Patents by Inventor Huan Liao
Huan Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240184036Abstract: A display device including a display panel and a light source module is provided. The light source module includes a flexible light guide and a light emitting element. The flexible light guide has a light exiting portion and a light incident portion. The flexible light guide is bent so that the display panel is located between the light exiting portion and the light incident portion. The light incident portion has a light incident surface at a terminal. A thickness of the light incident portion is gradually increased toward the light incident surface. The light emitting element is disposed to face toward the light incident surface.Type: ApplicationFiled: November 10, 2023Publication date: June 6, 2024Applicant: E Ink Holdings Inc.Inventors: Kun-Hsien Lee, Ching-Huan Liao
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Publication number: 20240178362Abstract: An electrode plate manufacturing apparatus includes a first coating device configured to apply a first active material coating on a first side of a current collector; a perforating device configured to perforate the current collector from a second side of the current collector, the second side being opposite to the first side; and a second coating device configured to apply a second active material coating on the second side of the current collector, where the perforating device is located downstream of the first coating device along a travel path of the current collector, and the second coating device is located downstream of the perforating device along the travel path of the current collector.Type: ApplicationFiled: February 9, 2024Publication date: May 30, 2024Inventors: Diwu LI, Hongwu SHANG, Shisong LI, Huan CHE, Zhenguang TANG, Linchen LIAO
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Publication number: 20240166802Abstract: A manufacturing method of a polymer includes the following steps. Terephthalic acid, butanediol, adipic acid, and carboxybenzene are used as raw materials to perform an esterification reaction to obtain a reactant. A catalyst is added to the reactant, and a polymerization reaction is performed.Type: ApplicationFiled: December 22, 2022Publication date: May 23, 2024Applicant: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Jung-Jen Chuang, Tzu-Huan Wong
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Publication number: 20240158570Abstract: A manufacturing method of a polyester for a plastic wrap at least includes the following steps. An aromatic carboxylic acid, an aliphatic carboxylic acid, and an aliphatic alcohol are provided, wherein the aromatic carboxylic acid includes at least two of a phthalic acid, an isophthalic acid, and a terephthalic acid. The aromatic carboxylic acid, the aliphatic carboxylic acid and the aliphatic alcohol are subjected to at least an esterification reaction, a pre-polymerization reaction, and a polymerization reaction in sequence, so as to obtain a polybutylene adipate terephthalate.Type: ApplicationFiled: December 15, 2022Publication date: May 16, 2024Applicant: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Jung-Jen Chuang, Tzu-Huan Wong
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Publication number: 20240162406Abstract: A display panel including an array substrate, a light-emitting diode chip, a photosensitive material layer and a photosensitive material layer. The array substrate includes a first electrode pad and a second electrode pad adjacent to the first electrode pad. The light-emitting diode chip includes a first electrode and a second electrode at opposite sides of the light-emitting diode chip, and the first electrode is connected with the first electrode pad. The photosensitive material layer is over the array substrate and surrounds the light-emitting diode chip, in which the photosensitive material layer includes an opening exposing the second electrode pad, a sidewall of the opening has a first portion and a second portion, a slope of the first portion is greater than a slope of the second portion. The transparent conductive layer is over the photosensitive material layer and electrically connects the second electrode pad and the second electrode.Type: ApplicationFiled: October 4, 2023Publication date: May 16, 2024Inventors: Chieh-Ming CHEN, Chou-Huan Yu, Bo-ru Jian, Ta-Wen Liao
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Publication number: 20240160078Abstract: A light source device includes a light emitting element and a fluorescent portion. The light emitting element is configured to emit light. The fluorescent portion is disposed on the light emitting element. The fluorescent portion is configured to transform the light into illumination light. In the spectrum of the illuminating light, the energy in red band is in a range from 25% to 45% of the energy in full band.Type: ApplicationFiled: July 20, 2023Publication date: May 16, 2024Inventors: Yi-Yu TSAI, Ching-Huan LIAO
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Publication number: 20240134107Abstract: A light source device includes a light guide plate, an optical adhesive, and a light source element. The light guide plate includes a light guide substrate and an enhancement layer. The light guide substrate has a light incident surface, a first surface, and a second surface. The first surface is opposite to the second surface, and the light incident surface extends between the first surface and the second surface. The enhancement layer is disposed on the light guide substrate. A thickness of the enhancement layer is from 1 micrometer to 25 micrometers and a first refractive index of the light guide substrate is greater than a second refractive index of the enhancement layer. The optical adhesive is interposed between the first surface of the light guide substrate and the optical adhesive. The light source element is disposed beside the light incident surface to emit light toward the light incident surface.Type: ApplicationFiled: June 26, 2023Publication date: April 25, 2024Applicant: E Ink Holdings Inc.Inventors: Hsin-Tao Huang, Yu-Chuan Wen, Jen-Pin Yu, Ching-Huan Liao, Ya-Chin Chang
