Abstract: A printed circuit board (PCB) includes a receiver component, a transmission line including a positive signal transmission line and a negative signal transmission line, a transmitter component, and a capacitance unit. The transmitter component transmits a different signal to the receiver component via the transmission line. The capacitance unit is spaced from the receiver component a predetermined distance S, therein, the predetermined distance S is calculated by a formula S=Vx (n*UI?(C1+C2)×Zo/2)/2, and V is a speed of the transmission line. C1 is an equivalent capacitance value of the receiver component, C2 is a capacitance value of the capacitance unit, Zo is a resistance value of the transmission line, UI is a half of one cycle of the differential signal, and n is a value less than or equal to 1.5 and greater than or equal to 0.5.

Abstract: A printed circuit board (PCB) includes a receiver component, a transmission line including a positive signal transmission line and a negative signal transmission line, a transmitter component, and a capacitance unit. The transmitter component transmits a different signal to the receiver component via the transmission line. The capacitance unit is spaced from the receiver component a predetermined distance S, therein, the predetermined distance S is calculated by a formula S=Vx (n*UI?(C1+C2)×Zo/2)/2, and V is a speed of the transmission line. C1 is an equivalent capacitance value of the receiver component, C2 is a capacitance value of the capacitance unit, Zo is a resistance value of the transmission line, UI is a half of one cycle of the differential signal, and n is a value less than or equal to 1.5 and greater than or equal to 0.5.

Abstract: A pad includes a first mating section and a second mating section. The first mating section includes a first horizontal plane and a first inclined plane. The second mating section includes a second horizontal plane and a second inclined plane. The first mating section is a copper foil capable of being connected to a wire. The second mating section is made of insulating material. The first inclined plane and the second inclined plane are bonded together.

Abstract: A printed circuit board includes a signal layer and a reference layer. The signal layer is covered with copper foil. A circuit topology for multiple loads is set on the signal layer. The circuit topology includes a driving terminal, a first signal receiving terminal, and a second signal receiving terminal. The driving terminal is connected to a node through a first transmission line. The node is connected to the first and second signal receiving terminals respectively through a second and a third transmission lines. A difference between lengths of the second and third transmission lines is greater than a product of a transmission speed and a rise time of signals from the driving terminal. The reference layer is covered with copper foil, and arranged under the signal layer. A region without copper foil is formed on the reference layer, under the second transmission line.

Abstract: A printed circuit board includes an insulation layer and a signal layer attached to the insulation layer. The signal layer includes a pair of differential transmission lines. Width W of each of the differential transmission lines is changed according to change of space S between the differential transmission lines, based on the following formula: W = C ? ? 1 × H × ( C ? ? 2 × H 0.8 ? W 0 + T ) C ? ? 3 × ? C ? ? 4 × S 0 H - 1 1 - C ? ? 3 × ? C ? ? 4 × S H - 1.25 ? T In above formula, C1=7.475, C2=5.98, C3=0.48, C4=?0.96, H is a thickness of the insulation layer, W0 is an original width of each of the differential transmission lines, and S0 is an original space between the differential transmission lines, and T is a thickness of each of the differential transmission lines.

Abstract: A printed circuit board includes a signal layer and a reference layer. The signal layer is covered with copper foil. A circuit topology for multiple loads is set on the signal layer. The circuit topology includes a driving terminal, a first signal receiving terminal, and a second signal receiving terminal. The driving terminal is connected to a node through a first transmission line. The node is connected to the first and second signal receiving terminals respectively through a second and a third transmission lines. A difference between lengths of the second and third transmission lines is greater than a product of a transmission speed and a rise time of signals from the driving terminal. The reference layer is covered with copper foil, and arranged under the signal layer. A region without copper foil is formed on the reference layer, under the second transmission line.

Abstract: A circuit topology for multiple loads includes a driving terminal, first and second signal receiving terminals, and a capacitor. The driving terminal is connected to a node through a first transmission line. The node is connected to the first and second signal receiving terminals through second and third transmission lines. The second transmission line is longer than the third transmission line, and a difference between lengths of the second and third transmission lines is greater than a product of a transmission speed and a rise time of signals from the driving terminal. A first terminal of the capacitor is connected to the third transmission line. A second terminal of the capacitor is grounded. A distance between the capacitor and the second signal receiving terminal is less than a distance between the capacitor and the node.

Abstract: A pad includes a first mating section and a second mating section. The first mating section includes a first horizontal plane and a first inclined plane. The second mating section includes a second horizontal plane and a second inclined plane. The first mating section is a copper foil capable of being connected to a wire. The second mating section is made of insulating material. The first inclined plane and the second inclined plane are bonded together.

Abstract: A circuit board includes a substrate and a copper layer positioned on the substrate. The copper layer includes a BGA area and a non-BGA area, and includes traces. The widths of the traces in the BGA area are smaller than the widths of the traces in the non-BGA area, the dielectric coefficient of the substrate in the BGA area is greater than the dielectric coefficient of the substrate in the non-BGA area for keeping the impedance of the traces consistent in the BGA area and in the non-BGA area.

Abstract: A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation: W 1 ? 8 ? Wpad + 10 ? T 0.8 ? Wtrace + T , wherein Wpad is a width of the pad, Wtrace is a width of the transmission line, T is the height of the pad.

Abstract: A printed circuit board includes an insulation layer and a signal layer attached to the insulation layer. The signal layer includes a pair of differential transmission lines. Width W of each of the differential transmission lines is changed according to change of space S between the differential transmission lines, based on the following formula: W = C ? ? 1 × H × ( C ? ? 2 × H 0.8 ? W 0 + T ) C ? ? 3 × ? C ? ? 4 × S 0 H - 1 1 - C ? ? 3 × ? C ? ? 4 × S H - 1.25 ? T In above formula, C1=7.475, C2=5.98, C3=0.48, C4=?0.96, H is a thickness of the insulation layer, W0 is an original width of each of the differential transmission lines, and S0 is an original space between the differential transmission lines, and T is a thickness of each of the differential transmission lines.

Abstract: A printed circuit board (PCB) includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path.

Abstract: A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation: W 1 ? 8 ? Wpad + 10 ? T 0.8 ? Wtrace + T , wherein Wpad is a width of the pad, Wtrace is a width of the transmission line, T is the height of the pad.