Patents by Inventor Hsiu-Yu Lin

Hsiu-Yu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151085
    Abstract: A hinge includes a first fixing bracket, a shaft and a swivel bracket. The first fixing bracket includes two first support pieces and a first connection piece. The two first support pieces are arranged in parallel to each other, and the first connection piece is connected to the two second support pieces. The two first support pieces are respectively provided with a shaft hole and the shaft holes are arranged coaxially along a central axis. At least one of the first support pieces is provided with one limiting extension portion extending in a direction in parallel to the central axis at an upper front end of the first support piece and extending towards the other first support piece. The shaft is inserted into the shaft hole.
    Type: Application
    Filed: January 11, 2023
    Publication date: May 9, 2024
    Inventors: KUAN-YU LIN, HSIU-FAN HO
  • Publication number: 20240151080
    Abstract: A hinge includes a seat, a shaft, a swivel bracket and at least one limiting bar. The seat includes two support portions. An accommodation area is defined between the two support portions. The two support portions are respectively provided with a shaft hole. The two shaft holes are arranged coaxially and connected to the accommodation area. The shaft includes a coupling section and two pivoting sections. The coupling section is located between the two pivoting sections. The two pivoting sections are respectively provided in one of the two shaft holes in a rotatable manner, and the coupling section is in the accommodation area. The swivel bracket includes a mounting plate, a sleeve piece and at least one extension portion. The mounting plate includes an inner surface, an outer surface, and a bottom edge. The sleeve piece extends from the bottom edge of the mounting plate and is wound at a side corresponding to the inner surface.
    Type: Application
    Filed: January 11, 2023
    Publication date: May 9, 2024
    Inventors: KUAN-YU LIN, HSIU-FAN HO
  • Publication number: 20240153842
    Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 9, 2024
    Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
  • Publication number: 20240105642
    Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Patent number: 11942464
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20240088062
    Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Publication number: 20240068006
    Abstract: A method for assessing drug-resistant Klebsiella pneumoniae includes the following steps. A test sample is provided, wherein the test sample includes a Klebsiella pneumoniae. A spectrum analysis step is performed, wherein the test sample is detected by a mass spectrometry method so as to obtain a target mass spectrum data. An assessing step for drug-resistant Klebsiella pneumoniae is performed, wherein the target mass spectrum data is analyzed so as to assess whether the Klebsiella pneumoniae is resistant to a carbapenem antibiotic or a colistin or not. When the Klebsiella pneumoniae is resistant to the carbapenem antibiotic, the target mass spectrum data includes a first anti-carbapenem feature mark, and when the Klebsiella pneumoniae is resistant to the colistin, the target mass spectrum data includes a first anti-colistin feature mark.
    Type: Application
    Filed: January 16, 2023
    Publication date: February 29, 2024
    Applicant: China Medical University
    Inventors: Der-Yang Cho, Po-Ren Hsueh, Jiaxin Yu, Ni Tien, Hsiu Hsien Lin, Chia-Fong Cho
  • Publication number: 20210262866
    Abstract: The disclosure provides an identification tag including a bag body, an identification substance, and an identification component. The bag body is configured to be disposed on a product, and has a chamber. The identification substance is stored in the chamber. The identification substance is colored, and the state of the identification substance is changeable with temperature. When the identification substance is changed from one of the states to the other of the states, the identification substance has a volume increase and causes at least one crack on the bag body, wherein the at least one crack is connected to the chamber.
    Type: Application
    Filed: December 23, 2020
    Publication date: August 26, 2021
    Applicant: CYMMETRIK ENTERPRISE CO.,LTD.
    Inventors: Shan-Jen KUO, Hsiu-Yu LIN, Jen-Chieh WEI
  • Patent number: 11024055
    Abstract: A vehicle, a vehicle positioning system and a vehicle positioning method are provided. The vehicle positioning system includes a 2D image sensor, a 3D sensor and a processor. The 2D image sensor is configured for obtaining 2D image data. The 3D sensor is configured for obtaining 3D point cloud data. The processor is coupled to the 2D image sensor and the 3D sensor, and configured for merging the 2D image data and the 3D point cloud data to generate 3D image data, identifying at least one static object from the 2D image data, obtaining 3D point cloud data of the static object from the 3D image data based on each one of the at least one static object, and calculating a vehicle relative coordinate of the vehicle based on the 3D point cloud data of the static object.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: June 1, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Bo-Chun Hsu, Wei-Po Nien, Yi-Ling Wu, Hsiu-Yu Lin, Shi-Xin Chen, An-Kai Jeng, Chung-Hsien Yang
  • Publication number: 20200175720
    Abstract: A vehicle, a vehicle positioning system and a vehicle positioning method are provided. The vehicle positioning system includes a 2D image sensor, a 3D sensor and a processor. The 2D image sensor is configured for obtaining 2D image data. The 3D sensor is configured for obtaining 3D point cloud data. The processor is coupled to the 2D image sensor and the 3D sensor, and configured for merging the 2D image data and the 3D point cloud data to generate 3D image data, identifying at least one static object from the 2D image data, obtaining 3D point cloud data of the static object from the 3D image data based on each one of the at least one static object, and calculating a vehicle relative coordinate of the vehicle based on the 3D point cloud data of the static object.
