Abstract: A lock structure. The lock structure includes a first element, a second element, a guiding element and a fixing pin. The first element has a guide hole and a first through hole located under the guide hole. The second element is deposed under the first element and has a second through hole that is co-axially aligned with the first through hole. The guiding element rotates and is movably disposed in the guide hole. The guiding element has a third through hole aligned with the first through hole. The fixing pin is inserted through the third through hole, guide hole, first through hole and second through hole and has a first retaining portion. The first retaining portion is formed on the lower portion of the fixing pin and located under the second element.

Abstract: A lock structure. The lock structure includes a first element, a second element, a guiding element and a fixing pin. The first element has a guide hole and a first through hole located under the guide hole. The second element is deposed under the first element and has a second through hole that is co-axially aligned with the first through hole. The guiding element rotates and is movably disposed in the guide hole. The guiding element has a third through hole aligned with the first through hole. The fixing pin is inserted through the third through hole, guide hole, first through hole and second through hole and has a first retaining portion. The first retaining portion is formed on the lower portion of the fixing pin and located under the second element.

Abstract: An apparatus and method for adjusting the position of a load port utilized in a semiconductor wafer processing system. Generally, a door opener can be configured for opening a door through which a semiconductor wafer may enter for subsequent positioning and processing thereof by a semiconductor wafer processing system. A load port is associated with the door opener. A calibration mechanism can then be utilized for calibrating the load port for leveling and height positioning, such that a plurality of directional axis associated with the load port do not interfere with one another, thereby conserving calibration time while permitting a single individual to perform calibration operations thereof.

Abstract: An apparatus and method for adjusting the position of a load port utilized in a semiconductor wafer processing system. Generally, a door opener can be configured for opening a door through which a semiconductor wafer may enter for subsequent positioning and processing thereof by a semiconductor wafer processing system. A load port is associated with the door opener. A calibration mechanism can then be utilized for calibrating the load port for leveling and height positioning, such that a plurality of directional axis associated with the load port do not interfere with one another, thereby conserving calibration time while permitting a single individual to perform calibration operations thereof.

Abstract: An apparatus and a method for aligning a loadport on a process machine are disclosed. The apparatus is constructed by a base plate, an alignment block mounted on the base plate, a light source and an optical detector. The alignment block is provided with an aperture extending longitudinally through the block, or formed in a T-shape extending both longitudinally and transversely through the block. The light source may be suitably a laser emission source, or a laser source that operates in a pulse mode. The diameter of the aperture provided in the alignment block should be sufficiently small, i.e. smaller than 5 mm, and preferably smaller than 3 mm.

Abstract: An apparatus and a method for aligning a loadport on a process machine are disclosed. The apparatus is constructed by a base plate, an alignment block mounted on the base plate, a light source and an optical detector. The alignment block is provided with an aperture extending longitudinally through the block, or formed in a T-shape extending both longitudinally and transversely through the block. The light source may be suitably a laser emission source, or a laser source that operates in a pulse mode. The diameter of the aperture provided in the alignment block should be sufficiently small, i.e. smaller than 5 mm, and preferably smaller than 3 mm.