Patents by Inventor Hua Ong

Hua Ong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package including rivet for bonding of lead posts
    Publication number: 20060012055
    Abstract: A semiconductor device (30,30?) includes a semiconductor die (32, 32?) having bonding pads (34, 34?) and ball bumps (38, 38?). Each of the ball bumps (38, 38?) has a base portion (40, 40?) and a protruding portion (42, 42?). The semiconductor die (32, 32?) is mounted on a lead frame having lead posts (44, 44?) such that each of the lead posts (44, 44?) is aligned to a respective one of the ball bumps (38, 38?). Each of the lead posts (44, 44?) has an opening (46, 46?) that extends from a first surface of the lead post (44, 44?) through to a second surface of the lead post (44, 44?). The opening (46, 46?) contains the protruding portion (42, 42?) of the respective one of the bumps (38, 38?) to facilitate alignment and bonding. A rivet (50, 50?) is formed from the protruding portion (42, 42?) of the respective one of the plurality of bumps (38, 38?) on the surface of the lead posts (44, 44?), which provides for bonding and securing of the lead posts (44, 44?) to the semiconductor die (32, 32?).
    Type: Application
    Filed: July 15, 2004
    Publication date: January 19, 2006
    Inventors: Chee Foong, Bee Liau, Wai Lo, Hua Ong
  • Watch
    Patent number: D638723
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: May 31, 2011
    Assignee: NSR Rubber Protective SDN BHD
    Inventor: Chin Hua Ong
  • Egg and toast tray
    Patent number: D947616
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: April 5, 2022
    Inventor: Sandy Lay Hua Ong