    Type: Application
    Filed: July 11, 2019
    Publication date: June 4, 2020
    Inventors: Bo-Chun Hsu, Wei-Po Nien, Yi-Ling Wu, Hsiu-Yu Lin, Shi-Xin Chen, An-Kai Jeng, Chung-Hsien Yang
  • Patent number: 8834308
    Abstract: A transporting apparatus is disclosed. The transporting apparatus comprises a mounting plate; a assistant wheel assembly attached to the mounting plate, the assistant wheel assembly comprising an inner wheel, an outer wheel, and an elastic member; the elastic member is between the inner wheel and the outer wheel; a driving wheel movably attached to the mounting plate; a driving member secured to the driving wheel; and a belt connecting the outer wheel and the driving member; wherein the elastic member is generally deformed at a location where the belt warps on the outer wheel.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: September 16, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Hsiu-Yu Lin
  • Publication number: 20130316864
    Abstract: A transmission shaft control mechanism is provided for a transmission apparatus. The transmission shaft control mechanism includes a mounting member, stationary member, and a braking member. The mounting member is secured to a transmission shaft. The stationary member is secured to a supporting plate. The braking member surrounds the transmission shaft and is located between the mounting member and the stationary member. The braking member is able to move axially along the transmission shaft. When the braking member moves to a position where the braking member is in contact with the stationary member, a friction force is produced between the braking member and the stationary member thereby smoothening the rotation of the transmission shaft.
    Type: Application
    Filed: April 3, 2013
    Publication date: November 28, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: HSIU-YU LIN
  • Publication number: 20120252617
    Abstract: A transporting apparatus is disclosed. The transporting apparatus comprises a mounting plate; a assistant wheel assembly attached to the mounting plate, the assistant wheel assembly comprising an inner wheel, an outer wheel, and an elastic member; the elastic member is between the inner wheel and the outer wheel; a driving wheel movably attached to the mounting plate; a driving member secured to the driving wheel; and a belt connecting the outer wheel and the driving member; wherein the elastic member is generally deformed at a location where the belt warps on the outer wheel.
    Type: Application
    Filed: November 15, 2011
    Publication date: October 4, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: HSIU-YU LIN
  • Patent number: 8113706
    Abstract: A backlight module, especially a side-edge type backlight module is disclosed. The backlight module comprises: a back plate having plural side walls, plural supporting elements locating on the connecting parts of the plural side walls, and a reflective sheet locating on the plural supporting elements. Therefore, an air space is maintained between the reflective sheet and the back plate of the backlight module. As a result, when the backlight module is operating, the heat produced by the light emitting units will not be transmitted to the reflective sheet of the backlight module during the operation. That is, even after long-term operation, the temperature of the reflective sheet of the backlight module can be maintained at a stable level.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: February 14, 2012
    Assignee: Chunghwa Picture Tubes, Ltd.
    Inventor: Hsiu-Yu Lin
  • Publication number: 20100002418
    Abstract: A backlight module, especially a side-edge type backlight module is disclosed. The backlight module comprises: a back plate having plural side walls, plural supporting elements locating on the connecting parts of the plural side walls, and a reflective sheet locating on the plural supporting elements. Therefore, an air space is maintained between the reflective sheet and the back plate of the backlight module. As a result, when the backlight module is operating, the heat produced by the light emitting units will not be transmitted to the reflective sheet of the backlight module during the operation. That is, even after long-term operation, the temperature of the reflective sheet of the backlight module can be maintained at a stable level.
    Type: Application
    Filed: June 24, 2009
    Publication date: January 7, 2010
    Applicant: Chunghwa Picture Tubes, Ltd.
    Inventor: Hsiu-Yu Lin