Abstract: An exemplary method of error checking and correction applied in a multi-channel system, includes: performing error checking and correction encoding upon a first data packet of a first channel and a second data packet of a second channel, and generating a first horizontal error correction code and a second horizontal error correction code; performing error checking and correction encoding upon a first mixed data packet and a second mixed data packet, and generating a first vertical error correction code and a second vertical error correction code; and combining the first data packet, the first horizontal error correction code and the first vertical error correction code into the first encoded data packet of the first channel, and combining the second data packet, the second horizontal error correction code and the second vertical error correction code into the second encoded data packet of the second channel.

Abstract: A cloud learning system capable of enhancing learner's capability based on then-current contour or profile of levels or capabilities of the learner provides tests about a subject, a skill or expertise in advance to determine then-current contour or profile of capability of the test-taker. Then learning data or material is provided to a user for training, while the learning data or material is based on the test points or formats for the test implicitly or explicitly, contained or hidden in the test questions so as to enhance some weak areas of the user detected or diagnosed in the test. The capability of the learner is enhanced and the user has higher confidence to learn the subject, the skill or the expertise further. The structure can be constructed in a cloud network structure. External content-providers can provide their teaching material to the dedicated database based on specific test points or formats.

Abstract: A disk processing system having a heater chamber and dual single-sided sputter chambers each with a sustaining heater.

Abstract: An electronic device includes a housing and an installation assembly. The housing defines an opening. The installation assembly includes a fixing member and a holding member. The fixing member includes a base and a fixing portion protruding from the base. The base defines an entrance corresponding to the opening. The holding member comprising a holding portion and an engaging portion formed on an end of the holding portion. The fixing portion runs through the opening, and the base abuts against an outer surface of the housing with the entrance corresponding to the first opening. The engaging portion is engaged with the fixing portion to fix the holding member to the fixing member in the housing, and the engaging portion abuts against an inner surface of the housing, such that the installation assembly is fixed the housing surrounding the first opening.

Abstract: A memory control method, including: writing a write-in data which has a logical address into a write-in cache buffer; generating a write-in address mapping table which maps the logical address of the data to a physical address of a main memory, and writing the write-in address mapping table into a cached data mapping table write buffer; writing the write-in data into the main memory according to the write-in address mapping table; and when an available storage space of the cached data mapping table write buffer is reduced to reach a predetermined threshold, writing the address mapping table in the cached data mapping table write buffer into the main memory, and storing a corresponding main memory write-in address mapping table into a global mapping table buffer.

Abstract: A hard magnet may include a seed layer including a first component including at least one of a Pt-group metal, Fe, Mn, and Co, a cap layer comprising the first component, and a multilayer stack between the seed layer and the cap layer. In some embodiments, the multilayer stack may include a first layer of including the first component and a second component including at least one of a Pt-group metal, Fe, Mn, and Co, where the second component is different than the first component. The multilayer stack may further include a second layer formed over the first layer and including the second component, and a third layer formed over the second layer and including the first component and the second component.

Abstract: Systems and methods for forming magnetic media with an underlayer are provided. One such method includes providing a non-magnetic substrate, forming a seed layer above the substrate, the seed layer including MgO, forming an underlayer on the seed layer, the underlayer including a material selected from the group consisting of Pd, Pt, W, Fe, V, Cu, and Ag, and forming a magnetic recording layer on the underlayer, the recording layer including FePt oxide.

Abstract: An electronic device housing includes a bottom housing, a support plate, a display panel, and a side frame. The support frame is welded in the bottom housing. The display panel is positioned on the support plate. The side frame is connected to a top edge of the bottom housing, such that the display panel is sandwiched between the support plate and the side frame. A manufacturing method for an electronic device housing is also provided.

Abstract: An energy assisted magnetic recording (EAMR) system includes a magnetic recording medium including a plurality of bi-layers and a magnetic recording layer on the plurality of bi-layers, a magnetic transducer configured to write information to the magnetic recording medium, and a light source positioned proximate the magnetic transducer and configured to heat the magnetic recording medium. Each of the plurality of bi-layers includes a heatsink layer and an amorphous under-layer on the heatsink layer.

Abstract: The present invention relates to a data scanning circuit and method. According to the present invention, a memory circuit stores a plurality of codes. Each of the code corresponds to a sub-rule. The memory circuit outputs at least first bit and at least second bit of each code, respectively, according to a first and a second data items. An operational circuit performs logic operations on the first and second bits, and produces an operated result. A decision circuit decides whether the input data satisfies the scanning rule according to the operated result.

