Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.

Abstract: Techniques support graph pattern matching queries inside a relational database management system (RDBMS) that supports SQL execution. The techniques compile a graph pattern matching query into a SQL query that can then be executed by the relational engine. As a result, techniques enable execution of graph pattern matching queries on top of the relational engine by avoiding any change in the existing SQL engine.

Abstract: The present application provides a transparent conductive oxide film and a heterojunction solar cell, which relates to the technical field of solar cells. The transparent conductive oxide film includes a seed layer, a conductive layer and a protection layer. The seed layer includes an indium tin oxide film or a gallium/aluminum co-doped zinc oxide film. The conductive layer is a gallium/aluminum co-doped zinc oxide film. The protection layer is an indium tin oxide film. The thickness of the indium tin oxide film in the transparent conductive oxide film is smaller than the thickness of the gallium/aluminum co-doped zinc oxide film. It can ensure battery efficiency and reduce battery attenuation, while reducing costs.

Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.

Abstract: A metal 3D printing device comprises a building platform, a first powder spreading arm, a second powder spreading arm, a gas stream unit and a scanning module. The building platform is for supporting the powder. The first and second powder spreading arms are spaced and configured for spreading powder. The gas stream unites comprises a gas blowing port and a gas suction port, the gas blowing port is provided in the first powder spreading arm, and the gas suction port is provided in the second powder spreading arm. The scanning module is for emitting a laser to the powder preplaced between the first and second powder spreading arms to solidify the powder to form the product.

Abstract: A method includes placing a package component over a carrier. The package component includes a device die. A core frame is placed over the carrier. The core frame forms a ring encircling the package component. The method further includes encapsulating the core frame and the package component in an encapsulant, forming redistribution lines over the core frame and the package component, and forming electrical connectors over and electrically coupling to the package component through the redistribution lines.

Abstract: A method of operating an integrated circuit includes using a first switching device to couple a bio-sensing device to a first signal path, generating, using the bio-sensing device, a bio-sensing signal on the first signal path in response to an electrical characteristic of a sensing film, using a second switching device to couple a temperature-sensing device to a second signal path, and generating, using the temperature-sensing device, a temperature-sensing signal on the second signal path in response to a temperature of the sensing film. The first and second switching devices, the bio-sensing device, the temperature-sensing device, and the sensing film are components of a sensing pixel of a plurality of sensing pixels of the integrated circuit.

Abstract: A photographing apparatus and an inspection device are provided. The photographing apparatus comprises a camera, a light supplementing structure, and a closed housing; the camera is provided with a lens, and positioned in and connected to the housing; the housing is provided with at least one photographing portion configured to be attached to an object to be photographed, and a space is formed between the lens and the photographing portion; the light supplementing structure is positioned in and connected to the housing, the light supplementing structure is configured to emit light to said object through the space and the photographing portion, and the lens is configured to capture an image of said object via the photographing portion. The inspection device comprises a rack and the photographing apparatus, and the housing is connected to the rack.

Abstract: A power adapter includes a circuit board, an electromagnetic interference filter, a shielding element, a power factor correction (PFC) inductor, a transformer and heating elements. The circuit board has a front side and a back side corresponding to each other, and a first long side and a second long side parallel to each other. The front side of the circuit board is divided into a first region, a second region and a third region along an extending direction of the first long side. The electromagnetic interference filter is disposed in the first region and close to the first long side. The shielding element is disposed in the first region and close to the electromagnetic interference filter. The PFC inductor is disposed in the first region of the circuit board and close to the second long side. The PFC inductor has a first long axis. The transformer is disposed in the third region and close to the first long side.

Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

Abstract: A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings. A redistribution layer can also be formed to extend over the encapsulant, and the first die may be separated from the second die.

Abstract: A method of forming semiconductor structure includes attaching backsides of top dies to a front side of a bottom wafer, the bottom wafer comprising a plurality of bottom dies; forming first conductive pillars on the front side of the bottom wafer adjacent to the top dies; forming a first dielectric material on the front side of the bottom wafer around the top dies and around the first conductive pillars; and dicing the bottom wafer to form a plurality of structures, each of the plurality of structures comprising at least one of the top dies and at least one of the bottom dies.

Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.

Abstract: The present disclosure provides a superhydrophobic and self-cleaning anticoagulant composite coating material and a preparation method and use thereof, and relates to the technical field of biomedical materials. In the coating material provided by the present disclosure, a titanium dioxide nanotube-based structure increases microscopic roughness of a surface of a titanium-based metal substrate, and a hydrophobic modification layer reduces surface energy of the material. The rough structure and the hydrophobic modification layer have a synergistic effect to construct a superhydrophobic surface, making the surface of the material have self-cleaning characteristics and low adhesion. Air can be retained on the surface of the material to form an air layer, thereby reducing the contact area between the material and bacteria and platelets in the blood, and inhibiting adhesion of the bacteria, platelets, and plasma proteins to the material.

Abstract: An active control method and device for large deformation of a deep thin-bedded surrounding rock, the active control method includes: drill holes in the surrounding rock of a tunnel against a tunnel face, add the active control device containing a sleeve, a high-strength prestressed anchor bolt, a resin anchoring agent and a grouting device into drill holes, apply a preload to the anchor bolt when the resin anchoring agent has a certain strength, and carry out lag grouting in the surrounding rock through the grouting device after stress adjustment, and the high-strength prestressed anchor bolt and the grouting device are inserted in the sleeve with holes on the side. The active control device or method of the invention can effectively reduce the fracture depth and degree of a thin-bedded soft rock in deep engineering, and effectively inhibit the occurrence of large deformation disasters.

Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.

Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa·s.

Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0 ? ? ? T ? ? 1 T ? ? 2 ? A ? ( T ) ? dT - ? T ? ? 1 T ? ? 3 ? E ? ( T ) ? dT ? ? < 0.01 wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.

Abstract: According to the present disclosure, there is provided a device (2) and a method for measuring a wavelength for a laser device. The device (2) for measuring a wavelength for a laser device includes: a first optical path assembly and a second optical path assembly. The first optical path assembly and the second optical path assembly constitute a laser wavelength measurement optical path. The second optical path assembly includes: an FP etalon assembly (11) and an optical classifier (13). The homogenized laser beam passes through the FP etalon assembly (11) to generate an interference fringe. The optical classifier (13) is arranged after the FP etalon assembly (11) in the laser wavelength measurement optical path, and configured to deflect the laser beam passing through the FP etalon assembly (11).