Abstract: A server of an elastic computing cloud system includes a block device driver apparatus and at least a block device service apparatus. The server implements a hot deployment for a storage service, such that an upgrade of the storage service may be performed without interrupting the storage service. The block device driver apparatus maintains a waiting queue and a pending queue for each storage service. In response to determining a storage service will perform an upgrade, the block device driver apparatus stops processing data write/read requests that are maintained in the pending queue for the service, and puts the data write/read requests that are currently processed in the pending queue back to the waiting queue for re-dispatching, thus realizing completion of processing the upgrade of the storage service in the elastic computing cloud system without interrupting the storage service.

Abstract: A server of an elastic computing cloud system includes a block device driver apparatus and at least a block device service apparatus. The server implements a hot deployment for a storage service, such that an upgrade of the storage service may be performed without interrupting the storage service. The block device driver apparatus maintains a waiting queue and a pending queue for each storage service. In response to determining a storage service will perform an upgrade, the block device driver apparatus stops processing data write/read requests that are maintained in the pending queue for the service, and puts the data write/read requests that are currently processed in the pending queue back to the waiting queue for re-dispatching, thus realizing completion of processing the upgrade of the storage service in the elastic computing cloud system without interrupting the storage service.

Abstract: A computer-implemented method, apparatus, and computer usable program code for cross-silo query and data retrieval. A request to access a data object in a trusted database is received, wherein the request includes an enterprise-wide unique identifier of a data object or one or more metadata attribute value pairs. If the request comprises one or more metadata attribute value pairs, one or more enterprise-wide unique identifiers associated with the metadata attribute value pairs are identified. Using the enterprise-wide unique identifiers, metadata about the data object stored in one or more enterprise-level data stores or the trusted database is retrieved. The metadata about the data object is queried to identify related data objects in disparate trusted databases in the enterprise system. The data object and the related data objects are provided to the application.

Abstract: A computer-implemented method, apparatus, and computer usable program code for cross-silo query and data retrieval. A request to access a data object in a trusted database is received, wherein the request includes an enterprise-wide unique identifier of a data object or one or more metadata attribute value pairs. If the request comprises one or more metadata attribute value pairs, one or more enterprise-wide unique identifiers associated with the metadata attribute value pairs are identified. Using the enterprise-wide unique identifiers, metadata about the data object stored in one or more enterprise-level data stores or the trusted database is retrieved. The metadata about the data object is queried to identify related data objects in disparate trusted databases in the enterprise system. The data object and the related data objects are provided to the application.

Abstract: A ceramic substrate (100) includes a top surface, a plurality of identification marks (104), a protective compound (110), a bottom surface, and a plurality of grooves (106). The top surface includes a first area and a second area. The first area is defined at one or more edges portions of the top surface. The second area is defined inside the first area. The identification marks are arranged on the first area. The protective compound is covered on the second area. The grooves are defined at the bottom surface, and corresponding to the identification marks. A related method for breaking a ceramic substrate includes: (a) pasting one or more tapes on the first area; (b) covering protective compound on the second area; (c) removing the tapes; (d) cutting the protective compound according to the identification marks; and (e) breaking the ceramic substrate into individual circuit unit pieces along the grooves.

Abstract: An exemplary Electromagnetic Interference (EMI) shielding package (1) includes a substrate (10), a metal cap (15), and a potting compound (18). The substrate has a plurality of electronic components (11a, 11b, 12) fixed thereon. The metal cap includes a horizontal base panel (152) and a plurality of peripheral walls (151) vertical to the base panel. A related method for making the EMI shielding package includes: providing a substrate with a plurality of electronic components fixed thereon; providing a metal cap including a horizontal base panel and a plurality of peripheral walls vertical to the base panel; attaching the walls to the substrate, thereby covering selected one or more of the electronic components that need to be shielded with the metal cap; sealing the electronic components and the metal cap with a potting compound; and curing the potting compound to form an encapsulation.

Abstract: An exemplary Electromagnetic Interference (EMI) shielding package (1) includes a substrate (10), a metal cap (15), and a potting compound (18). The substrate has a plurality of electronic components (11a, 11b, 12) fixed thereon. The metal cap includes a horizontal base panel (152) and a plurality of peripheral walls (151) vertical to the base panel. A related method for making the EMI shielding package includes: providing a substrate with a plurality of electronic components fixed thereon; providing a metal cap including a horizontal base panel and a plurality of peripheral walls vertical to the base panel; attaching the walls to the substrate, thereby covering selected one or more of the electronic components that need to be shielded with the metal cap; sealing the electronic components and the metal cap with a potting compound; and curing the potting compound to form an encapsulation.

Abstract: A ceramic substrate (100) includes a top surface, a plurality of identification marks (104), a protective compound (110), a bottom surface, and a plurality of grooves (106). The top surface includes a first area and a second area. The first area is defined at one or more edges portions of the top surface. The second area is defined inside the first area. The identification marks are arranged on the first area. The protective compound is covered on the second area. The grooves are defined at the bottom surface, and corresponding to the identification marks. A related method for breaking a ceramic substrate includes: (a) pasting one or more tapes on the first area; (b) covering protective compound on the second area; (c) removing the tapes; (d) cutting the protective compound according to the identification marks; and (e) breaking the ceramic substrate into individual circuit unit pieces along the grooves.

Abstract: A light emitting diode is disclosed that includes a support structure and a Group III nitride light emitting active structure mesa on the support structure. The mesa has its sidewalls along an indexed crystal plane of the Group III nitride. A method of forming the diode is also disclosed that includes the steps of removing a substrate from a Group III nitride light emitting structure that includes a sub-mount structure on the Group III nitride light emitting structure opposite the substrate, and thereafter etching the surface of the Group III nitride from which the substrate has been removed with an anisotropic etch to develop crystal facets on the surface in which the facets are along an index plane of the Group III nitride. The method can also include etching the light emitting structure with an anisotropic etch to form a mesa with edges along an index plane of the Group III nitride.