Patents by Inventor Hua Lee

Hua Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12005220
    Abstract: The application provides a dissolvable microneedle device to deliver immune stimulants to the skin. The application also provides a method of treating a skin condition comprising applying a dissolvable microneedle device to the skin.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: June 11, 2024
    Assignee: Veradermics Incorporated
    Inventors: Reid Waldman, Madeline DeWane, Ming Hua Lee, Lauren Sweeney Durso
  • Publication number: 20240185850
    Abstract: A method includes extracting, using a keyword detection model, audio features from audio data. The method also includes processing the audio features by a first layer of the keyword detection model configured to predict a first likelihood that the audio data includes speech. The method also includes processing the audio features by a second layer of the keyword detection model configured to predict a second likelihood that the audio data includes keyword-like speech. The method also includes processing the audio features by a third layer of the keyword detection model configured to predict a third likelihood, for each of a plurality of possible keywords, that the audio data includes the keyword. The method also includes identifying a keyword included in the audio data. The method also includes generating instructions to perform an action based at least in part on the identified keyword.
    Type: Application
    Filed: July 14, 2023
    Publication date: June 6, 2024
    Inventors: Rakshith Sharma Srinivasa, Yashas Malur Saidutta, Ching-Hua Lee, Chou-Chang Yang, Yilin Shen, Hongxia Jin
  • Publication number: 20240186373
    Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.
    Type: Application
    Filed: February 7, 2024
    Publication date: June 6, 2024
    Inventors: Po-Yu Lin, Wei-Yang Lee, Chia-Pin Lin, Tzu-Hua Chiu, Kuan-Hao Cheng, Wei-Han Fan, Li-Li Su, Wei-Min Liu
  • Publication number: 20240182460
    Abstract: The disclosure relates to compounds of Formula (I) as allosteric chromenone inhibitors of phosphoinositide 3-kinase (PI3K) useful in the treatment of diseases or disorders associated with PI3K modulation, Formula (I): or pharmaceutically acceptable salts thereof wherein R1, R2, R3, R4, R5, R6, R7, and R8, are as defined herein. The disclosure also relates to methods of making and using compounds of Formula (I) or pharmaceutically acceptable salts thereof.
    Type: Application
    Filed: October 31, 2023
    Publication date: June 6, 2024
    Inventors: Surendra DAWADI, Hua-Yu WANG, Marcos SAINZ, Gabrielle R. KOLAKOWSKI, Nathan Edward WRIGHT, Christopher Glenn MAYNE, Gerit Maria POTOTSCHNIG, Erin ANDERSON, Warren Christopher CHAN, Shuai CHEN, Manoj KUMAR, Kyunga LEE, Ganesh MURHADE, Mariam Nader SALIB, Latoya Denise SCAGGS, Xia WANG, Thomas IRVIN, Alfredo PICADO VALENZUELA, Katelyn LONG, Carina JETTE
  • Publication number: 20240186163
    Abstract: The present invention provides a measuring apparatus for measuring a wafer carrier having an opening end and at least one gas tower deposited inside, the measuring apparatus comprising a carrying interface for securing the wafer carrier. The opening end of the wafer carrier faces an inspection space of measuring apparatus. The carrying interface having a gas supplying assembly connected to a base of the wafer carrier so as to supply gas to the wafer carrier. The internal of the inspection space disposed a measuring assembly which is mainly used to measure gas flow rate from the gas tower in the accommodating space. The measuring assembly comprises a plurality of wind speed sensing elements and a plurality of displacement sensing element, which are fitted to the a second connecting element.
    Type: Application
    Filed: September 25, 2023
    Publication date: June 6, 2024
    Inventors: Ming-Chien CHIU, Chia-Ho CHUANG, Kuo-Hua Lee, Xin-Yuan HUANG, En-Nien Shen, Jyun-Ming Lyu
  • Publication number: 20240180091
    Abstract: Apparatus, systems and methods for irrigating lands are disclosed. In one example, an irrigation system is disclosed. The irrigation system includes a gate and a microcontroller unit (MCU). The gate is configured for adjusting a water flow for irrigating a piece of land. The MCU is configured for controlling the gate to adjust the water flow based on environmental information related to the piece of land.