Abstract: Various embodiments provide for a heat assisted magnetic recording (HAMR) media comprising: a magnetic recording layer; a barrier layer disposed under the magnetic recording layer; a first underlayer disposed under the barrier layer; and an amorphous seedlayer disposed under the first underlayer. For some embodiments, the recording medium may comprise: a magnetic recording layer including FePt alloy, a CoPt alloy, or a FePd alloy; a barrier layer including MgO, TiC, TiN, CrN, TiCN, ?-WC, TaC, HfC, ZrC, VC, NbC, or NiO; a first underlayer including RuAl-oxide, NiAl, FeAl, AlMn, CuBe, or AlRe; or an amorphous seedlayer including a Cr—X alloy, where X comprises Al, B, C, Cu, Hf, Ho, Mn, Mo, Ni, Ta, Ti, V, W, or Ru.

Abstract: A composite hard magnetic recording layer for a magnetic storage comprises a hard magnetic layer and a capping layer. The composite recording layer has a crystal structure where crystal grains include a portion within the magnetic layer and a portion within the capping layer.

Abstract: A method for machining a hole in a metallic member includes the following steps: providing a metallic member and a machining equipment, the metallic member includes a machining portion, and the machining equipment includes a first support member, a second support member, a cutter, and a fixing member; placing the first and second support members on two sides of the metallic member covering the machining portion, and then placing the metallic member and the first and second support members on the fixing member; machining at least one through hole in the machining portion and the first and second support members by the cutter; and removing the first and second support members machined to obtain the metallic member having the at least one through hole.

Abstract: An electronic device housing includes a bottom housing, a support frame, a display panel, and a side frame. The bottom housing includes a base plate and four sidewalls extending from a periphery of the base plate. The support frame is welded to the sidewalls of the bottom housing. The support frame is received in the bottom housing and made up of at least two support plates, two ends of each are welded to ends of the adjacent support plates. The support frame forms at least two welding lines at joints of the at least two support plates, and each welding line corresponds to a middle portion of one sidewall. The display panel is positioned on the support frame sandwiched between the support frame and the side frame. The side frame is connected to a top edge of the bottom housing.

Abstract: A packet forwarding mechanism using a packet map is disclosed. The method includes the packet map storing a packet forwarding information of each packet, where the packet map uses a single bit to indicate whether a packet is forwarding through a specific output port. In this way, the packet forwarding information can be stored in a very simple form such that less memory space is required for storing the packet forwarding information.

Abstract: A magnetic recording medium comprises a substrate; a heatsink layer comprising a layer of crystallized CuTi; and a hard magnetic recording layer. The crystallized CuTi is applied in an amorphous state and then crystallized through heating. The use of this heatsink improves surface and underlayer roughness compared to previous heatsink designs.

Abstract: A varnish includes an epoxy resin, a curing agent, an accelerator agent and fillers. The fillers include sericite powders. The sericite powders have composition of SiO2 in weight ratio of 55±3%. Furthermore, the Mohs' scale of hardness of the sericite powder is between 2 to 3. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better machined-work capability.

Abstract: An electronic device includes a bottom housing and a display panel. The bottom housing includes a bottom wall, a side wall, a support plate, and a plurality of reinforcement portions. The side wall extends from an edge of the bottom wall. The support plate extends toward a center of the bottom housing from a top end of the side wall, and defines an assembly groove. The side wall includes a plurality of side plates connecting with each other. The reinforcement portions are positioned at the corners of the bottom housing Each of the reinforcement portions is sandwiched between the bottom wall and the support plate, and connecting two adjacent side plates. A manufacturing method for an electronic device housing is also provided.

Abstract: An electronic device housing includes a bottom housing, a support frame, a display panel, and a side frame. The bottom housing includes a base plate and four sidewalls extending from a periphery of the base plate. The support frame is welded to the sidewalls of the bottom housing. The support frame is received in the bottom housing and made up of at least two support plates, two ends of each are welded to ends of the adjacent support plates. The support frame forms at least two welding lines at joints of the at least two support plates, and each welding line corresponds to a middle portion of one sidewall. The display panel is positioned on the support frame sandwiched between the support frame and the side frame. The side frame is connected to a top edge of the bottom housing.

Abstract: A thermal module includes a heat sink and a cooling fan. The heat sink has a main body, from an outer periphery thereof a plurality of radiating fins and at least one fixing section are outward extended. The fixing section is provided on one lateral side with at least one first mating part. The cooling fan has a housing having a blade hub arranged therein. The housing is provided on one side facing toward the heat sink with at least one second mating part and an axially raised wall portion. The raised wall portion is pressed against the heat sink to thereby define a space between the cooling fan and the heat sink. The cooling fan and the heat sink can be quickly assembled together through engagement of the first and the second mating part with one another to reduce the material and labor costs of the thermal module.