Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a first fin structure. The semiconductor device structure includes a first source/drain structure over the first fin structure. The semiconductor device structure includes a first dielectric layer over the first source/drain structure and the substrate. The semiconductor device structure includes a first conductive contact structure in the first dielectric layer and over the first source/drain structure. The semiconductor device structure includes a second dielectric layer over the first dielectric layer and the first conductive contact structure. The semiconductor device structure includes a first conductive via structure passing through the second dielectric layer and connected to the first conductive contact structure. A first width direction of the first conductive contact structure is substantially parallel to a second width direction of the first conductive via structure.

Abstract: A pressure buffering system includes a housing, a pump module, a pressure sensor and a pressure cylinder. The pump module, the pressure sensor and the pressure cylinder are disposed in the housing. The pressure cylinder is communicated between the pump module and the pressure sensor. A biological culture device is further provided.

Abstract: A detection apparatus configured for PCR testing includes a carrier structure and a temperature detection module. The carrier structure is configured to carry a test tube, and the test tube is configured for containing a reagent and a specimen. The temperature detection module is disposed on the carrier structure and includes a heat transfer medium and a temperature sensor. The heat capacity of the heat transfer medium is approximately equal to a preset value, so as to match heat capacity of the reagent. The temperature sensor is configured to sense a temperature of the heat transfer medium. In addition, a method for detecting a temperature of the detection apparatus is also provided.

Abstract: A heat dissipation module including a heat dissipation portion, a working fluid, and a buffer member is provided. The heat dissipation portion has a containing portion, the working fluid is contained in the containing portion, and the buffer member is connected to the containing portion. When the working fluid is heated, the buffer member is expanded to maintain a constant pressure within the containing portion.

Abstract: A pressure buffering system includes a housing, a pump module, a pressure sensor and a pressure cylinder. The pump module, the pressure sensor and the pressure cylinder are disposed in the housing. The pressure cylinder is communicated between the pump module and the pressure sensor. A biological culture device is further provided.

Abstract: An electronic device includes a first main body, a second main body, a pivoting mechanism, and a heat dissipation module. The second main body includes a first housing, a second housing, and a cover plate. The pivoting mechanism is pivotally connected between the first main body and the second main body. Two sides of the cover plate are pivotally connected to the second housing and the pivoting mechanism respectively. The heat dissipation module is disposed in the second main body and includes at least one elastic member. The elastic member is fixed between the first housing and the cover plate. In response to that the first main body is in unfolded position relative to the second main body through the pivoting mechanism, the pivoting mechanism drives the cover plate to be located between an open position relative to the second housing, so that the elastic member is stretched.

Abstract: An electronic device includes a first main body, a second main body, a pivoting mechanism, and a heat dissipation module. The second main body includes a first housing, a second housing, and a cover plate. The pivoting mechanism is pivotally connected between the first main body and the second main body. Two sides of the cover plate are pivotally connected to the second housing and the pivoting mechanism respectively. The heat dissipation module is disposed in the second main body and includes at least one elastic member. The elastic member is fixed between the first housing and the cover plate. In response to that the first main body is in unfolded position relative to the second main body through the pivoting mechanism, the pivoting mechanism drives the cover plate to be located between an open position relative to the second housing, so that the elastic member is stretched.

Abstract: A heat dissipation module including a heat dissipation portion, a working fluid, and a buffer member is provided. The heat dissipation portion has a containing portion, the working fluid is contained in the containing portion, and the buffer member is connected to the containing portion. When the working fluid is heated, the buffer member is expanded to maintain a constant pressure within the containing portion.