Patents by Inventor Hsuan-Chih Chu
Hsuan-Chih Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11965237Abstract: A system and a method for detecting abnormality of a thin-film deposition process are provided. In the method, a thin-film is deposited on a substrate in a thin-film deposition chamber by using a target, a dimension of a collimator mounted between the target and the substrate is scanned by using at least one sensor disposed in the thin-film deposition chamber to derive an erosion profile of the target, and abnormality of the thin-film deposition process is detected by analyzing the erosion profile with an analysis model trained with data of a plurality of erosion profiles derived under a plurality of deposition conditions.Type: GrantFiled: November 13, 2020Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
-
Publication number: 20240011160Abstract: A precursor supply system for thin film deposition is provided. The precursor supply system includes a precursor source container, and the precursor source container includes: a top wall; a bottom wall; a side wall circumferentially connecting the top wall and the bottom wall, wherein at least a portion of an interior surface of the precursor source container has a three-dimensional (3D) pattern; an inlet configured to allow introduction of a carrier gas into the precursor source container; and an outlet configured to allow exit of a precursor vapor generated in the precursor source container.Type: ApplicationFiled: July 11, 2022Publication date: January 11, 2024Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
-
Publication number: 20240003993Abstract: A thin-film deposition system includes a thin-film deposition chamber. A magnetron assembly is positioned within the thin-film deposition chamber to assist in thin-film deposition processes. A magnetic sensor apparatus is positioned adjacent to the magnetron assembly. The magnetic sensor apparatus includes a plurality of magnetic sensors that each sense the magnetic field in a particular location within the thin-film deposition chamber. The control system generates a magnetic field distribution based on the sensor signals from the magnetic sensors. An analysis model that has been trained with a machine learning process analyzes the magnetic field distribution and determines whether or not an abnormal magnetic field distributions process. The control system can stop the thin-film deposition process based on the output of the analysis model.Type: ApplicationFiled: June 30, 2022Publication date: January 4, 2024Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN
-
Patent number: 11851751Abstract: A deposition system is provided capable of cleaning itself by removing a target material deposited on a surface of a collimator. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, a target enclosing the substrate process chamber, and a collimator having a plurality of hollow structures disposed between the target and the substrate, a vibration generating unit, and cleaning gas outlet.Type: GrantFiled: July 23, 2021Date of Patent: December 26, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
-
Publication number: 20230381701Abstract: A device for removing particles in a gas stream includes a first cylindrical portion configured to receive the gas stream containing a target gas and the particles, a rotatable device disposed within the first cylindrical portion and configured to generate a centrifugal force when in a rotational action to divert the particles away from the rotatable device, a second cylindrical portion coupled to the first cylindrical portion and configured to receive the target gas, and a third cylindrical portion coupled to the first cylindrical portion and surrounding the second cylindrical portion, the third cylindrical portion being configured to receive the diverted particles.Type: ApplicationFiled: August 13, 2023Publication date: November 30, 2023Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
-
Publication number: 20230383400Abstract: A deposition system is provided capable of cleaning itself by removing a target material deposited on a surface of a collimator. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, a target enclosing the substrate process chamber, and a collimator having a plurality of hollow structures disposed between the target and the substrate, a vibration generating unit, and cleaning gas outlet.Type: ApplicationFiled: August 10, 2023Publication date: November 30, 2023Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN
-
Publication number: 20230352350Abstract: A deposition system provides a feature that may reduce costs of the sputtering process by increasing a target change interval. The deposition system provides an array of magnet members which generate a magnetic field and redirect the magnetic field based on target thickness measurement data. To adjust or redirect the magnetic field, at least one of the magnet members in the array tilts to focus on an area of the target where more target material remains than other areas. As a result, more ion, e.g., argon ion bombardment occurs on the area, creating more uniform erosion on the target surface.Type: ApplicationFiled: June 26, 2023Publication date: November 2, 2023Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN, Yi-Ming DAI
-
Publication number: 20230332322Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.Type: ApplicationFiled: June 23, 2023Publication date: October 19, 2023Inventors: Zong-Kun LIN, Hsuan-Chih CHU, Chien-Hsun PAN, Yen-Yu CHEN, Yi-Ming DAI
-
Publication number: 20230298916Abstract: A semiconductor process system includes a wafer support and a control system. The wafer support includes a plurality of heating elements and a plurality of temperature sensors. The heating elements heat a semiconductor wafer supported by the support system. The temperature sensors generate sensor signals indicative of a temperature. The control system selectively controls the heating elements responsive to the sensor signals.Type: ApplicationFiled: May 26, 2023Publication date: September 21, 2023Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN
-
Patent number: 11742231Abstract: The present disclosure provides a flexible workpiece pedestal capable of tilting a workpiece support surface. The workpiece pedestal further includes a heater mounted on the workpiece support surface. The heater includes a plurality of heating sources such as heating coils. The plurality of heating sources in the heater allows heating the workpiece at different temperatures for different zones of the workpiece. For example, the workpiece can have a central zone heated by a first heating coil, a first outer ring zone that is outside of the central zone heated by a second heating coil, a second outer ring zone that is outside of the first outer ring zone heated by a third heating coil. By using the tunable heating feature and the tilting feature of the workpiece pedestal, the present disclosure can reduce or eliminate the shadowing effect problem of the related workpiece pedestal in the art.Type: GrantFiled: October 18, 2019Date of Patent: August 29, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hsuan-Chih Chu, Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai
