Patents by Inventor Hualin Li
Hualin Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12004021Abstract: A communications method includes receiving, by a session management network element, a message for requesting to establish or modify a session, and determining, by the session management network element based on an access technology type corresponding to the session, whether to send a request message to an access management network element in the first communications network, where the request message requests the access management network element to allocate a connection identifier of a connection of the session in a second communications network.Type: GrantFiled: January 26, 2021Date of Patent: June 4, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Huan Li, Hualin Zhu, Guowei Ouyang
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Patent number: 11999919Abstract: The present invention relates to a nitrogen-containing diesel solidification point depressant composition, and preparation and application thereof. The nitrogen-containing diesel solidification point depressant composition includes the following components in percentage by weight: 10-40% of monoisopropanolamine; 10-40% of cyclohexane; 0-20% of polyethylene glycol; and 40-60% of N-tetradecyl methacrylamide-tetradecyl methacrylate. After the prepared diesel solidification point depressant composition is added to commercially available 0 #diesel, a solidification point and a cold filter plugging point of the diesel are respectively depressed by 21-25° C. and 9-13° C.Type: GrantFiled: May 27, 2021Date of Patent: June 4, 2024Assignee: SHANGHAI INSTITUTE OF TECHNOLOGYInventors: Sheng Han, Hualin Lin, Suya Yin, Xin Li, Mingxia Yuan, Maiying Xie, Fengfei Chen, Taishun Yang
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Publication number: 20240155705Abstract: An access network device obtains first information, where the access network device supports a 3rd generation partnership project 3GPP access technology; the access network device establishes a user plane connection to a first terminal device based on the first information; and the access network device obtains user plane data of the first terminal device via the user plane connection, and sends the user plane data to a first fixed network gateway device.Type: ApplicationFiled: January 17, 2024Publication date: May 9, 2024Inventors: Yishan Xu, Shiyong Tan, Hualin Zhu, Chuan Ma, He Li
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Patent number: 11952540Abstract: A method and apparatus for hydrocracking mineralized refuse pyrolysis oil. The method may use the following steps: (a) crushing and pyrolyzing mineralized refuse to obtain arene and alkane precursor biomass oil; (b) hydrogenating the arene and alkane precursor biomass oil obtained in step (a), and separating the obtained hydrocrackate to obtain arene and alkane; and (c) purifying, recovering and optimizing the arene and alkane obtained in step (b), and performing deep processing to produce naphtha, jet fuel, light diesel oil, and heavy diesel oil.Type: GrantFiled: June 16, 2020Date of Patent: April 9, 2024Assignee: East China University of Science and TechnologyInventors: Yulong Chang, Hualin Wang, Xia Jiang, Jianping Li, Jingyi Zhu, Pengbo Fu, Wei Yuan
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Patent number: 11930393Abstract: Embodiments of this application provide a session management method to provide quality of service (QoS) assurance for a service of a terminal. The method includes: determining, by a first control plane network element in a second network, to manage a session, where the session is used to provide a connection in the first network for a terminal, and the first control plane network element is a network element in the first network; and managing, by the first control plane network element, the session.Type: GrantFiled: July 15, 2021Date of Patent: March 12, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Hualin Zhu, Huan Li, Weisheng Jin
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Publication number: 20240081026Abstract: Embodiments of this application provide a terminal device, including a middle frame, a heat source device, a first heat dissipation assembly, and a second heat dissipation assembly, where the first heat dissipation assembly is disposed on one side of the middle frame, the heat source device and the second heat dissipation assembly are disposed on the other side of the middle frame, and at least one of the first heat dissipation assembly and the second heat dissipation assembly is a graphene heat dissipation assembly.Type: ApplicationFiled: November 9, 2023Publication date: March 7, 2024Inventors: Yongwang Xiao, Linfang Jin, Hualin Li, Naixiang Xu, Guoping Wang