    Type: Application
    Filed: February 9, 2024
    Publication date: June 6, 2024
    Inventors: Ting-Cheng HUANG, Tai-Hua YU, Shui-Ting YANG, Chao-Te LEE, Ching Rong LU
  • Publication number: 20240177893
    Abstract: An over-current protection device includes a heat-sensitive layer and an electrode layer. The electrode layer includes a top metal layer and a bottom metal layer, and the heat-sensitive layer attached therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a conductive filler. The polymer matrix includes a polyolefin-based homopolymer and a polyolefin-based copolymer. The polyolefin-based homopolymer has a first coefficient of thermal expansion (CTE), and the polyolefin-based copolymer has a second CTE lower than the first CTE. The polyolefin-based homopolymer and the polyolefin-based copolymer together form an interpenetrating polymer network (IPN).
    Type: Application
    Filed: May 3, 2023
    Publication date: May 30, 2024
    Inventors: CHENG-YU TUNG, Chia-Yuan Lee, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU, Takashi Hasunuma
  • Publication number: 20240177756
    Abstract: A magnetic random access memory (MRAM) structure is provided. The MRAM structure includes a first write electrode, a first magnetic tunnel junction (MTJ) stack, a voltage control electrode, a second MTJ stack, and a second write electrode. The first MTJ stack includes a first free layer disposed on the first write electrode, a first tunnel barrier layer disposed on the first free layer, and a first fixed layer disposed on the first tunnel barrier layer. The voltage control electrode is disposed on the first MTJ stack. The second MTJ stack includes a second fixed layer disposed on the voltage control electrode, a second tunnel barrier layer disposed on the second fixed layer, and a second free layer disposed on the second tunnel barrier layer. The second write electrode is disposed on the second MTJ stack.
    Type: Application
    Filed: December 23, 2022
    Publication date: May 30, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Hsin-Han LEE, Jeng-Hua WEI, Shan-Yi YANG, Yu-Chen HSIN
  • Publication number: 20240177482
    Abstract: A method for multimedia image processing includes steps of identifying objects and selecting images, and is characterized in that when a body position of a preset object is detected and conformed to match a preset posture; or a plurality of the preset objects are detected to have body movements and facial expressions that are emotional, and the preset objects have at least one of looking in similar directions, one looking at the other, and at least two looking at each other, an interception time point is selected for selecting a candidate image, and the candidate image can be collected to produce a concatenated video with rich contents. An electronic device is also introduced for multimedia image processing, a terminal device connected thereto, and a non-transitory computer-readable recording medium.
    Type: Application
    Filed: November 27, 2023
    Publication date: May 30, 2024
    Inventors: PIN-YU CHOU, YUEH-HUA LEE, MING-HSIEN WU, HUI-MEI HUNG
  • Publication number: 20240166498
    Abstract: Disclosed is a responsive platform, which includes a polymer-grafted nanopillar array, cargo-containing entities, first conjugatable moieties, and second conjugatable moieties. The polymer-grafted nanopillar array includes thermoresponsive polymer brushes grafted onto surfaces of nanopillars, and the cargo-containing entities are attached to the thermoresponsive polymer brushes through non-covalent association between the first conjugatable moieties and the second conjugatable moieties. Accordingly, the cargo-containing entities can be released from the nanopillar array for cellular uptake in a controlled manner by applying thermal stimulus.
    Type: Application
    Filed: November 7, 2022
    Publication date: May 23, 2024
    Inventors: Hsiao-hua YU, Hsien-Ming LEE, Bhaskarchand Sureshchand Gautam
  • Patent number: 11990258
    Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: May 21, 2024
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Hsiu-Che Yen, Yung-Hsien Chang, Cheng-Yu Tung, Chen-Nan Liu, Chia-Yuan Lee, Yu-Chieh Fu, Yao-Te Chang, Fu-Hua Chu
  • Patent number: 11990381
    Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Po-Yuan Teng, Chen-Hua Yu
  • Patent number: 11990512
    Abstract: The present disclosure relates to a semiconductor device includes first and second source/drain (S/D) regions doped with lead (Pb) at a first dopant concentration. The semiconductor device also includes a channel region between the first and second S/D regions, where the channel region is doped with Pb at a second dopant concentration that is lower than the first dopant concentration. The semiconductor device further includes first and second S/D contacts in contact with the first and second S/D regions, respectively. The semiconductor device also includes a gate electrode over the channel region.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Miao-Syuan Fan, Pei-Wei Lee, Ching-Hua Lee, Jung-Wei Lee
  • Patent number: 11990510
    Abstract: A semiconductor device, includes a channel region, and a source/drain region adjacent to the channel region. The source/drain region includes a first epitaxial layer, a second epitaxial layer epitaxially formed on the first epitaxial layer and a third epitaxial layer epitaxially formed on the second epitaxial layer, and the first epitaxial layer is made of SiAs.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Yi Peng, Ting Tsai, Chung-Wei Hung, Jung-Ting Chen, Ying-Hua Lai, Song-Bor Lee, Bor-Zen Tien
  • Publication number: 20240162109
    Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.