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Publication number: 20240126001Abstract: A switchable backlight module is disclosed. The switchable backlight module includes two light source modules arranged parallelly with respect to a plane. Each of the light source modules includes a turning film and a LGP. The LGP is of an edge-lit type arranged parallelly under the turning film. A light ray enters the LGP from a light incident side of the LGP, exits the LGP from a light emergent surface of the LGP, enters the turning film, and exits the turning film from a surface of the turning film away from the LGP. The light incident side of the LGP of one of the light source modules is perpendicular to the light incident side of the LGP of the other light source module. The switchable backlight module is in an anti-peeping mode having a narrow viewing angle when only an upper one of the light source modules emits light.Type: ApplicationFiled: July 19, 2023Publication date: April 18, 2024Inventors: YU-HUAN CHIU, CHIEN-WEI LIAO, YEN-LUNG CHEN
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Publication number: 20240113430Abstract: The disclosed system may include a conductive enclosure, a first printed circuit board (PCB) that includes multiple antenna feeds, and a second PCB that includes a grounding layer and one or more sensors. A first antenna feed may be electrically connected to the conductive enclosure, and a second antenna feed may be electrically connected to the grounding layer of the second PCB. As such, the grounding layer of the second PCB may act as a radiating element for a second antenna. Various other mobile electronic devices, apparatuses, and methods of manufacturing are also disclosed.Type: ApplicationFiled: November 7, 2022Publication date: April 4, 2024Inventors: Zhong Ji, Yonghua Wei, Md Rashidul Islam, Huan Liao, Geng Ye, Bruno Cendon Martin
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Publication number: 20240113420Abstract: The disclosed system may include a detachable capsule that includes a capsule-side capacitive plate. The system may also include a receiving antenna electrically connected to an antenna-side capacitive plate, and a capacitive sensor electrically connected to the capsule-side capacitive plate. The two plates may be coupled to each other and may transmit RF signals between them. The capacitive sensor may be configured to detect an amount of capacitance between the two capacitive plates. The system may also include an antenna matching tuner electrically connected to the capacitive sensor and to an antenna feed. Then, upon receiving capacitance measurements from the capacitive sensor, the antenna matching tuner may alter various parameters of the antenna feed including impedance matching parameters. Various other apparatuses and mobile wearable devices are also disclosed.Type: ApplicationFiled: September 29, 2022Publication date: April 4, 2024Inventors: Wenjing Su, Md Rashidul Islam, Juan Manuel Martinez, Jiang Zhu, Huan Liao, Yonghua Wei, Geng Ye, Bruno Cendon Martin
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Publication number: 20240075158Abstract: Provided are a complex of an anti-IL-4R antibody or an antigen-binding fragment thereof, and a medical use thereof. Specifically, provided are a complex of an antibody that specifically binds to IL-4R or an antigen-binding fragment thereof covalently linked to a toxin, a pharmaceutical composition comprising the complex, and a use thereof in the preparation of a drug for treating IL-4R-mediated diseases or disorders, especially a use in the preparation of an anti-cancer drug.Type: ApplicationFiled: December 22, 2021Publication date: March 7, 2024Inventors: Huan WANG, Yuan LIN, Yucheng TANG, Ke KE, Kan LIN, Cheng LIAO
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Publication number: 20240071847Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Inventors: Yi-Huan Liao, Ping-Yin Hsieh, Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Ying-Ching Shih
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Publication number: 20240065012Abstract: A photosensitive device including a microlens substrate, a photosensitive element substrate, and an optical glue is provided. The microlens substrate includes a first substrate and microlenses. The first substrate has a first side and a second side opposite to the first side. The microlenses are located on the first side of the first substrate. The photosensitive element substrate includes a second substrate, active components, first electrodes, a second electrode, and an organic photosensitive material layer. The second substrate has a third side and a fourth side opposite to the third side. The second side of the first substrate faces the third side of the second substrate. The active components are located on the fourth side of the second substrate. The first electrodes are respectively electrically connected to the active components. The organic photosensitive material layer is located between the first electrodes and the second electrode.Type: ApplicationFiled: October 30, 2023Publication date: February 22, 2024Applicant: AUO CorporationInventors: Yi-Huan Liao, Chun Chang, Hsin-Hsuan Lee
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Publication number: 20240038623Abstract: In an embodiment, a device includes a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component. The device also includes a back-side metal layer on a back-side of the package component. The device also includes an indium thermal interface material on a back-side of the back-side metal layer. The device also includes a lid on a back-side of the indium thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.Type: ApplicationFiled: July 28, 2022Publication date: February 1, 2024Inventors: Ping-Yin Hsieh, Chih-Hao Chen, Yi-Huan Liao, Pu Wang, Li-Hui Cheng
