Patents by Inventor Huan-Chun Wang

Huan-Chun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240083555
    Abstract: A waste collection apparatus for collecting waste in water is provided. The waste collection apparatus includes a floating device and a waste collection device coupled to the floating device. The waste collection device includes a fluid ejection element, and the flow out of the fluid ejection element flows toward a space where waste is collected.
    Type: Application
    Filed: May 12, 2023
    Publication date: March 14, 2024
    Inventors: Wei-Chun LIU, Ching-Fu WANG, Cheng-Che HO, Huan-Fu LIN
  • Publication number: 20240079409
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a first fin structure. The semiconductor device structure includes a first source/drain structure over the first fin structure. The semiconductor device structure includes a first dielectric layer over the first source/drain structure and the substrate. The semiconductor device structure includes a first conductive contact structure in the first dielectric layer and over the first source/drain structure. The semiconductor device structure includes a second dielectric layer over the first dielectric layer and the first conductive contact structure. The semiconductor device structure includes a first conductive via structure passing through the second dielectric layer and connected to the first conductive contact structure. A first width direction of the first conductive contact structure is substantially parallel to a second width direction of the first conductive via structure.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jyun-De WU, Te-Chih HSIUNG, Yi-Chun CHANG, Yi-Chen WANG, Yuan-Tien TU, Peng WANG, Huan-Just LIN
  • Patent number: 11916131
    Abstract: According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: De-Fang Chen, Teng-Chun Tsai, Cheng-Tung Lin, Li-Ting Wang, Chun-Hung Lee, Ming-Ching Chang, Huan-Just Lin
  • Publication number: 20190165811
    Abstract: An LDPC decoder determines j number of variable nodes related to a first check node based on a parity check matrix. The LDPC decoder calculates j number of node LLR values corresponding to the j number of variable nodes, and determines j number of initial CN-VN LLR values of the j number of variable nodes. The LDPC decoder calculates j number of VN-CN LLR values according to the j number of node LLR values and the j number of initial CN-VN LLR values, and calculates j number of updated CN-VN LLR values of the j number of variable nodes. The LDPC decoder calculates j number of updated node LLR values according to the j number of updated CN-VN LLR values and j number of VN-CN LLR values, and updates the j number of node LLR values of the j number of variable nodes by the updated node LLR values.
    Type: Application
    Filed: December 3, 2017
    Publication date: May 30, 2019
    Inventors: Huan-Chun WANG, Jih-Wei LEE, Ming-Ju WU
  • Patent number: 8351525
    Abstract: An orthogonal frequency division multiplexing (OFDM) receiving apparatus, including a receiving unit, a subcarrier demodulation unit and a signal output processing unit, is provided. The receiving unit is for receiving an RF signal to generate a set of discrete signals. The subcarrier demodulation unit is coupled to the receiving unit, and used for demodulating a set of discrete signals to obtain a complex signal. The signal output processing unit is coupled to the subcarrier demodulation unit, and used for capturing and outputting real parts of the complex signal.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: January 8, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Huan-Chun Wang, De-Jhen Huang, Chang-Lan Tsai
  • Patent number: 8175180
    Abstract: A pre-encoding apparatus and a pre-decoding apparatus are provided. The pre-encoding apparatus adopts a cascade structure constituted by a plurality of pre-encoding units and a plurality of interleavers for pre-encoding, and the pre-decoding apparatus adopts a cascade structure constituted by a plurality of pre-decoding units and a plurality of de-interleavers for pre-decoding. Therefore, the pre-decoding apparatus is featured with a lower error rate. Also, each of the pre-decoding units can be alternatively composed of a plurality of low dimensional pre-decoders so that a computation complexity of the pre-decoding apparatus can be reduced accordingly.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: May 8, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Huan-Chun Wang, De-Jhen Huang
  • Publication number: 20110038250
    Abstract: An orthogonal frequency division multiplexing (OFDM) receiving apparatus, including a receiving unit, a subcarrier demodulation unit and a signal output processing unit, is provided. The receiving unit is for receiving an RF signal to generate a set of discrete signals. The subcarrier demodulation unit is coupled to the receiving unit, and used for demodulating a set of discrete signals to obtain a complex signal. The signal output processing unit is coupled to the subcarrier demodulation unit, and used for capturing and outputting real parts of the complex signal.
    Type: Application
    Filed: October 28, 2010
    Publication date: February 17, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Huan-Chun Wang, De-Jhen Huang, Chang-Lan Tsai
  • Patent number: 7852955
    Abstract: An orthogonal frequency division multiplexing (OFDM) transmitting apparatus including a signal processing unit, a subcarrier orthogonalization processing unit, and a transmitting unit is provided. The signal processing unit divides a received signal into several real parts and several corresponding imaginary parts. The subcarrier orthogonalization processing unit is coupled to the signal processing unit for receiving the real and the imaginary parts of the signal, and for making the real and the imaginary parts respectively carried by a plurality of different and orthogonal subcarriers. The transmitting unit is coupled to the subcarrier orthogonalization processing unit to transmit the subcarriers.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: December 14, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Huan-Chun Wang, De-Jhen Huang, Chang-Lan Tsai
  • Publication number: 20100246731
    Abstract: An apparatus for decoding a received plurality of multi-path signals to recover the data content of transmitted signals may include an integrated circuit. The integrated circuit may be configured to generate a logarithm likelihood ratio based on a received plurality of multi-path signals, where the received plurality of multi-path signals is representative of transmitted data content. The integrated circuit may be further configured to arrange coefficients of an expression generated based on the received plurality of multi-path signals and integrate the expression. The integrated circuit may be further configured to divide the integrated expression by prior information. As a result, the integrated circuit may be configured to receive the plurality of multi-path signals and decode the signals via integration. Associated methods and computer program products may also be provided.
    Type: Application
    Filed: March 24, 2009
    Publication date: September 30, 2010
    Inventors: Huan-Chun Wang, De-Jhen Huang
  • Publication number: 20090221236
    Abstract: A pre-encoding apparatus and a pre-decoding apparatus are provided. The pre-encoding apparatus adopts a cascade structure constituted by a plurality of pre-encoding units and a plurality of interleavers for pre-encoding, and the pre-decoding apparatus adopts a cascade structure constituted by a plurality of pre-decoding units and a plurality of de-interleavers for pre-decoding. Therefore, the pre-decoding apparatus is featured with a lower error rate. Also, each of the pre-decoding units can be alternatively composed of a plurality of low dimensional pre-decoders so that a computation complexity of the pre-decoding apparatus can be reduced accordingly.
    Type: Application
    Filed: August 7, 2008
    Publication date: September 3, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Huan-Chun Wang, De-Jhen Huang
  • Publication number: 20080298479
    Abstract: An orthogonal frequency division multiplexing (OFDM) transmitting apparatus including a signal processing unit, a subcarrier orthogonalization processing unit, and a transmitting unit is provided. The signal processing unit divides a received signal into several real parts and several corresponding imaginary parts. The subcarrier orthogonalization processing unit is coupled to the signal processing unit for receiving the real and the imaginary parts of the signal, and for making the real and the imaginary parts respectively carried by a plurality of different and orthogonal subcarriers. The transmitting unit is coupled to the subcarrier orthogonalization processing unit to transmit the subcarriers.
    Type: Application
    Filed: July 20, 2007
    Publication date: December 4, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Huan-Chun Wang, De-Jhen Huang, Chang-Lan Tsai