Patents by Inventor Hua Shu

Hua Shu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11976093
    Abstract: The disclosure discloses an ultrasonic-assisted pretreatment method for extraction of multiple steroid hormones in a sediment, including the following steps: (1) lyophilizing the sediment, grinding the sediment, and passing the ground sediment through a 40-60-mesh sieve; (2) placing the sample obtained in step (1) in a container; (3) adding an extractant to the container in step (2), shaking the mixture for 15 s-30 s, centrifuging the mixture to collect an supernatant after ultrasonication, and repeating extraction three times; where the extractants used in the three times of extraction are two of methanol, acetonitrile and acetone; and (4) after mixing the supernatants of the three times of extraction obtained in step (3), concentrating the mixture under a nitrogen flow at 20-30° C., passing the concentrated mixture through a filter, and performing detection. By using the method of the disclosure, the maximum recovery can be up to 100%.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: May 7, 2024
    Assignee: JIANGNAN UNIVERSITY
    Inventors: Hua Zou, Xin Luo, Ruihua Dai, Yun Zhang, Shu Shu, Zhengkai Zhou
  • Patent number: 11289568
    Abstract: The present disclosure relates to a MIM (metal-insulator-metal) capacitor having a top electrode overlying a substrate. A passivation layer overlies the top electrode. The passivation layer has a step region that continuously contacts and extends from a top surface of the top electrode to sidewalls of the top electrode. A metal frame overlies the passivation layer. The metal frame continuously contacts and extends from a top surface of the passivation layer to upper sidewalls of the passivation layer in the step region. The metal frame has a protrusion that extends through the passivation layer and contacts the top surface of the top electrode.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: March 29, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang, Wen-Chuan Tai, Yi-Chuan Teng, Yi Heng Tsai, You-Ru Lin, Yen-Wen Chen, Anderson Lin, Fu-Chun Huang, Chun-Ren Cheng, Ivan Hua-Shu Wu, Fan Hu, Ching-Hui Lin, Yan-Jie Liao
  • Patent number: 11056817
    Abstract: An electrical connector includes an insulative housing having opposite mating port and mounting port. Plural pairs of contacts are retained in the housing. Each pair of contacts has a first contact blade and a second contact blade. Each of the first contact blade and the second contact blade includes a main body, a contacting section extending into the mating port, and a mounting leg of the main body disposed in the mounting port. Each of the main body of the first contact blade and the main body of the second contact blade forms an embossment abutting against each other so as to electrically unify both the first contact blade and the second contact blade without blocking the space therebetween for enhancing heat dissipation thereof.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: July 6, 2021
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Yun-Kui Liang, Fang-Hua Shu, Yun Qi, Jian Shao, Zhi-Jian Chen, Xue-Wu Bu
  • Patent number: 10961118
    Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
  • Patent number: 10899608
    Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: January 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
  • Patent number: 10858984
    Abstract: A combustion system includes a remodeled diesel engine and a fuel composition to be added into the remodeled diesel engine. The remodeled diesel engine includes a cylinder unit, and a coating coated on the cylinder unit and containing a catalyst that is a metal, an alloy of the metal, a composite containing oxides of the metal, a salt of the metal or combinations thereof. The metal is platinum, nickel, cobalt, copper, molybdenum, and/or titanium. The fuel composition includes water, a fuel oil and an emulsifying agent. The amount of water ranges from 10 to 90 wt % based on total weight of water and the fuel oil, and the amount of the emulsifying agent ranges from 0.5 to 10 wt % relative to total weight of water and the fuel oil.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: December 8, 2020
    Inventors: Shigemi Sawada, Masahiro Tachi, Hua-Shu Chang
  • Patent number: D912028
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: March 2, 2021
    Assignee: SHENZHEN QIANHAI JERRY E-COMMERCE CO., LTD.
    Inventor: Hua Shu
  • Patent number: D914000
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: March 23, 2021
    Assignee: PERLE ELECTRONICS HARDWARE (HONG KONG) CO., LIMITED
    Inventor: Hua Shu
  • Patent number: D915366
    Type: Grant
    Filed: September 6, 2020
    Date of Patent: April 6, 2021
    Inventor: Hua Shu
  • Patent number: D918880
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: May 11, 2021
    Assignee: SHENZHEN MENGXIANGYUAN FITNESS DEVELOPMENT CO., LTD.
    Inventor: Hua Shu
  • Patent number: D919631
    Type: Grant
    Filed: May 17, 2020
    Date of Patent: May 18, 2021
    Inventor: Hua Shu
  • Patent number: D920340
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: May 25, 2021
    Inventor: Hua Shu
  • Patent number: D920675
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: June 1, 2021
    Inventor: Hua Shu
  • Patent number: D920988
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: June 1, 2021
    Assignee: SHENZHEN OUMAIGAO TECHNOLOGY CO., LTD.
    Inventor: Hua Shu
  • Patent number: D921645
    Type: Grant
    Filed: May 17, 2020
    Date of Patent: June 8, 2021
    Inventor: Hua Shu
  • Patent number: D922094
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: June 15, 2021
    Inventor: Hua Shu
  • Patent number: D922364
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: June 15, 2021
    Assignee: SHENZHEN MENGXIANGYUAN FITNESS DEVELOPMENT CO., LTD.
    Inventor: Hua Shu
  • Patent number: D922395
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: June 15, 2021
    Inventor: Hua Shu
  • Patent number: D928793
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: August 24, 2021
    Inventor: Hua Shu
  • Patent number: D944235
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: February 22, 2022
    Assignee: SHENZHEN BESTQI INNOVATION TECHNOLOGY CO., LTD
    Inventor: Hua Shu