Abstract: The present invention is directed to a system and method for on-line real-time measuring the surface topography and out-of-plane deformation by using phase-shifting shadow moiré method. Digital Phase-Shifting Shadow Moiré Method is applied to a system, which receives the reflected images from the surface of transparent or non-transparent plate projected under a light beam passing through a grating. Next, by image correction program, the skewed interference fringe pattern is recovered to the image as if the image acquisition equipment is placed normal to the surface. Furthermore, the received images are processed with Phase-Shifting to show the surface topography of the plate.

Abstract: An example method to prepare a prepreg is disclosed. In one embodiment, the method includes applying a mixture on a fibrous material and heating the mixture and the fibrous material to a temperature greater than about 225 degrees Celsius during a process of preparing the prepreg. The mixture includes an epoxy compound, a compound having a ring structure, and a crosslinking agent.

Abstract: A wearable electronic device includes a device body having a wireless communication module, a wearing unit connected to the device body for being worn on a user, an antenna module entirely embedded inside the wearing unit, and a conductive unit is partially disposed in the wearing unit and electrically connected to the antenna module and the wireless communication module.

Abstract: A wearable electronic device includes a device body having a wireless communication module, a wearing unit connected to the device body for being worn on a user, an antenna module entirely embedded inside the wearing unit, and a conductive unit is partially disposed in the wearing unit and electrically connected to the antenna module and the wireless communication module.

Abstract: An intelligent watch includes a main body, a trigger switch, an inner-ring body and an outer-ring body. The trigger switch is disposed in the main body. The inner-ring body is pressably engaged on the main body to be pressed for trigger the trigger switch. The outer-ring body is rotatably engaged on the main body and surrounds the inner-ring body.

Abstract: The present invention is directed to a system and method for on-line real-time measuring the surface topography and out-of-plane deformation by using phase-shifting shadow moiré method. Digital Phase-Shifting Shadow Moiré Method is applied to a system, which receives the reflected images from the surface of transparent or non-transparent plate projected under a light beam passing through a grating. Next, by image correction program, the skewed interference fringe pattern is recovered to the image as if the image acquisition equipment is placed normal to the surface. Furthermore, the received images are processed with Phase-Shifting to show the surface topography of the plate.

Abstract: A lamp device and a light source module are provided. The lamp device includes a lamp body and a coil connecting tube. The lamp body has an end portion and a lead wire extends from the end portion. The coil connecting tube is disposed corresponding to the end portion of the lamp body and electrically connecting to the lead wire for power supply purpose. The coil connecting tube winds about an axial direction of the lamp body and is capable of stretching or compressing along the axial direction. The light source module includes the lamp device and a lamp connector which has a power source portion being coupled to the coil connecting tube for power supply.

Abstract: An example method to prepare a prepreg is disclosed. In one embodiment, the method includes applying a mixture on a fibrous material and heating the mixture and the fibrous material to a temperature greater than about 225 degrees Celsius during a process of preparing the prepreg. The mixture includes an epoxy compound, a compound having a ring structure, and a crosslinking agent.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.

Abstract: Disclosed is a halogen-free flame-retardant epoxy resin composition for printed circuit board, which includes (A) a halogen-free epoxy resin; (B) a copolymer of styrene and maleic anhydride used as a first curing agent; (C) poly(1,3-phenylene methylphosphonate) used as a second curing agent; (D) a curing accelerator; and (E) an inorganic filler.

Abstract: A stable solution of the polymer prepared from N,O-heterocyclic compound and its preparing method are provided, wherein the stable solution is prepared by making the N,O-heterocyclic compound of formulae I or II carry out a ring-opening polymerization: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification. The stable solution can be used as a hardener for curing epoxy resin.

Abstract: A lamp device and a light source module are provided. The lamp device includes a lamp body and a coil connecting tube. The lamp body has an end portion and a lead wire extends from the end portion. The coil connecting tube is disposed corresponding to the end portion of the lamp body and electrically connecting to the lead wire for power supply purpose. The coil connecting tube winds about an axial direction of the lamp body and is capable of stretching or compressing along the axial direction. The light source module includes the lamp device and a lamp connector which has a power source portion being coupled to the coil connecting tube for power supply.

Abstract: A resin composition is provided.

Abstract: A stable solution of the polymer prepared from N,O-heterocyclic compound and its preparing method are provided, wherein the stable solution is prepared by making the N,O-heterocyclic compound of formulae I or II carry out a ring-opening polymerization: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification. The stable solution can be used as a hardener for curing epoxy resin.

Abstract: Embodiments of the present disclosure set forth a sintered talc powder. The sintered talc powder comprising a first X-ray diffraction peak from about 29° to about 30° and having a first intensity and a second X-ray diffraction peak from about 25° to about 27° and having a second intensity, wherein the first intensity is greater than the second intensity.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.

Abstract: Disclosed is a halogen-free flame-retardant epoxy resin composition for printed circuit board, which includes (A) a halogen-free epoxy resin; (B) a copolymer of styrene and maleic anhydride used as a first curing agent; (C) poly(1,3-phenylene methylphosphonate) used as a second curing agent; (D) a curing accelerator; and (E) an inorganic filler.

Abstract: A lamp device and a light source module are provided. The lamp device includes a lamp body and a coil connecting tube. The lamp body has an end portion and a lead wire extends from the end portion. The coil connecting tube is disposed corresponding to the end portion of the lamp body and electrically connecting to the lead wire for power supply purpose. The coil connecting tube winds about an axial direction of the lamp body and is capable of stretching or compressing along the axial direction. The light source module includes the lamp device and a lamp connector which has a power source portion being coupled to the coil connecting tube for power supply.

Abstract: Embodiments of the present disclosure set forth a prepreg. In one embodiment, the prepreg includes a fibrous material and a resin blend. The resin blend includes an epoxy compound, a compound having a ring structure, and a crosslinking agent. The resin blend has been heated to a temperature substantially greater than 225 degrees Celsius in a curing process when preparing the prepreg.