    Type: Application
    Filed: January 10, 2023
    Publication date: May 16, 2024
    Inventors: Hung-Yi Kuo, Chen-Hua Yu, Kuo-Chung Yee, Yu-Jen Lien, Ke-Han Shen, Wei-Kong Sheng, Chung-Shi Liu, Szu-Wei Lu, Tsung-Fu Tsai, Chung-Ju Lee, Chih-Ming Ke
  • Patent number: 11985904
    Abstract: A method of manufacturing a semiconductor device includes: providing a substrate, the substrate defining a logic region and a memory region; depositing a bottom electrode layer across the logic region and the memory region; depositing a magnetic tunnel junction (MTJ) layer over the bottom electrode layer; depositing a first conductive layer over the MTJ layer; depositing a sacrificial layer over the first conductive layer; etching the sacrificial layer in the memory region to expose the first conductive layer in the memory region while keeping the first conductive layer in the logic region covered; depositing a second conductive layer in the memory region and the logic region; patterning the second conductive layer to expose the MTJ layer in the memory region; and etching the patterned second conductive layer and the MTJ layer to form a top electrode and an MTJ, respectively, in the memory region.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Jen Chien, Jung-Tang Wu, Szu-Hua Wu, Chin-Szu Lee, Meng-Yu Wu
  • Publication number: 20240154629
    Abstract: A 24 GHz band-pass filter includes a step impedance resonator, a first U-shape feeding portion, a second U-shape feeding portion, short-circuit stubs and open-circuit stubs. The step impedance resonator includes a first main portion, a second main portion, and a connection portion for connecting the main portions to each other. The first main portion and the second main portion are electrically connected to a first signal input/output port and a second signal input/output port. The first U-shape feeding portion is electrically connected between the first main portion and the first signal input/output port. The second U-shape feeding portion is electrically connected between the second main portion and the second signal input/output port. The short-circuit stubs are electrically connected to coupling segments of the step impedance resonator. The open-circuit stubs are electrically connected to the first U-shape feeding portion and the second U-shape feeding portion.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 9, 2024
    Inventors: Kun Yen TU, Meng-Hua TSAI, Wei Ting LEE, Sin-Siang WANG
  • Publication number: 20240153630
    Abstract: A medical decision supporting apparatus according to an embodiment may include a visual and linguistic neural learner, which receives a medical image and extracts visual embedding, a cause miner, which extracts a predetermined index based on the visual embedding and pretrained embedding, and outputs a predetermined cause for the medical image based on a hash map including at least one index-concept pair and the extracted predetermined index, a logical reasoner, which generates a medical report based on the visual embedding, a background knowledge graph, and the predetermined cause, and a proof inference unit, which generates an answer including a proof for a user's question about the medical image based on the predetermined cause and the medical report.
    Type: Application
    Filed: March 20, 2023
    Publication date: May 9, 2024
    Inventors: Sung Young LEE, Hao HUA-CAM, Ubaid Ur REHMAN
  • Publication number: 20240150699
    Abstract: An electroporation system including one or more of a pipette, a pipette tip, a pipette docking assembly, and a pulse generator. The pipette docking assembly includes a pipette station, a pipette station guard, and a reservoir (e.g., a buffer tube). A method for transfecting a cell with a payload including providing an electroporation system, providing the cell, providing the payload, introducing the cell and the payload into a pipette tip, and electroporating the cell within the pipette tip by operating the electroporation system.
    Type: Application
    Filed: September 15, 2023
    Publication date: May 9, 2024
    Inventors: Han WEI, Chee Wai CHAN, Wui Khen LIAW, Shan Hua DONG, See Chen GOH, Huei Steven YEO, Harmon Cosme SICAT, JR., Mio Xiu Lu LING, Josh M. MEAD, Mikko MAKINEN, Beng Heng LIM, Kuan Moon BOO, Justina Linkai BONG, Chye Sin NG, Wee Liam LIM, Li Yang LIM, Way Xuang LEE
  • Patent number: 11978678
    Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: May 7, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Tung-Kai Liu, Tsau-Hua Hsieh, Wei-Cheng Chu, Chun-Hsien Lin, Chandra Lius, Ting-Kai Hung, Kuan-Feng Lee, Ming-Chang Lin, Tzu-Min Yan, Hui-Chieh Wang