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Publication number: 20210392782Abstract: Embodiments of this application provide a terminal device, including a middle frame, a heat source device, a first heat dissipation assembly, and a second heat dissipation assembly. The first heat dissipation assembly is disposed on one side of the middle frame, the heat source device and the second heat dissipation assembly are disposed on the other side of the middle frame, and at least one of the first heat dissipation assembly and the second heat dissipation assembly is a graphene heat dissipation assembly.Type: ApplicationFiled: September 25, 2019Publication date: December 16, 2021Inventors: Yongwang Xiao, Linfang Jin, Hualin Li, Naixiang Xu, Guoping Wang
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Patent number: 10756000Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: GrantFiled: November 14, 2019Date of Patent: August 25, 2020Assignee: Huawei Device Co., Ltd.Inventors: Linfang Jin, Yongwang Xiao, Guoping Wang, Jie Zou, Hualin Li
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Publication number: 20200083144Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: ApplicationFiled: November 14, 2019Publication date: March 12, 2020Inventors: Linfang JIN, Yongwang XIAO, Guoping WANG, Jie Zou, Hualin LI
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Patent number: 10497641Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: GrantFiled: September 24, 2018Date of Patent: December 3, 2019Assignee: HUAWEI DEVICE CO., LTD.Inventors: Linfang Jin, Yongwang Xiao, Guoping Wang, Jie Zou, Hualin Li
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Patent number: 10481654Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder, and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.Type: GrantFiled: January 23, 2018Date of Patent: November 19, 2019Assignee: Huawei Device Co., Ltd.Inventors: Xiangyang Yang, Linfang Jin, Hualin Li, Wenbing Tang, Jie Zou
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Publication number: 20190027423Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: ApplicationFiled: September 24, 2018Publication date: January 24, 2019Inventors: Linfang JIN, Yongwang XIAO, Guopin WANG, Jie ZOU, Hualin LI
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Patent number: 10103087Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: GrantFiled: March 18, 2014Date of Patent: October 16, 2018Assignee: HUAWEI DEVICE (DONGGUAN) CO., LTD.Inventors: Linfang Jin, Yongwang Xiao, Guoping Wang, Jie Zou, Hualin Li
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Publication number: 20180150115Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder, and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.Type: ApplicationFiled: January 23, 2018Publication date: May 31, 2018Inventors: Xiangyang YANG, Linfang JIN, Hualin LI, Wenbing TANG, Jie ZOU
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Patent number: 9910468Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.Type: GrantFiled: March 21, 2014Date of Patent: March 6, 2018Assignee: HUAWEI DEVICE (DONGGUAN) CO., LTD.Inventors: Xiangyang Yang, Linfang Jin, Hualin Li, Wenbing Tang, Jie Zou
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Patent number: 9768096Abstract: A mobile terminal is provided. The mobile terminal includes a circuit board, where a chip is disposed on a first surface of the circuit board. A groove is provided on a second surface of the circuit board. The mobile terminal further includes: a heat pipe that is disposed in the groove. One end of the heat pipe extends to a side wall of the circuit board or outside a side wall of the circuit board.Type: GrantFiled: March 20, 2014Date of Patent: September 19, 2017Assignee: Huawei Device Co., Ltd.Inventors: Longping Yan, Konggang Wei, Hualin Li
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Publication number: 20170139452Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.Type: ApplicationFiled: March 21, 2014Publication date: May 18, 2017Applicant: HUAWEI DEVICE CO., LTD.Inventors: Xiangyang YANG, Linfang JIN, Hualin LI, Wenbing TANG, Jie ZOU
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Publication number: 20170098592Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.Type: ApplicationFiled: March 18, 2014Publication date: April 6, 2017Applicant: HUAWEI DEVICE CO., LTD.Inventors: Linfang JIN, Yongwang XIAO, Guoping WANG, Jie ZOU, Hualin LI
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Publication number: 20170077010Abstract: A mobile terminal is provided. The mobile terminal includes a circuit board, where a chip is disposed on a first surface of the circuit board. A groove is provided on a second surface of the circuit board. The mobile terminal further includes: a heat pipe that is disposed in the groove. One end of the heat pipe extends to a side wall of the circuit board or outside a side wall of the circuit board.Type: ApplicationFiled: March 20, 2014Publication date: March 16, 2017Applicant: HUAWEI DEVICE CO., LTD.Inventors: Longping YAN, Konggang WEI, Hualin LI
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Patent number: 9363884Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.Type: GrantFiled: November 5, 2013Date of Patent: June 7, 2016Assignee: Huawei Device Co., Ltd.Inventors: Jun Yang, Liechun Zhou, Hualin Li, Xijie Wu