor material and the second semiconductor material under the dummy gate structure; performing a first etching process to selectively remove the exposed first semiconductor material, where after the first etching process, the exposed second semiconductor material form nanostructures, where each of the nanostructures has a first shape; and after the first etching process, performing a second etching process to reshape each of the nanostructures into a second shape different from the first shape.

Abstract: A sample collection device includes a tube, a closure and a partitioning member. The tube includes an opening and is used to receive a sampling swab. The closure is engaged with the tube for enclosing the opening. The partitioning member is disposed in the tube and includes a blocking portion and a position-limiting portion. The blocking portion is disposed close to the opening and covers a portion of the opening so as to leave another uncovered portion as an entrance for passing the sampling swab therethrough. The position-limiting portion is connected with the blocking portion and extended into the tube, so as to limit the sampling swab in a space corresponding to the entrance inside the tube after the sampling swab passes through the entrance.

Abstract: This invention provides a dynamic control method for LED backlight module, in which each LED of a backlight module is connected with respective parallel circuit, and each parallel circuit is connected in series together. Then, only a single current source is used to supply the required power for light emitting of the whole LEDs series, and the brightness of each LED is controlled by controlling the current flowing through each LED with the parallel circuit according to flow dividing method. In this manner, the connection in the whole circuit design and its control become easier and simpler.

Abstract: A frame structure with a built-in illumination device is provided. The frame structure includes a bottom plate, carrying a decorating object; a sidewall, having a sidewall height determined depending on a 3D height of the decorating object, and surrounding the bottom plate; an outer framework, disposed along the sidewall and covering the sidewall; an illumination device, mounted on the sidewall at any position, and providing an electric switch connected to an external power source; and a reflection board, adhered onto the illumination device at a corresponding position, so as to reflect light rays emitted by the illumination device to enhance luminance.