Patents by Inventor Hsuan-Wei Chen
Hsuan-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240144305Abstract: A method for allocating perishable products based on machine learning, includes using a sales estimation model to evaluate estimated sales of a plurality of perishable products in a predetermined period, using a rating model to calculate a predetermined rate of the plurality of perishable products in the predetermined period according to the estimated sales, using an allocation model to adjust an allocation ratio of the plurality of perishable products in a plurality of marketing channels according to the estimated sales and the predetermined rate if a current rate is lower than the predetermined rate, and determining the numbers of perishable products allocated to the plurality of marketing channels according to the allocation ratio.Type: ApplicationFiled: December 27, 2022Publication date: May 2, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Publication number: 20240119473Abstract: A rate adjustment method includes a rate estimation model generating a plurality of estimated rates according to a plurality of training data, a revenue estimation model generating an estimated revenue according to the plurality of estimated rates, updating the rate estimation model according to the estimated revenue to generate an updated rate estimation model, and inputting a plurality of current data into the updated rate estimation model to update the plurality of estimated rates.Type: ApplicationFiled: December 27, 2022Publication date: April 11, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Publication number: 20230394014Abstract: A method for retrieving data on a web page includes performing a simulated user operation on a target web page to generate a result web page, retrieving a source code of the result web page, creating a data table according to the source code, and performing a data cleaning operation with the data table to generate cleaned data and store the cleaned data in a database. Each temporary row of the data table is corresponding to a quotation plan.Type: ApplicationFiled: August 5, 2022Publication date: December 7, 2023Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Patent number: 11545412Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.Type: GrantFiled: November 19, 2020Date of Patent: January 3, 2023Assignee: Unimicron Technology Corp.Inventors: Pei-Wei Wang, Ching Sheng Chen, Ra-Min Tain, Ming-Hao Wu, Hsuan-Wei Chen
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Publication number: 20220159824Abstract: A package carrier includes a circuit structure layer and a heat-conducting element. The circuit structure layer includes a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conduction portion is aligned with a side surface of the circuit structure layer.Type: ApplicationFiled: December 29, 2020Publication date: May 19, 2022Applicant: Unimicron Technology Corp.Inventors: Ming-Hao Wu, Hsuan-Wei Chen, Chi-Chun Po
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Publication number: 20220087033Abstract: A circuit board and a method of manufacturing the same are provided. The method includes the following steps of providing a first conductive layer; providing an adhesive material and at least one conductive bump, in which the adhesive material is electrically conductive; adhering at least one conductive bump to a surface of the first conductive layer using the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and at least one conductive bump; and disposing a second conductive layer on the insulation layer.Type: ApplicationFiled: October 28, 2020Publication date: March 17, 2022Inventors: Ming-Hao WU, Hsuan-Wei CHEN
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Publication number: 20210074606Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.Type: ApplicationFiled: November 19, 2020Publication date: March 11, 2021Applicant: Unimicron Technology Corp.Inventors: Pei-Wei Wang, Ching Sheng Chen, Ra-Min Tain, Ming-Hao Wu, Hsuan-Wei Chen
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Patent number: 10881006Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.Type: GrantFiled: January 10, 2020Date of Patent: December 29, 2020Assignee: Unimicron Technology Corp.Inventors: Ra-Min Tain, Pei-Chang Huang, Chi-Chun Po, Chun-Lin Liao, Po-Hsiang Wang, Hsuan-Wei Chen
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Publication number: 20200329565Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.Type: ApplicationFiled: January 10, 2020Publication date: October 15, 2020Applicant: Unimicron Technology Corp.Inventors: Ra-Min Tain, Pei-Chang Huang, Chi-Chun Po, Chun-Lin Liao, Po-Hsiang Wang, Hsuan-Wei Chen
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Patent number: 10655789Abstract: A lighting bulb according to embodiments of the disclosure comprises a light source assembly, a base and a transparent top cap. The light source assembly has a carrier plate, a first plurality of light-emitting units and a second plurality of light-emitting units. The carrier plate has first and second surfaces. The base is for fixing the carrier plate to have the first surface facing to a first direction and the second surface facing to a second direction opposite to the first direction. The transparent top cap has an inner surface facing to a third direction perpendicular to the first and second directions. The first and second plurality of light-emitting units are located between the transparent top cap and the base.Type: GrantFiled: January 16, 2018Date of Patent: May 19, 2020Assignee: Epistar CorporationInventors: Been-Yu Liaw, Hsuan-Wei Chen, Jian-Qin Liang, Kang-Sen Huang, Zhi-Guang Shen
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Publication number: 20180202613Abstract: A lighting bulb according to embodiments of the disclosure comprises a light source assembly, a base and a transparent top cap. The light source assembly has a carrier plate, a first plurality of light-emitting units and a second plurality of light-emitting units. The carrier plate has first and second surfaces. The base is for fixing the carrier plate to have the first surface facing to a first direction and the second surface facing to a second direction opposite to the first direction. The transparent top cap has an inner surface facing to a third direction perpendicular to the first and second directions. The first and second plurality of light-emitting units are located between the transparent top cap and the base.Type: ApplicationFiled: January 16, 2018Publication date: July 19, 2018Inventors: Been-Yu Liaw, Hsuan-Wei Chen, Jian-Qin Liang, Kang-Sen Huang, Zhi-Guang Shen
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Patent number: D770064Type: GrantFiled: July 13, 2015Date of Patent: October 25, 2016Assignee: EPISTAR CORPORATIONInventors: Wei-Chiang Hu, Chiu-Lin Yao, Hsuan-Wei Chen
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Patent number: D777953Type: GrantFiled: September 23, 2015Date of Patent: January 31, 2017Assignee: EPISTAR CORPORATIONInventors: Ming-Huang Hsu, Hsuan-Wei Chen