Patents by Inventor Hsun-Chin Liu

Hsun-Chin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT EMITTING DIODE CHIP, LIGHT EMITTING DIODE PACKAGE STRUCTURE, AND METHOD FOR FORMING THE SAME
    Publication number: 20130087823
    Abstract: A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than 0. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency.
    Type: Application
    Filed: August 3, 2011
    Publication date: April 11, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yao-Jun Tsai, Chen-Peng Hsu, Kuo-Feng Lin, Hsun-Chin Liu, Ji-Feng Chen, Hung-Lieh Hu, Chien-Jen Sun