-
Patent number: 11732379Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.Type: GrantFiled: June 15, 2020Date of Patent: August 22, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Zong-Kun Lin, Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Yi-Ming Dai
-
Patent number: 11728226Abstract: A deposition system provides a feature that may reduce costs of the sputtering process by increasing a target change interval. The deposition system provides an array of magnet members which generate a magnetic field and redirect the magnetic field based on target thickness measurement data. To adjust or redirect the magnetic field, at least one of the magnet members in the array tilts to focus on an area of the target where more target material remains than other areas. As a result, more ion, e.g., argon ion bombardment occurs on the area, creating more uniform erosion on the target surface.Type: GrantFiled: August 14, 2020Date of Patent: August 15, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen, Yi-Ming Dai
-
Patent number: 11688615Abstract: A semiconductor process system includes a wafer support and a control system. The wafer support includes a plurality of heating elements and a plurality of temperature sensors. The heating elements heat a semiconductor wafer supported by the support system. The temperature sensors generate sensor signals indicative of a temperature. The control system selectively controls the heating elements responsive to the sensor signals.Type: GrantFiled: August 19, 2020Date of Patent: June 27, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
-
Publication number: 20230022509Abstract: A deposition system is provided capable of cleaning itself by removing a target material deposited on a surface of a collimator. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, a target enclosing the substrate process chamber, and a collimator having a plurality of hollow structures disposed between the target and the substrate, a vibration generating unit, and cleaning gas outlet.Type: ApplicationFiled: July 23, 2021Publication date: January 26, 2023Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN
-
Publication number: 20230008029Abstract: A sputtering target structure includes a back plate characterized by a first size, and a plurality of sub-targets bonded to the back plate. Each of the sub-targets is characterized by a size that is a fraction of the first size and is equal to or less than a threshold target size. Each sub-target includes a ferromagnetic material containing iron (Fe) and boron (B). Each of the plurality of sub-targets is in direct contact with one or more adjacent sub-targets.Type: ApplicationFiled: January 18, 2022Publication date: January 12, 2023Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
-
Publication number: 20230010438Abstract: A semiconductor device includes a device feature. The semiconductor device includes a first silicide layer having a first metal, wherein the first silicide layer is embedded in the device feature. The semiconductor device includes a second silicide layer having a second metal, wherein the second silicide layer, disposed above the device feature, comprises a first portion directly contacting the first silicide layer. The first metal is different from the second metal.Type: ApplicationFiled: January 26, 2022Publication date: January 12, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
-
Publication number: 20220406583Abstract: A deposition system is provided capable of controlling an amount of a target material deposited on a substrate and/or direction of the target material that is deposited on the substrate. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, a target enclosing the substrate process chamber, and a collimator having a plurality of hollow structures disposed between the target and the substrate, wherein a length of at least one of the plurality of hollow structures is adjustable.Type: ApplicationFiled: June 18, 2021Publication date: December 22, 2022Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN
-
Publication number: 20220356578Abstract: A thin film deposition system deposits a thin film on a substrate in a thin film deposition chamber. The thin film deposition system deposits the thin film by flowing a fluid into the thin film deposition chamber. The thin film deposition system includes a byproducts sensor that senses byproducts of the fluid in an exhaust fluid. The thin film deposition system adjusts the flow rate of the fluid based on the byproducts.Type: ApplicationFiled: July 25, 2022Publication date: November 10, 2022Inventors: Wen-Hao CHENG, Yi-Ming DAI, Yen-Yu CHEN, Hsuan-Chih CHU
-
Publication number: 20220359232Abstract: The present disclosure provides a flexible workpiece pedestal capable of tilting a workpiece support surface. The workpiece pedestal further includes a heater mounted on the workpiece support surface. The heater includes a plurality of heating sources such as heating coils. The plurality of heating sources in the heater allows heating the workpiece at different temperatures for different zones of the workpiece. For example, the workpiece can have a central zone heated by a first heating coil, a first outer ring zone that is outside of the central zone heated by a second heating coil, a second outer ring zone that is outside of the first outer ring zone heated by a third heating coil. By using the tunable heating feature and the tilting feature of the workpiece pedestal, the present disclosure can reduce or eliminate the shadowing effect problem of the related workpiece pedestal in the art.Type: ApplicationFiled: July 20, 2022Publication date: November 10, 2022Inventors: Hsuan-Chih Chu, Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai
-
Publication number: 20220297037Abstract: A device for removing particles in a gas stream includes a first cylindrical portion configured to receive the gas stream containing a target gas and the particles, a rotatable device disposed within the first cylindrical portion and configured to generate a centrifugal force when in a rotational action to divert the particles away from the rotatable device, a second cylindrical portion coupled to the first cylindrical portion and configured to receive the target gas, and a third cylindrical portion coupled to the first cylindrical portion and surrounding the second cylindrical portion, the third cylindrical portion being configured to receive the diverted particles.Type: ApplicationFiled: July 28, 2021Publication date: September 22, 2022Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen