Patents by Inventor Huai-Pu Chu

Huai-Pu Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of coating a substrate with a rapidly solidified metal
    Patent number: 4552784
    Abstract: A method for coating a substrate with rapidly solidified metal which comprises spraying a mixture of rapidly solidified metal powder and small peening particles at high velocity against the substrate, said velocity being sufficient for the rapidly solidified metal powder and peening particles to impact the substrate and simultaneously bond the metal powder to the substrate. If the substrate is metallic, the method may provide the simultaneous mechanical working of the substrate surface.
    Type: Grant
    Filed: March 19, 1984
    Date of Patent: November 12, 1985
    Assignee: The United States of America as represented by the United States National Aeronautics and Space Administration
    Inventors: Huai-Pu Chu, Charles L. Staugaitis