Abstract: A precharge method for a data driver includes steps of: outputting a display data to a plurality of output terminals of the data driver; outputting a second precharge voltage to an output terminal among the plurality of output terminals prior to outputting the display data to the output terminal, to precharge the output terminal to a voltage level closer to an output voltage; and outputting a first precharge voltage to the output terminal prior to outputting the second precharge voltage. The first precharge voltage provides a faster voltage transition on the output terminal than the second precharge voltage.

Abstract: A wound capacitor package structure and a method of manufacturing the same are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly, a package casing and a protruding sealing element. The conductive assembly includes a first conductive pin and a second conductive pin. The package casing is configured to receive the wound assembly. The protruding sealing element is arranged inside and cooperates with the package casing. The package casing is configured to receive the wound assembly. The protruding sealing element is disposed inside the package casing and cooperating with the package casing. The package casing has a surrounding concave position-limiting portion recessed inward, and a surrounding convex end portion protruding from the surrounding concave position-limiting portion.

Abstract: A board-level pad pattern includes a corner pad unit disposed at a corner of a surface mount region for mounting a multi-row QFN package. The corner pad unit includes at least a reversed-L-shaped pad. The reversed-L-shaped pad is disposed in proximity to an apex of the corner of the surface mount region.

Abstract: A board-level pad pattern includes a printed circuit board (PCB) substrate; an exposed pad region disposed within a surface mount region of the base substrate; and multiple staggered ball pads disposed within the surface mount region arranged in a ring shape around the exposed pad region. The staggered ball pads includes first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch. Multiple square-shaped ball pads are arranged in a third row between the exposed pad region and the staggered ball pads.

Abstract: A board-level pad pattern includes staggered ball pads disposed within a surface mount region for mounting a multi-row QFN package. The staggered ball pads include first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch.

Abstract: The present disclosure provides a wound capacitor package structure without negative conductive foil and a wound assembly thereof. The wound capacitor package structure includes a wound assembly, a package assembly, and a conductive assembly. The wound assembly includes a wound positive conductive foil and a wound separator paper mated with the wound positive conductive foil. The package assembly is used for enclosing the wound assembly. The conductive assembly includes a first conductive pin electrically contacting the wound positive conductive foil and a second conductive pin electrically contacting the wound separator paper. The wound separator paper has a plurality of conductive materials disposed therein, so that the wound separator paper with the conductive polymer materials can be used as a negative conductive paper.

Abstract: The present disclosure provides a wound capacitor package structure and a wound assembly thereof. The wound capacitor package structure includes a wound assembly, a package assembly, and a conductive assembly. The wound assembly includes a wound positive conductive foil, a wound negative conductive foil, and two wound separator papers. The package assembly is used for enclosing the wound assembly. The conductive assembly includes a first conductive pin electrically contacting the wound positive conductive foil and a second conductive pin electrically contacting the wound negative conductive foil. The wound positive conductive foil has a first predetermined width, the wound negative conductive foil has a second predetermined width, each of the two wound separator papers has a third predetermined width, and the first predetermined width of the wound positive conductive foil and the second predetermined width of the wound negative conductive foil are different.

Abstract: A semiconductor device comprises a substrate, an active layer over the substrate, and an insulating layer between the substrate and the active layer. The insulating layer is doped with one of positive charge and negative charge and configured to establish an electric field across the active layer when the semiconductor device is powered.

Abstract: A semiconductor device comprises a substrate, an active layer over the substrate, and an insulating layer between the substrate and the active layer. The insulating layer is doped with one of positive charge and negative charge and configured to establish an electric field across the active layer when the semiconductor device is powered.

Abstract: The present invention provides a method for treating arthritic disorders, skin inflammatory disorders and pain, comprising administering to a subject an extract of Andrographis paniculata Nees, and also provides a herbal composition used therefor that comprises the extract of Andrographis paniculata Nees.