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Patent number: 11886091Abstract: A front light module including a light guide plate, a light source, an optical film, and a first optical clear adhesive is provided. The light guide plate has a top surface, a bottom surface opposite to the top surface, and a light input surface connecting the top surface with the bottom surface. The light source is disposed beside the light input surface. An optical surface of the optical film facing away from the light guide plate has a plurality of optical microstructures. Each of the optical microstructures is a recess, and has a light receiving surface more adjacent to the light input surface and a light back surface further away from the light input surface. The optical clear adhesive is disposed between the light guide plate and the optical film in a fully bonding manner. An electrophoretic display is also provided.Type: GrantFiled: September 5, 2022Date of Patent: January 30, 2024Assignee: E Ink Holdings Inc.Inventors: Sheng-Chieh Tai, Ching-Huan Liao
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Patent number: 11832462Abstract: A photosensitive device including a microlens substrate, a photosensitive element substrate, and an optical glue is provided. The microlens substrate includes a first substrate and microlenses. The first substrate has a first side and a second side opposite to the first side. The microlenses are located on the first side of the first substrate. The photosensitive element substrate includes a second substrate, active components, first electrodes, a second electrode, and an organic photosensitive material layer. The second substrate has a third side and a fourth side opposite to the third side. The second side of the first substrate faces the third side of the second substrate. The active components are located on the fourth side of the second substrate. The first electrodes are respectively electrically connected to the active components. The organic photosensitive material layer is located between the first electrodes and the second electrode.Type: GrantFiled: June 18, 2021Date of Patent: November 28, 2023Assignee: Au Optronics CorporationInventors: Yi-Huan Liao, Chun Chang, Hsin-Hsuan Lee
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Publication number: 20230307094Abstract: A method for predicting cancer prognosis is disclosed, and the method comprises capturing a reference radiomics and obtaining reference pathological eigenvalues, wherein the reference pathological eigenvalues are based on pathological features of a reference patients, and the pathological features comprise genomic features, gene expression, test values or a combination of two or more thereof. Then, capturing a test radiomics and obtaining test pathological eigenvalues are performed, wherein the test pathological eigenvalues are based on pathological features of a test patients, and the pathological features comprise genomic features, gene expression, test values or a combination of two or more thereof. A mathematical formula is used to calculate a prognostic index based on the aforementioned reference radiomics, reference pathological eigenvalues, test radiomics and test pathological eigenvalues, and the prognostic change risk of the test patient is evaluated according to the prognostic index.Type: ApplicationFiled: May 4, 2022Publication date: September 28, 2023Inventors: Chung-I LI, Meng-Ru SHEN, Yi-Shan TSAI, Peng-Chan LIN, Pei-Fang SU, Yi-Huan LIAO, Yu-Husan LAI
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Patent number: 11733581Abstract: A light source device is used to generate illumination light and includes a plurality of light emitting components, at least one first fluorescent part, and at least one second fluorescent part. Each light emitting component is used to emit light. The first fluorescent part is disposed on at least one of the light emitting components and able to convert the light to first white light having a first color temperature. The second fluorescent part is disposed on at least one of the other light emitting components and able to convert the light to second white light having a second color temperature. The illumination light includes the first white light and the second white light, where the maximum difference between the first color temperature and the second color temperature is greater than or equal to 2000K.Type: GrantFiled: August 26, 2021Date of Patent: August 22, 2023Assignee: E Ink Holdings Inc.Inventors: Ching-Huan Liao, Yi-Yu Tsai
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Publication number: 20230205039Abstract: A front light module including a light guide plate, a light source, an optical film, and a first optical clear adhesive is provided. The light guide plate has a top surface, a bottom surface opposite to the top surface, and a light input surface connecting the top surface with the bottom surface. The light source is disposed beside the light input surface. An optical surface of the optical film facing away from the light guide plate has a plurality of optical microstructures. Each of the optical microstructures is a recess, and has a light receiving surface more adjacent to the light input surface and a light back surface further away from the light input surface. The optical clear adhesive is disposed between the light guide plate and the optical film in a fully bonding manner. An eletrophoretic display is also provided.Type: ApplicationFiled: September 5, 2022Publication date: June 29, 2023Applicant: E Ink Holdings Inc.Inventors: Sheng-Chieh Tai, Ching-Huan Liao
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Patent number: 11688927Abstract: According to an aspect, a display device includes a display module including a display panel and a conductive layer, and an enclosure configured to surround the display module, where the enclosure includes a conductive portion. The display device includes an antenna having a structure formed by an air gap disposed between the conductive layer and the conductive portion of the enclosure. The antenna includes an antenna feed located within the air gap. The antenna feed is coupled to the conductive portion of the enclosure and to the conductive layer such that at least a portion of the display module is configured as a radiating element for wireless communication.Type: GrantFiled: July 23, 2020Date of Patent: June 27, 2023Assignee: Google LLCInventors: Sung Oh, Uei-ming Jow, Huan Liao