Patents by Inventor Hsiu-Ping SHEN

Hsiu-Ping SHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10889659
    Abstract: The present disclosure provides a modified polymethylhydrosiloxane, a modified high-cis conjugated diene polymer, and a manufacturing method for the same, and a rubber composition and a tire using the same. The manufacturing method for the modified high-cis conjugated diene polymer comprises: performing a polymerization reaction to form a high-cis conjugated diene polymer; and making the high-cis conjugated diene polymer react with a first modifier, and then react with a condensation accelerator and a second modifier to generate a modified high-cis conjugated diene polymer; wherein the modified high-cis conjugated diene polymer has over 97% of cis-1,4 structure. The second modifier comprises a compound represented by the following formula (1).
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: January 12, 2021
    Assignee: CHI MEI CORPORATION
    Inventors: Hsiu-Ping Shen, Kuan-Lin Hsieh
  • Publication number: 20190241740
    Abstract: The present disclosure provides a modified polymethylhydrosiloxane, a modified high-cis conjugated diene polymer, and a manufacturing method for the same, and a rubber composition and a tire using the same. The manufacturing method for the modified high-cis conjugated diene polymer comprises: performing a polymerization reaction to form a high-cis conjugated diene polymer; and making the high-cis conjugated diene polymer react with a first modifier, and then react with a condensation accelerator and a second modifier to generate a modified high-cis conjugated diene polymer; wherein the modified high-cis conjugated diene polymer has over 97% of cis-1,4 structure. The second modifier comprises a compound represented by the following formula (1).
    Type: Application
    Filed: January 28, 2019
    Publication date: August 8, 2019
    Inventors: Hsiu-Ping SHEN, Kuan-Lin HSIEH